J. C. Bea

672 total citations
53 papers, 534 citations indexed

About

J. C. Bea is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanical Engineering. According to data from OpenAlex, J. C. Bea has authored 53 papers receiving a total of 534 indexed citations (citations by other indexed papers that have themselves been cited), including 49 papers in Electrical and Electronic Engineering, 21 papers in Biomedical Engineering and 12 papers in Mechanical Engineering. Recurrent topics in J. C. Bea's work include 3D IC and TSV technologies (43 papers), Electronic Packaging and Soldering Technologies (21 papers) and Modular Robots and Swarm Intelligence (11 papers). J. C. Bea is often cited by papers focused on 3D IC and TSV technologies (43 papers), Electronic Packaging and Soldering Technologies (21 papers) and Modular Robots and Swarm Intelligence (11 papers). J. C. Bea collaborates with scholars based in Japan, United States and South Korea. J. C. Bea's co-authors include Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka, M. Murugesan, Kangwook Lee, Yuki Ohara, Eiji Iwata, Toshihiro Konno, Hisashi Kino and Akihiro Noriki and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and IEEE Transactions on Electron Devices.

In The Last Decade

J. C. Bea

51 papers receiving 526 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
J. C. Bea Japan 12 481 161 154 68 46 53 534
E.B. Liao Singapore 14 465 1.0× 157 1.0× 47 0.3× 80 1.2× 34 0.7× 35 530
Hisashi Kino Japan 12 547 1.1× 169 1.0× 90 0.6× 100 1.5× 31 0.7× 100 635
Thomas Uhrmann Austria 13 311 0.6× 89 0.6× 59 0.4× 47 0.7× 110 2.4× 54 399
Akitsu Shigetou Japan 13 562 1.2× 172 1.1× 44 0.3× 120 1.8× 60 1.3× 54 638
B. Reese United States 10 401 0.8× 71 0.4× 85 0.6× 32 0.5× 19 0.4× 20 450
Adeel Bajwa United States 13 366 0.8× 68 0.4× 98 0.6× 24 0.4× 12 0.3× 26 415
X. F. Ang Singapore 10 316 0.7× 62 0.4× 42 0.3× 53 0.8× 31 0.7× 18 341
M. J. Wolf Germany 13 540 1.1× 126 0.8× 34 0.2× 82 1.2× 45 1.0× 41 606
T. Sato Japan 9 305 0.6× 111 0.7× 23 0.1× 40 0.6× 74 1.6× 18 367
Pierric Gueguen France 11 355 0.7× 58 0.4× 30 0.2× 80 1.2× 27 0.6× 20 390

Countries citing papers authored by J. C. Bea

Since Specialization
Citations

This map shows the geographic impact of J. C. Bea's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. C. Bea with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. C. Bea more than expected).

Fields of papers citing papers by J. C. Bea

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. C. Bea. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. C. Bea. The network helps show where J. C. Bea may publish in the future.

Co-authorship network of co-authors of J. C. Bea

This figure shows the co-authorship network connecting the top 25 collaborators of J. C. Bea. A scholar is included among the top collaborators of J. C. Bea based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J. C. Bea. J. C. Bea is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
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Fukushima, Takafumi, et al.. (2017). Enlarging the Nanocylinder Size for Through-Si-Via Applications. 3 indexed citations
3.
Fukushima, Takafumi, M. Murugesan, Hiroyuki Hashimoto, et al.. (2016). New concept of TSV formation methodology using Directed Self-Assembly (DSA). 1–4. 3 indexed citations
4.
Murugesan, M., Takafumi Fukushima, J. C. Bea, et al.. (2016). Back-via 3D integration technologies by temporary bonding with thermoplastic adhesives and visible-laser debonding. 265–269. 1 indexed citations
5.
Murugesan, M., J. C. Bea, Mitsumasa Koyanagi, et al.. (2016). Non-conductive film underfill for 3D integration of 20 pm-thick LSI wafers with fine Cu-TSVs. 23. 466–471. 1 indexed citations
6.
Suzuki, Taku, Takafumi Fukushima, J. C. Bea, et al.. (2015). Challenges of high-robustness self-assembly with Cu/Sn-Ag microbump bonding for die-to-wafer 3D integration. 1. 342–347. 8 indexed citations
7.
8.
Fukushima, Takafumi, Taku Suzuki, J. C. Bea, et al.. (2015). Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding. 1. TS7.4.1–TS7.4.4. 1 indexed citations
9.
Fukushima, Takafumi, J. C. Bea, Hisashi Kino, et al.. (2014). Reconfigured-Wafer-to-Wafer 3-D Integration Using Parallel Self-Assembly of Chips With Cu–SnAg Microbumps and a Nonconductive Film. IEEE Transactions on Electron Devices. 61(2). 533–539. 41 indexed citations
10.
11.
Murugesan, M., et al.. (2014). Mechanical Characteristics of Thin Die/Wafers in Three-Dimensional Large-Scale Integrated Systems. IEEE Transactions on Semiconductor Manufacturing. 27(3). 341–346. 9 indexed citations
12.
Murugesan, M., Takafumi Fukushima, J. C. Bea, et al.. (2014). Wafer thinning for high-density three dimensional integration _ 12-inch wafer-level 3D-LSI program at GINTI. 3 indexed citations
13.
Lee, Kangwook, M. Murugesan, J. C. Bea, et al.. (2014). Impacts of 3-D Integration Processes on Memory Retention Characteristics in Thinned DRAM Chip for High-Reliable 3-D DRAM. IEEE Transactions on Electron Devices. 61(2). 379–385. 10 indexed citations
14.
Fukushima, Takafumi, et al.. (2012). Self-assembly-based 3D integration technologies. 151–151.
15.
Murugesan, M., Hiroshi Kobayashi, H. Shimamoto, et al.. (2012). Minimizing the local deformation induced around Cu-TSVs and CuSn/InAu-microbumps in high-density 3D-LSIs. 28.6.1–28.6.4. 21 indexed citations
16.
Fukushima, Takafumi, Yuki Ohara, M. Murugesan, et al.. (2011). Self-assembly technologies with high-precision chip alignment and fine-pitch microbump bonding for advanced die-to-wafer 3D integration. 2050–2055. 12 indexed citations
17.
Fukushima, Takafumi, Eiji Iwata, J. C. Bea, et al.. (2010). Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature. 1–5. 12 indexed citations
18.
19.
Noriki, Akihiro, Eiji Iwata, Yuki Ohara, et al.. (2009). High-Aspect-Ratio Fine Cu Sidewall Interconnection over Chip Edge with Tapered Polymer for MEMS-LSI Multi-Chip Module. 2 indexed citations
20.
Murugesan, M., J. C. Bea, Hiroshi Nohira, et al.. (2008). Investigation of the effect of in situ annealing of FePt nanodots under high vacuum on the chemical states of Fe and Pt by x-ray photoelectron spectroscopy. Journal of Applied Physics. 104(7). 10 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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