Seok‐Hwan Huh
- Mechanical Engineering top 2%
- Advanced Welding Techniques Analysis 5
- Intermetallics and Advanced Alloy Properties 4
- General Materials Science top 1%
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- Electronic Packaging and Soldering Technologies 16
- 3D IC and TSV technologies 8
- Aerospace Engineering top 5%
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- Magnetic and transport properties of perovskites and related materials 11
- Magnetic Properties of Alloys 6
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- Magnetic properties of thin films 7
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- Magnetic Properties and Synthesis of Ferrites 5
- Co-authors
- Katsuaki SuganumaKeun‐Soo KimBon Heun KooKavita KumariYe‐Tang PanZeeshan Ur RehmanDavid G. ChurchillZakir Ullah
- Journals
- Journal of The Electrochemical Society (1 paper)Carbohydrate Polymers (1 paper)Journal of the American Ceramic Society (1 paper)
- Partner nations
- South KoreaIndiaSaudi Arabia
In The Last Decade
Seok‐Hwan Huh
44 papers receiving 1.4k citations
Hit Papers
Peers
Comparison fields: 5 of 48
- Mechanical Engineering 981
- General Materials Science 76
- Electrical and Electronic Engineering 1.2k
- Aerospace Engineering 281
- Electronic, Optical and Magnetic Materials 121
Countries citing papers authored by Seok‐Hwan Huh
This map shows the geographic impact of Seok‐Hwan Huh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Seok‐Hwan Huh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Seok‐Hwan Huh more than expected).
Fields of papers citing papers by Seok‐Hwan Huh
This network shows the impact of papers produced by Seok‐Hwan Huh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Seok‐Hwan Huh. The network helps show where Seok‐Hwan Huh may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Seok‐Hwan Huh, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 0 | |
| 2 | 2025 | 0 | |
| 3 | 2024 | 3 | |
| 4 | 2023 | 7 | |
| 5 | 2023 | 5 | |
| 6 | 2023 | 3 | |
| 7 | 2023 | 7 | |
| 8 | 2023 | 7 | |
| 9 | 2023 | 2 | |
| 10 | 2021 | 55 | |
| 11 | 2021 | 5 | |
| 12 | 2018 | 1 | |
| 13 | 2014 | 1 | |
| 14 | 2013 | 25 | |
| 15 | 2012 | 14 | |
| 16 | 2011 | 1 | |
| 17 | 2011 | 1 | |
| 18 | 2011 | 1 | |
| 19 | 2002 | 23 | |
| 20 | 2001 | 78 |
About Seok‐Hwan Huh
Seok‐Hwan Huh is a scholar working on Electronic, Optical and Magnetic Materials, General Materials Science and Electrical and Electronic Engineering, having authored 49 papers that have together received 1.4k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (16 papers), Magnetic and transport properties of perovskites and related materials (11 papers), 3D IC and TSV technologies (8 papers), Magnetic properties of thin films (7 papers), Magnetic Properties of Alloys (6 papers), Advanced Welding Techniques Analysis (5 papers), Magnetic Properties and Synthesis of Ferrites (5 papers) and Intermetallics and Advanced Alloy Properties (4 papers). The work is most often cited by research in Mechanical Engineering (981 citations), General Materials Science (76 citations) and Electrical and Electronic Engineering (1.2k citations). Seok‐Hwan Huh has collaborated with scholars based in South Korea, India and Saudi Arabia. Frequent co-authors include Katsuaki Suganuma, Keun‐Soo Kim, Bon Heun Koo, Kavita Kumari, Ye‐Tang Pan, Zeeshan Ur Rehman, David G. Churchill, Zakir Ullah, Shalendra Kumar and Ankush Vij. Their work appears in journals such as Journal of The Electrochemical Society, Carbohydrate Polymers and Journal of the American Ceramic Society.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.