Evgeny E. Glickman

657 total citations
41 papers, 539 citations indexed

About

Evgeny E. Glickman is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Materials Chemistry. According to data from OpenAlex, Evgeny E. Glickman has authored 41 papers receiving a total of 539 indexed citations (citations by other indexed papers that have themselves been cited), including 31 papers in Electronic, Optical and Magnetic Materials, 25 papers in Electrical and Electronic Engineering and 15 papers in Materials Chemistry. Recurrent topics in Evgeny E. Glickman's work include Copper Interconnects and Reliability (31 papers), Electronic Packaging and Soldering Technologies (16 papers) and Metal and Thin Film Mechanics (11 papers). Evgeny E. Glickman is often cited by papers focused on Copper Interconnects and Reliability (31 papers), Electronic Packaging and Soldering Technologies (16 papers) and Metal and Thin Film Mechanics (11 papers). Evgeny E. Glickman collaborates with scholars based in Israel, United States and Russia. Evgeny E. Glickman's co-authors include M. Nathan, Alexandra Inberg, Nick Fishelson, Yosi Shacham‐Diamand, Leonid Klinger, В. А. Богуш, A. Palevski, M. Karpovski, Y. Lereah and Noam Eliaz and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Acta Materialia.

In The Last Decade

Evgeny E. Glickman

41 papers receiving 509 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Evgeny E. Glickman Israel 14 279 235 183 122 93 41 539
P. Flaitz United States 12 333 1.2× 163 0.7× 273 1.5× 78 0.6× 85 0.9× 29 605
David M. Stewart United States 13 249 0.9× 145 0.6× 266 1.5× 152 1.2× 45 0.5× 36 584
Keiji Koterazawa Japan 15 151 0.5× 123 0.5× 336 1.8× 104 0.9× 242 2.6× 51 507
A. J. Griffin United States 14 144 0.5× 128 0.5× 433 2.4× 212 1.7× 278 3.0× 30 653
M.A. Kulakov Germany 15 272 1.0× 77 0.3× 286 1.6× 210 1.7× 123 1.3× 39 648
Tik Sun United States 10 369 1.3× 304 1.3× 196 1.1× 61 0.5× 117 1.3× 20 548
Shinn‐Tyan Wu Taiwan 13 251 0.9× 57 0.2× 274 1.5× 119 1.0× 110 1.2× 36 480
P. Ferguson Canada 17 696 2.5× 218 0.9× 246 1.3× 366 3.0× 94 1.0× 29 956
R. Bensalem Algeria 14 175 0.6× 156 0.7× 169 0.9× 220 1.8× 59 0.6× 35 504
Po-Kai Chiu Taiwan 11 157 0.6× 106 0.5× 202 1.1× 200 1.6× 73 0.8× 50 519

Countries citing papers authored by Evgeny E. Glickman

Since Specialization
Citations

This map shows the geographic impact of Evgeny E. Glickman's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Evgeny E. Glickman with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Evgeny E. Glickman more than expected).

Fields of papers citing papers by Evgeny E. Glickman

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Evgeny E. Glickman. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Evgeny E. Glickman. The network helps show where Evgeny E. Glickman may publish in the future.

