Chung‐Yung Lin
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering
- Control and Systems Engineering top 10%
- Aerospace Engineering
- Automotive Engineering
- Co-authors
- Rong‐Jong WaiYee‐Wen YenChiapyng LeeY.-R. ChangPo‐Hsun ChenXingjun LiuTing‐Chang ChangChih‐Cheng Shih
- Topics
- Electronic Packaging and Soldering Technologies (11 papers)Intermetallics and Advanced Alloy Properties (8 papers)Advanced Welding Techniques Analysis (4 papers)
In The Last Decade
Chung‐Yung Lin
22 papers receiving 335 citations
Peers
Comparison fields: 5 of 33
- Electrical and Electronic Engineering 315
- Mechanical Engineering 150
- Control and Systems Engineering 72
- Aerospace Engineering 47
- Automotive Engineering 40
Countries citing papers authored by Chung‐Yung Lin
This map shows the geographic impact of Chung‐Yung Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chung‐Yung Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chung‐Yung Lin more than expected).
Fields of papers citing papers by Chung‐Yung Lin
This network shows the impact of papers produced by Chung‐Yung Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chung‐Yung Lin. The network helps show where Chung‐Yung Lin may publish in the future.
Co-authorship network of co-authors of Chung‐Yung Lin
This figure shows the co-authorship network connecting the top 25 collaborators of Chung‐Yung Lin. A scholar is included among the top collaborators of Chung‐Yung Lin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chung‐Yung Lin. Chung‐Yung Lin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 2 | |
| 3 | 3 | |
| 4 | 21 | |
| 5 | 1 | |
| 6 | 12 | |
| 7 | 5 | |
| 8 | 4 | |
| 9 | 1 | |
| 10 | 3 | |
| 11 | 1 | |
| 12 | 23 | |
| 13 | 18 | |
| 14 | 22 | |
| 15 | 38 | |
| 16 | 94 | |
| 17 | 11 | |
| 18 | 5 | |
| 19 | 35 | |
| 20 | 20 |
About Chung‐Yung Lin
Chung‐Yung Lin is a scholar working on General Materials Science, Mechanical Engineering and Electrical and Electronic Engineering, having authored 22 papers that have together received 347 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (11 papers), Intermetallics and Advanced Alloy Properties (8 papers) and Advanced Welding Techniques Analysis (4 papers). The work is most often cited by research in General Materials Science (34 citations), Electrical and Electronic Engineering (315 citations) and Mechanical Engineering (150 citations). Chung‐Yung Lin has collaborated with scholars based in Taiwan, Germany and China. Frequent co-authors include Rong‐Jong Wai, Yee‐Wen Yen, Chiapyng Lee, Y.-R. Chang, Po‐Hsun Chen, Xingjun Liu, Ting‐Chang Chang, Chih‐Cheng Shih, Pei‐Yu Chen and Rameez Asif. Their work appears in journals such as Journal of Hazardous Materials, Journal of Alloys and Compounds and Intermetallics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.