Evgeny E. Glickman

657 citations

41 papers · 539 indexed · h-index 14

Co-authors: M. Nathan Alexandra Inberg Nick Fishelson Yosi Shacham‐Diamand Leonid Klinger В. А. Богуш A. Palevski M. Karpovski
Topics: Copper Interconnects and Reliability (31 papers)Electronic Packaging and Soldering Technologies (16 papers)Metal and Thin Film Mechanics (11 papers)
Cited by: Metals and Alloys Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering
Journals: Applied Physics Letters Journal of Applied Physics Acta Materialia
Partner nations: Israel United States Russia

In The Last Decade

Evgeny E. Glickman

41 papers receiving 509 citations

Peers

Countries citing papers authored by Evgeny E. Glickman

Since Specialization

Citations

This map shows the geographic impact of Evgeny E. Glickman's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Evgeny E. Glickman with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Evgeny E. Glickman more than expected).

Fields of papers citing papers by Evgeny E. Glickman

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Evgeny E. Glickman. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Evgeny E. Glickman. The network helps show where Evgeny E. Glickman may publish in the future.

Co-authorship network of co-authors of Evgeny E. Glickman

This figure shows the co-authorship network connecting the top 25 collaborators of Evgeny E. Glickman. A scholar is included among the top collaborators of Evgeny E. Glickman based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Evgeny E. Glickman. Evgeny E. Glickman is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Interaction of liquid and solid gallium with thin silver films: Synchronized spreading and penetration 2010 ·Acta Materialia ·Evgeny E. Glickman,(unknown),(unknown),Noam Eliaz	28
2	Dissolution Condensation Mechanism of Stress Corrosion Cracking in Liquid Metals: Driving Force and Crack Kinetics 2010 ·Metallurgical and Materials Transactions A ·Evgeny E. Glickman	32
3	Formation and characterization of low resistivity sub-100nm copper films deposited by electroless on SAM 2009 ·Electrochimica Acta ·(unknown),Alexandra Inberg,Evgeny E. Glickman,Nick Fishelson,Yosi Shacham‐Diamand	31
4	On the Role of Stress, Strain and Diffusion in Dissolution – Condensation Mechanism of Liquid Metal Embrittlement 2007 ·Defect and diffusion forum/Diffusion and defect data, solid state data. Part A, Defect and diffusion forum ·Evgeny E. Glickman	7
5	Electroless deposition and electrical resistivity of sub-100nm Cu films on SAMs: State of the art 2007 ·Microelectronic Engineering ·Evgeny E. Glickman,Alexandra Inberg,Nick Fishelson,(unknown)	37
6	Properties of 50nm electroless films Ag–W–oxygen before and after low temperature, low activation energy resistivity decay 2006 ·Microelectronic Engineering ·Evgeny E. Glickman,Alexandra Inberg,Galit Aviram,(unknown),N. Croitoru,Yosi Shacham‐Diamand	4
7	Fast penetration of Ga in Al: liquid metal embrittlement near the threshold of grain boundary wetting 2005 ·International Journal of Materials Research (formerly Zeitschrift fuer Metallkunde) ·Evgeny E. Glickman	2
8	Electrical resistivity of thin electroless Ag–W films for metallization 2003 ·Microelectronic Engineering ·Evgeny E. Glickman,В. А. Богуш,Alexandra Inberg,Yosi Shacham‐Diamand,N. Croitoru	18
9	Electromigration Kinetics in Thin Film Interconnects: Electro-Transport Coupled to Diffusional Creep 2001 ·Defect and diffusion forum/Diffusion and defect data, solid state data. Part A, Defect and diffusion forum ·Evgeny E. Glickman,M. Nathan	1
10	Creep-controlled electromigration in near-threshold interconnects 2000 ·Microelectronic Engineering ·Evgeny E. Glickman,M. Nathan	5
11	Grain Boundary Electromigration in Thin Films: Interface Reaction and Segregation Effects 1998 ·Defect and diffusion forum/Diffusion and defect data, solid state data. Part A, Defect and diffusion forum ·Evgeny E. Glickman	6
12	Grain Boundary Wetting in Metals: 'Self Indentation-Internal Solution' Mechanism 1998 ·Materials science forum ·Evgeny E. Glickman	2
13	On the unusual electromigration behavior of copper interconnects 1996 ·Journal of Applied Physics ·Evgeny E. Glickman,M. Nathan	58
14	On the effect of grain boundary segregation on electromigration driving force in thin metal films 1996 ·Materials Letters ·Evgeny E. Glickman,(unknown)	10
15	Electromigration in Metal Interconnects: Electrical- and Stress Field Induced Diffusion in Small Dimensions 1996 ·Defect and diffusion forum/Diffusion and defect data, solid state data. Part A, Defect and diffusion forum ·Evgeny E. Glickman	1
16	Effect of Surface and Grain-Boundary Diffusion on Interconnect Reliability 1995 ·MRS Proceedings ·Leonid Klinger,Evgeny E. Glickman,V. E. Fradkov,W. W. Mullins,C. Bauer	4
17	Grain Boundary Migration and Grain Growth Induced by Electromigration in Copper and Aluminum Lines 1995 ·MRS Proceedings ·A. Gladkikh,Evgeny E. Glickman,Mark G. Karpovsky,Y. Lereah,A. Palevski,(unknown)	4
18	On the Role of Surface Diffusion in Stress Relaxation During Electromigration 1995 ·MRS Proceedings ·Leonid Klinger,L. Levin,Evgeny E. Glickman	1
19	Time dependence of stress and hillock distributions during electromigration in thin metal film interconnections 1994 ·Materials Science and Engineering B ·Leonid Klinger,Evgeny E. Glickman,Alexander Katsman,L. Levin	21
20	Stress Relaxation and Electromigration Kinetics in Short Metal Lines: Transition to Creep Controlled Regime 1994 ·MRS Proceedings ·Evgeny E. Glickman,Leonid Klinger,Alexander Katsman,L. Levin	3

About Evgeny E. Glickman

Evgeny E. Glickman is a scholar working on Electronic, Optical and Magnetic Materials, Mechanics of Materials and Electrical and Electronic Engineering, having authored 41 papers that have together received 539 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (31 papers), Electronic Packaging and Soldering Technologies (16 papers) and Metal and Thin Film Mechanics (11 papers). The work is most often cited by research in Metals and Alloys (33 citations), Electronic, Optical and Magnetic Materials (235 citations) and Electrical and Electronic Engineering (279 citations). Evgeny E. Glickman has collaborated with scholars based in Israel, United States and Russia. Frequent co-authors include M. Nathan, Alexandra Inberg, Nick Fishelson, Yosi Shacham‐Diamand, Leonid Klinger, В. А. Богуш, A. Palevski, M. Karpovski, Y. Lereah and Noam Eliaz. Their work appears in journals such as Applied Physics Letters, Journal of Applied Physics and Acta Materialia.

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