Harold D. Ackler

555 total citations
20 papers, 396 citations indexed

About

Harold D. Ackler is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Materials Chemistry. According to data from OpenAlex, Harold D. Ackler has authored 20 papers receiving a total of 396 indexed citations (citations by other indexed papers that have themselves been cited), including 9 papers in Electrical and Electronic Engineering, 6 papers in Biomedical Engineering and 6 papers in Materials Chemistry. Recurrent topics in Harold D. Ackler's work include 3D IC and TSV technologies (5 papers), Advanced MEMS and NEMS Technologies (4 papers) and Electronic Packaging and Soldering Technologies (4 papers). Harold D. Ackler is often cited by papers focused on 3D IC and TSV technologies (5 papers), Advanced MEMS and NEMS Technologies (4 papers) and Electronic Packaging and Soldering Technologies (4 papers). Harold D. Ackler collaborates with scholars based in United States, France and Germany. Harold D. Ackler's co-authors include Yet‐Ming Chiang, Roger H. French, J. B. MacChesney, R. Naslain, Frederick T. Wallenberger, Bahgat Sammakia, Kanad Ghose, Zhou Fan, Soonwan Chung and Pinyen Lin and has published in prestigious journals such as Journal of Colloid and Interface Science, Journal of the American Ceramic Society and Heat Transfer Engineering.

In The Last Decade

Harold D. Ackler

19 papers receiving 382 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Harold D. Ackler United States 9 133 96 92 78 60 20 396
Jonas Paul Germany 10 110 0.8× 42 0.4× 70 0.8× 96 1.2× 58 1.0× 13 308
Jinkun Guo China 13 263 2.0× 154 1.6× 28 0.3× 89 1.1× 72 1.2× 42 447
G. Despert France 6 383 2.9× 91 0.9× 63 0.7× 41 0.5× 218 3.6× 7 551
Jill E. Seebergh United States 9 131 1.0× 73 0.8× 29 0.3× 96 1.2× 46 0.8× 14 437
Dien Ngo United States 14 263 2.0× 58 0.6× 102 1.1× 64 0.8× 129 2.1× 24 586
Samir Salameh Germany 13 135 1.0× 116 1.2× 31 0.3× 120 1.5× 44 0.7× 15 433
Stacy G. Bike United States 15 95 0.7× 75 0.8× 106 1.2× 253 3.2× 49 0.8× 22 656
Hailong Li China 13 147 1.1× 34 0.4× 41 0.4× 123 1.6× 46 0.8× 42 456
Yoshiharu Ozaki Japan 10 255 1.9× 163 1.7× 49 0.5× 94 1.2× 61 1.0× 40 456
Seiichirō Kashū Japan 9 236 1.8× 101 1.1× 52 0.6× 116 1.5× 62 1.0× 14 461

Countries citing papers authored by Harold D. Ackler

Since Specialization
Citations

This map shows the geographic impact of Harold D. Ackler's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Harold D. Ackler with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Harold D. Ackler more than expected).

Fields of papers citing papers by Harold D. Ackler

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Harold D. Ackler. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Harold D. Ackler. The network helps show where Harold D. Ackler may publish in the future.

Co-authorship network of co-authors of Harold D. Ackler

This figure shows the co-authorship network connecting the top 25 collaborators of Harold D. Ackler. A scholar is included among the top collaborators of Harold D. Ackler based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Harold D. Ackler. Harold D. Ackler is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Ackler, Harold D., et al.. (2010). Processing and characterization of composite shape memory alloy (SMA) thin film structures for microactuators. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 7644. 76440N–76440N. 3 indexed citations
2.
Finot, M., et al.. (2009). High gain solar photovoltaics. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 7407. 740708–740708. 1 indexed citations
3.
Sammakia, Bahgat, et al.. (2008). Comparative Analysis of Microchannel Heat Sink Configurations Subject to a Pressure Constraint. Heat Transfer Engineering. 30(1-2). 43–53. 8 indexed citations
4.
Fan, Zhou, et al.. (2007). Thermo-Mechanical Analysis of Thru-Silicon-Via Based High Density Compliant Interconnect. 3. 1179–1185. 9 indexed citations
5.
Ackler, Harold D., et al.. (2006). Material Characterization of Carbon-Nanotube-Reinforced Polymer Composite. Electronic Materials Letters. 2(3). 175–181. 8 indexed citations
6.
Park, Seungbae, et al.. (2006). Viscoelastic Material Properties of SU-8 and Carbon-Nanotube-Reinforced SU-8 Materials. 43–52. 2 indexed citations
8.
Ackler, Harold D., et al.. (2006). Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 24(4). 1780–1784. 4 indexed citations
9.
Ackler, Harold D., et al.. (2005). Smart Three Axis Compliant (STAC) Interconnect: An Ultra-High Density MEMS Based Interconnect for Wafer-Level Ultra-Thin Die Stacking Technology. 2 indexed citations
11.
Chung, Soonwan, et al.. (2005). Structural Reliability of SU-8 Material for MEMS Application. 251–258. 5 indexed citations
12.
Yang, Jun, Jody V. Vykoukal, Jamileh Noshari, et al.. (2000). DIELECTROPHORESIS-BASED MICROFLUIDIC SEPARATION AND DETECTION SYSTEMS.. PubMed. 3(2). 1–12. 4 indexed citations
13.
Ackler, Harold D. & Yet‐Ming Chiang. (1999). Effect of Initial Microstructure on Final Intergranular Phase Distribution in Liquid‐Phase‐Sintered Ceramics. Journal of the American Ceramic Society. 82(1). 183–189. 23 indexed citations
14.
Wallenberger, Frederick T., R. Naslain, J. B. MacChesney, & Harold D. Ackler. (1999). Advanced Inorganic Fibers. 22 indexed citations
15.
Wallenberger, Frederick T., J. B. MacChesney, R. Naslain, & Harold D. Ackler. (1999). Advanced inorganic fibers: Processes, structures, properties and applications. Medical Entomology and Zoology. 14 indexed citations
16.
Ackler, Harold D.. (1998). Healing of Lithographically Introduced Cracks in Glass and Glass‐Containing Ceramics. Journal of the American Ceramic Society. 81(12). 3093–3103. 27 indexed citations
17.
Ackler, Harold D.. (1998). Microfluidic systems for electrochemical and biological studies. University of North Texas Digital Library (University of North Texas). 1 indexed citations
19.
Ackler, Harold D. & Yet‐Ming Chiang. (1997). Model Experiment on Thermodynamic Stability of Retained Intergranular Amorphous Films. Journal of the American Ceramic Society. 80(7). 1893–1896. 29 indexed citations
20.
Ackler, Harold D., Roger H. French, & Yet‐Ming Chiang. (1996). Comparisons of Hamaker Constants for Ceramic Systems with Intervening Vacuum or Water: From Force Laws and Physical Properties. Journal of Colloid and Interface Science. 179(2). 460–469. 228 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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