Seok‐Hwan Huh
- Electrical and Electronic Engineering top 5%
- Mechanical Engineering top 2%
- Aerospace Engineering top 5%
- Materials Chemistry
- Electronic, Optical and Magnetic Materials
- Co-authors
- Katsuaki SuganumaKeun‐Soo KimBon Heun KooKavita KumariYe‐Tang PanZeeshan Ur RehmanDavid G. ChurchillZakir Ullah
- Topics
- Electronic Packaging and Soldering Technologies (16 papers)Magnetic and transport properties of perovskites and related materials (11 papers)3D IC and TSV technologies (8 papers)
- Journals
- Journal of The Electrochemical SocietyCarbohydrate PolymersJournal of the American Ceramic Society
- Partner nations
- South KoreaIndiaSaudi Arabia
In The Last Decade
Seok‐Hwan Huh
44 papers receiving 1.4k citations
Hit Papers
Peers
Comparison fields: 5 of 48
- Electrical and Electronic Engineering 1.2k
- Mechanical Engineering 981
- Aerospace Engineering 281
- Materials Chemistry 165
- Electronic, Optical and Magnetic Materials 121
Countries citing papers authored by Seok‐Hwan Huh
This map shows the geographic impact of Seok‐Hwan Huh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Seok‐Hwan Huh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Seok‐Hwan Huh more than expected).
Fields of papers citing papers by Seok‐Hwan Huh
This network shows the impact of papers produced by Seok‐Hwan Huh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Seok‐Hwan Huh. The network helps show where Seok‐Hwan Huh may publish in the future.
Co-authorship network of co-authors of Seok‐Hwan Huh
This figure shows the co-authorship network connecting the top 25 collaborators of Seok‐Hwan Huh. A scholar is included among the top collaborators of Seok‐Hwan Huh based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Seok‐Hwan Huh. Seok‐Hwan Huh is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 0 | |
| 3 | 3 | |
| 4 | 7 | |
| 5 | 5 | |
| 6 | 3 | |
| 7 | 7 | |
| 8 | 7 | |
| 9 | 2 | |
| 10 | 55 | |
| 11 | 5 | |
| 12 | 1 | |
| 13 | 1 | |
| 14 | 25 | |
| 15 | 14 | |
| 16 | 1 | |
| 17 | 1 | |
| 18 | 1 | |
| 19 | 23 | |
| 20 | 78 |
About Seok‐Hwan Huh
Seok‐Hwan Huh is a scholar working on Electronic, Optical and Magnetic Materials, General Materials Science and Electrical and Electronic Engineering, having authored 49 papers that have together received 1.4k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (16 papers), Magnetic and transport properties of perovskites and related materials (11 papers) and 3D IC and TSV technologies (8 papers). The work is most often cited by research in Mechanical Engineering (981 citations), General Materials Science (76 citations) and Electrical and Electronic Engineering (1.2k citations). Seok‐Hwan Huh has collaborated with scholars based in South Korea, India and Saudi Arabia. Frequent co-authors include Katsuaki Suganuma, Keun‐Soo Kim, Bon Heun Koo, Kavita Kumari, Ye‐Tang Pan, Zeeshan Ur Rehman, David G. Churchill, Zakir Ullah, Shalendra Kumar and Ankush Vij. Their work appears in journals such as Journal of The Electrochemical Society, Carbohydrate Polymers and Journal of the American Ceramic Society.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.