Co-authorship network of co-authors of Evgeny E. Glickman

This figure shows the co-authorship network connecting the top 25 collaborators of Evgeny E. Glickman. A scholar is included among the top collaborators of Evgeny E. Glickman based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Evgeny E. Glickman. Evgeny E. Glickman is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Glickman, Evgeny E., et al.. (2010). Interaction of liquid and solid gallium with thin silver films: Synchronized spreading and penetration. Acta Materialia. 59(3). 914–926. 28 indexed citations
2.
Glickman, Evgeny E.. (2010). Dissolution Condensation Mechanism of Stress Corrosion Cracking in Liquid Metals: Driving Force and Crack Kinetics. Metallurgical and Materials Transactions A. 42(2). 250–266. 32 indexed citations
3.
Inberg, Alexandra, et al.. (2009). Formation and characterization of low resistivity sub-100nm copper films deposited by electroless on SAM. Electrochimica Acta. 54(25). 6053–6057. 31 indexed citations
4.
Glickman, Evgeny E.. (2007). On the Role of Stress, Strain and Diffusion in Dissolution – Condensation Mechanism of Liquid Metal Embrittlement. Defect and diffusion forum/Diffusion and defect data, solid state data. Part A, Defect and diffusion forum. 264. 141–149. 7 indexed citations
5.
Glickman, Evgeny E., et al.. (2007). Electroless deposition and electrical resistivity of sub-100nm Cu films on SAMs: State of the art. Microelectronic Engineering. 84(11). 2466–2470. 37 indexed citations
6.
Glickman, Evgeny E., et al.. (2006). Properties of 50nm electroless films Ag–W–oxygen before and after low temperature, low activation energy resistivity decay. Microelectronic Engineering. 83(11-12). 2359–2363. 4 indexed citations
7.
Glickman, Evgeny E.. (2005). Fast penetration of Ga in Al: liquid metal embrittlement near the threshold of grain boundary wetting. International Journal of Materials Research (formerly Zeitschrift fuer Metallkunde). 96(10). 1204–1210. 2 indexed citations
8.
Glickman, Evgeny E., В. А. Богуш, Alexandra Inberg, Yosi Shacham‐Diamand, & N. Croitoru. (2003). Electrical resistivity of thin electroless Ag–W films for metallization. Microelectronic Engineering. 70(2-4). 495–500. 18 indexed citations
9.
Glickman, Evgeny E. & M. Nathan. (2001). Electromigration Kinetics in Thin Film Interconnects: Electro-Transport Coupled to Diffusional Creep. Defect and diffusion forum/Diffusion and defect data, solid state data. Part A, Defect and diffusion forum. 194-199. 1417–1430. 1 indexed citations
10.
Glickman, Evgeny E. & M. Nathan. (2000). Creep-controlled electromigration in near-threshold interconnects. Microelectronic Engineering. 50(1-4). 329–334. 5 indexed citations
11.
Glickman, Evgeny E.. (1998). Grain Boundary Electromigration in Thin Films: Interface Reaction and Segregation Effects. Defect and diffusion forum/Diffusion and defect data, solid state data. Part A, Defect and diffusion forum. 156. 147–160. 6 indexed citations
12.
Glickman, Evgeny E.. (1998). Grain Boundary Wetting in Metals: 'Self Indentation-Internal Solution' Mechanism. Materials science forum. 294-296. 405–410. 2 indexed citations
13.
Glickman, Evgeny E. & M. Nathan. (1996). On the unusual electromigration behavior of copper interconnects. Journal of Applied Physics. 80(7). 3782–3791. 58 indexed citations
14.
Glickman, Evgeny E., et al.. (1996). On the effect of grain boundary segregation on electromigration driving force in thin metal films. Materials Letters. 26(1-2). 65–68. 10 indexed citations
15.
Glickman, Evgeny E.. (1996). Electromigration in Metal Interconnects: Electrical- and Stress Field Induced Diffusion in Small Dimensions. Defect and diffusion forum/Diffusion and defect data, solid state data. Part A, Defect and diffusion forum. 129-130. 225–228. 1 indexed citations
16.
Klinger, Leonid, Evgeny E. Glickman, V. E. Fradkov, W. W. Mullins, & C. Bauer. (1995). Effect of Surface and Grain-Boundary Diffusion on Interconnect Reliability. MRS Proceedings. 391. 4 indexed citations
17.
Gladkikh, A., et al.. (1995). Grain Boundary Migration and Grain Growth Induced by Electromigration in Copper and Aluminum Lines. MRS Proceedings. 391. 4 indexed citations
18.
Klinger, Leonid, L. Levin, & Evgeny E. Glickman. (1995). On the Role of Surface Diffusion in Stress Relaxation During Electromigration. MRS Proceedings. 391. 1 indexed citations
19.
Klinger, Leonid, Evgeny E. Glickman, Alexander Katsman, & L. Levin. (1994). Time dependence of stress and hillock distributions during electromigration in thin metal film interconnections. Materials Science and Engineering B. 23(1). 15–18. 21 indexed citations
20.
Glickman, Evgeny E., Leonid Klinger, Alexander Katsman, & L. Levin. (1994). Stress Relaxation and Electromigration Kinetics in Short Metal Lines: Transition to Creep Controlled Regime. MRS Proceedings. 338. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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