Yonghuan Guo
- Electrical and Electronic Engineering top 5%
- Mechanical Engineering top 5%
- Aerospace Engineering
- Mechanics of Materials
- Industrial and Manufacturing Engineering top 10%
- Co-authors
- Chengwen HeLiang ZhangJiguang HanLei SunXiao LuYong‐Wei ZhangSinn-wen ChenWenyi Liu
- Topics
- Electronic Packaging and Soldering Technologies (31 papers)3D IC and TSV technologies (20 papers)Aluminum Alloys Composites Properties (17 papers)
- Journals
- Materials Science and Engineering AJournal of Alloys and CompoundsIEEE Transactions on Electron Devices
- Partner nations
- ChinaUnited StatesItaly
In The Last Decade
Yonghuan Guo
62 papers receiving 940 citations
Peers
Comparison fields: 5 of 62
- Electrical and Electronic Engineering 796
- Mechanical Engineering 663
- Aerospace Engineering 74
- Mechanics of Materials 65
- Industrial and Manufacturing Engineering 56
Countries citing papers authored by Yonghuan Guo
This map shows the geographic impact of Yonghuan Guo's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yonghuan Guo with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yonghuan Guo more than expected).
Fields of papers citing papers by Yonghuan Guo
This network shows the impact of papers produced by Yonghuan Guo. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yonghuan Guo. The network helps show where Yonghuan Guo may publish in the future.
Co-authorship network of co-authors of Yonghuan Guo
This figure shows the co-authorship network connecting the top 25 collaborators of Yonghuan Guo. A scholar is included among the top collaborators of Yonghuan Guo based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yonghuan Guo. Yonghuan Guo is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 4 | |
| 2 | 1 | |
| 3 | 10 | |
| 4 | 20 | |
| 5 | 4 | |
| 6 | 1 | |
| 7 | 26 | |
| 8 | 1 | |
| 9 | 0 | |
| 10 | 21 | |
| 11 | 30 | |
| 12 | 2 | |
| 13 | 4 | |
| 14 | 4 | |
| 15 | 10 | |
| 16 | 3 | |
| 17 | 7 | |
| 18 | Injection mould design of half of complex sleeve for connection | 0 |
| 19 | Influence of ceria on phosphorus and sulphur of low alloy steel weld | 1 |
| 20 | 1 |
About Yonghuan Guo
Yonghuan Guo is a scholar working on Mechanical Engineering, Industrial and Manufacturing Engineering and Automotive Engineering, having authored 65 papers that have together received 959 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (20 papers) and Aluminum Alloys Composites Properties (17 papers). The work is most often cited by research in Mechanical Engineering (663 citations), Electrical and Electronic Engineering (796 citations) and General Materials Science (39 citations). Yonghuan Guo has collaborated with scholars based in China, United States and Italy. Frequent co-authors include Chengwen He, Liang Zhang, Jiguang Han, Liang Zhang, Lei Sun, Xiao Lu, Yong‐Wei Zhang, Sinn-wen Chen, Wenyi Liu and Zhi‐Quan Liu. Their work appears in journals such as Materials Science and Engineering A, Journal of Alloys and Compounds and IEEE Transactions on Electron Devices.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.