Yao-Ching Ku

684 total citations
7 papers, 129 citations indexed

About

Yao-Ching Ku is a scholar working on Electrical and Electronic Engineering, Surfaces, Coatings and Films and Biomedical Engineering. According to data from OpenAlex, Yao-Ching Ku has authored 7 papers receiving a total of 129 indexed citations (citations by other indexed papers that have themselves been cited), including 6 papers in Electrical and Electronic Engineering, 2 papers in Surfaces, Coatings and Films and 2 papers in Biomedical Engineering. Recurrent topics in Yao-Ching Ku's work include Advancements in Photolithography Techniques (5 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers) and Advancements in Semiconductor Devices and Circuit Design (2 papers). Yao-Ching Ku is often cited by papers focused on Advancements in Photolithography Techniques (5 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers) and Advancements in Semiconductor Devices and Circuit Design (2 papers). Yao-Ching Ku collaborates with scholars based in Taiwan, Japan and United States. Yao-Ching Ku's co-authors include C.H. Diaz, Anthony Yen, K.K. Young, Matthew A. Thompson, J.D. Hayden, B. Taylor, Hiroyuki Takahashi, Hiroki Kawada, Wenge Yang and Kazuyoshi Nakamura and has published in prestigious journals such as IEEE Electron Device Letters and Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE.

In The Last Decade

Yao-Ching Ku

6 papers receiving 123 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Yao-Ching Ku Taiwan 3 119 26 16 15 9 7 129
Erin Mclellan United States 5 95 0.8× 54 2.1× 21 1.3× 46 3.1× 12 1.3× 8 126
P. Gouraud France 5 115 1.0× 63 2.4× 14 0.9× 22 1.5× 9 1.0× 25 148
A. Opdebeeck Belgium 4 119 1.0× 26 1.0× 8 0.5× 8 0.5× 8 0.9× 4 130
Arnaud Garnier France 7 102 0.9× 19 0.7× 3 0.2× 8 0.5× 12 1.3× 27 123
A.R. Papazian United States 5 97 0.8× 26 1.0× 9 0.6× 27 1.8× 2 0.2× 9 117
R. Schreutelkamp Belgium 10 257 2.2× 51 2.0× 10 0.6× 6 0.4× 7 0.8× 31 276
A. Balasiński United States 11 390 3.3× 18 0.7× 8 0.5× 7 0.5× 7 0.8× 62 411
S. Siddiqui United States 7 137 1.2× 38 1.5× 3 0.2× 5 0.3× 32 3.6× 18 151
V. Bavigadda Singapore 5 25 0.2× 10 0.4× 19 1.2× 6 0.4× 11 1.2× 13 82
C. Arvet France 10 223 1.9× 61 2.3× 6 0.4× 7 0.5× 24 2.7× 28 230

Countries citing papers authored by Yao-Ching Ku

Since Specialization
Citations

This map shows the geographic impact of Yao-Ching Ku's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yao-Ching Ku with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yao-Ching Ku more than expected).

Fields of papers citing papers by Yao-Ching Ku

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yao-Ching Ku. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yao-Ching Ku. The network helps show where Yao-Ching Ku may publish in the future.

Co-authorship network of co-authors of Yao-Ching Ku

This figure shows the co-authorship network connecting the top 25 collaborators of Yao-Ching Ku. A scholar is included among the top collaborators of Yao-Ching Ku based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yao-Ching Ku. Yao-Ching Ku is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

7 of 7 papers shown
1.
Ku, Yao-Ching, et al.. (2010). Photobase generator and photo decomposable quencher for high-resolution photoresist applications. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 7639. 76390W–76390W. 6 indexed citations
2.
Ku, Yao-Ching, Kazuyoshi Nakamura, Hiroyuki Takahashi, et al.. (2007). High-performance reticle inspection tool for the 65-nm node and beyond. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 6607. 660716–660716. 1 indexed citations
3.
Ku, Yao-Ching, et al.. (2007). Application of Sigma7500 pattern generator to X architecture and 45-nm generation mask making. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 6607. 660705–660705. 2 indexed citations
4.
Ku, Yao-Ching, et al.. (2004). Quantification of CD-SEM wafer global charging effect on CD and CD uniformity of 193-nm lithography. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 5375. 173–173.
5.
Lin, Chih‐Hsiang, et al.. (2004). 90-nm lithography process characterization using ODP scatterometry technology. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 5375. 597–597. 1 indexed citations
6.
Ku, Yao-Ching, et al.. (2002). Trench isolation for 0.45 μm active pitch and below. 679–682. 9 indexed citations
7.
Diaz, C.H., et al.. (2001). An experimentally validated analytical model for gate line-edge roughness (LER) effects on technology scaling. IEEE Electron Device Letters. 22(6). 287–289. 110 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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