F. Sarvar

549 total citations
24 papers, 433 citations indexed

About

F. Sarvar is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Automotive Engineering. According to data from OpenAlex, F. Sarvar has authored 24 papers receiving a total of 433 indexed citations (citations by other indexed papers that have themselves been cited), including 20 papers in Electrical and Electronic Engineering, 11 papers in Mechanical Engineering and 5 papers in Automotive Engineering. Recurrent topics in F. Sarvar's work include Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (7 papers) and Heat Transfer and Optimization (6 papers). F. Sarvar is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (7 papers) and Heat Transfer and Optimization (6 papers). F. Sarvar collaborates with scholars based in United Kingdom and Singapore. F. Sarvar's co-authors include Paul Conway, D.C. Whalley, N. J. Poole, David A. Hutt, Xiao Tan, Paul J. Palmer, David Williams, Amin Al‐Habaibeh, D.J. Williams and P.M. Anderson and has published in prestigious journals such as Journal of Materials Processing Technology, Journal of Electronic Materials and Finite Elements in Analysis and Design.

In The Last Decade

F. Sarvar

24 papers receiving 411 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
F. Sarvar United Kingdom	8	217	191	153	83	55	24	433
K.F. Graff United States	12	95 0.4×	116 0.6×	184 1.2×	144 1.7×	34 0.6×	20	358
Der Ho Wu Taiwan	10	157 0.7×	141 0.7×	168 1.1×	70 0.8×	40 0.7×	12	408
Fabien Amiot France	12	96 0.4×	112 0.6×	122 0.8×	157 1.9×	45 0.8×	30	445
Kenny C. Otiaba United Kingdom	9	141 0.6×	253 1.3×	189 1.2×	65 0.8×	34 0.6×	16	405
Andrew B. Geltmacher United States	9	204 0.9×	88 0.5×	173 1.1×	118 1.4×	30 0.5×	19	400
Jianbin Wang China	11	123 0.6×	150 0.8×	247 1.6×	57 0.7×	28 0.5×	26	406
George Jefferson United States	15	139 0.6×	136 0.7×	370 2.4×	200 2.4×	116 2.1×	21	645
Konstantin O. Papailiou Switzerland	11	249 1.1×	161 0.8×	95 0.6×	173 2.1×	73 1.3×	24	486
Vadim Gektin United States	9	72 0.3×	211 1.1×	230 1.5×	59 0.7×	22 0.4×	28	413
Richard L. Rhorer United States	11	123 0.6×	107 0.6×	252 1.6×	98 1.2×	32 0.6×	30	371

Countries citing papers authored by F. Sarvar

Since Specialization

Citations

This map shows the geographic impact of F. Sarvar's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by F. Sarvar with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites F. Sarvar more than expected).

Fields of papers citing papers by F. Sarvar

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by F. Sarvar. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by F. Sarvar. The network helps show where F. Sarvar may publish in the future.

Co-authorship network of co-authors of F. Sarvar

This figure shows the co-authorship network connecting the top 25 collaborators of F. Sarvar. A scholar is included among the top collaborators of F. Sarvar based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with F. Sarvar. F. Sarvar is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Sarvar, F., D.C. Whalley, & Paul Conway. (2006). Thermal Interface Materials - A Review of the State of the Art. Loughborough University Institutional Repository (Loughborough University). 1292–1302. 207 indexed citations

Hutt, David A., F. Sarvar, D.C. Whalley, et al.. (2006). Overmoulding of Electronics for End of Life Recovery. 133–133. 1 indexed citations

Hutt, David A., et al.. (2006). Modeling of the Power Cycling Performance of a Si on Si Flip Chip Assembly. Nottingham Trent University's Institutional Repository (Nottingham Trent Repository). 26. 243–250. 5 indexed citations

Tan, Xiao, Paul Conway, & F. Sarvar. (2005). Thermo-mechanical properties and regression models of alloys: AISI 305, CK 60, CuBe2 and Laiton MS 63. Journal of Materials Processing Technology. 168(1). 152–163. 10 indexed citations

Sarvar, F., et al.. (2004). Thermo-mechanical modelling of polymer encapsulated electronics. 465–472. 4 indexed citations

Sarvar, F., et al.. (2004). Design of a turbulence-enhanced deaggregation system for dry powder formulations. 3866–3869. 1 indexed citations

Sarvar, F., David A. Hutt, & D.C. Whalley. (2003). Application of adhesives in MEMS and MOEMS assembly: a review. 22–28. 33 indexed citations

Sarvar, F. & Paul Conway. (2002). Effective transient process modelling of the reflow soldering of printed circuit assemblies. 4 2. 195–202. 3 indexed citations

Sarvar, F., et al.. (2001). IGBT Package Design for High Power Aircraft Electronic Systems. Journal of Electronic Packaging. 123(4). 338–343. 7 indexed citations

10.

Sarvar, F.. (1999). Thermal design of high power semiconductor packages for aircraft electronic systems. 1999. 6–6. 2 indexed citations

11.

Sarvar, F. & D.C. Whalley. (1999). THERMAL DESIGN OF HIGH POWER SEMICONDUCTOR PACKAGES FOR AIRCRAFT SYSTEMS. Journal of Electronics Manufacturing. 9(4). 269–274. 6 indexed citations

12.

Sarvar, F. & Paul Conway. (1998). Effective modeling of the reflow soldering process: basis, construction, and operation of a process model. 21(2). 126–133. 34 indexed citations

13.

Sarvar, F. & Paul Conway. (1998). A modelling tool for the thermal optimisation of the reflow soldering of printed circuit assemblies. Finite Elements in Analysis and Design. 30(1-2). 47–63. 16 indexed citations

14.

Sarvar, F. & Paul Conway. (1998). Effective modeling of the reflow soldering process: use of a modeling tool for product and process design. 21(3). 165–171. 13 indexed citations

15.

Whalley, D.C., Paul Conway, F. Sarvar, & David Williams. (1995). Modelling of Solder Joint Geometry for Quality and Reliability. Soldering and Surface Mount Technology. 7(3). 10–12. 1 indexed citations

16.

Sarvar, F., et al.. (1994). Observed Phenomenology of the Interaction between Solder Paste and Soldering Processes. Soldering and Surface Mount Technology. 6(3). 8–11. 4 indexed citations

17.

Sarvar, F., et al.. (1993). Convection heat transfer from a hybrid circuit. Journal of Electronic Materials. 22(7). 751–754. 1 indexed citations

18.

Sarvar, F., et al.. (1993). Examination of natural convection plumes from partially heated PCB plates and estimation of the heat transfer coefficients. Journal of Electronic Materials. 22(5). 573–577. 6 indexed citations

19.

Sarvar, F., et al.. (1990). PCB glass-fibre laminates: Thermal conductivity measurements and their effect on simulation. Journal of Electronic Materials. 19(12). 1345–1350. 59 indexed citations

20.

Poole, N. J., et al.. (1988). Thermal modelling using ASTEC3 software. International Journal of Numerical Modelling Electronic Networks Devices and Fields. 1(2). 103–113. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact