S. Schmitz

6.0k total citations
13 papers, 154 citations indexed

About

S. Schmitz is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Economics and Econometrics. According to data from OpenAlex, S. Schmitz has authored 13 papers receiving a total of 154 indexed citations (citations by other indexed papers that have themselves been cited), including 9 papers in Electrical and Electronic Engineering, 5 papers in Mechanical Engineering and 2 papers in Economics and Econometrics. Recurrent topics in S. Schmitz's work include Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (7 papers) and Advanced Measurement and Metrology Techniques (2 papers). S. Schmitz is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (7 papers) and Advanced Measurement and Metrology Techniques (2 papers). S. Schmitz collaborates with scholars based in Germany, Netherlands and Italy. S. Schmitz's co-authors include Wolfgang Hiddemann, Karin Hohloch, Ullrich Graeven, Wolfram Klapper, Hartmut Eimermacher, Bernd Metzner, Marcel Reiser, Roland J. Fuchs, Michael Kneba and Michael Unterhalt and has published in prestigious journals such as Leukemia, Value in Health and Microelectronics Reliability.

In The Last Decade

S. Schmitz

9 papers receiving 150 citations

Peers

Countries citing papers authored by S. Schmitz

Since Specialization

Citations

This map shows the geographic impact of S. Schmitz's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. Schmitz with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. Schmitz more than expected).

Fields of papers citing papers by S. Schmitz

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by S. Schmitz. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. Schmitz. The network helps show where S. Schmitz may publish in the future.

Co-authorship network of co-authors of S. Schmitz

This figure shows the co-authorship network connecting the top 25 collaborators of S. Schmitz. A scholar is included among the top collaborators of S. Schmitz based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with S. Schmitz. S. Schmitz is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

13 of 13 papers shown

#	Work	Indexed citations
1	Brüssel vs. Berlin: Wie die EU-Fiskalregeln und die Schuldenbremse die Fiskalpolitik herausfordern 2025 ·Wirtschaftsdienst ·(unknown), S. Schmitz	0
2	P47 How Do HTA Agencies Manage Uncertainties in the Long-Term Clinical Benefit of Gene Therapies? An Analysis of Recent Gene Therapy HTAs in England, Germany, France, Italy, Canada, and the United States 2023 ·Value in Health ·Beryl McCormick, Charles Sheppard, Erika Hutt, S. Schmitz, (unknown)	0
3	Investigating wire bonding pull testing and its calculation basics 2014 ·Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·S. Schmitz, (unknown), Martin Schneider‐Ramelow, Wolfgang H. Müller, K.-D. Lang	0
4	European R&D Trends in wire bonding technologies 2012 ·IMAPSource Proceedings ·Martin Schneider‐Ramelow, (unknown), (unknown), S. Schmitz, K.-D. Lang	5
5	Technologies and Trends to Improve Power Electronic Packaging 2011 ·IMAPSource Proceedings ·Martin Schneider‐Ramelow, Matthias Hütter, Hermann Oppermann, (unknown), S. Schmitz, Eckart Hoene, K.-D. Lang	8
6	Influence of bonding process parameters on chip cratering and phase formation of Cu ball bonds on AlSiCu during storage at 200°C 2010 ·Microelectronics Reliability ·S. Schmitz, (unknown), Stephan Schröder	11
7	Kirkendall voiding in au ball bond interconnects on al chip metallization in the temperature range from 100 – 200°c after optimized intermetallic coverage 2009 ·Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·Martin Schneider‐Ramelow, S. Schmitz, (unknown), (unknown)	1
8	The addition of rituximab to front-line therapy with CHOP (R-CHOP) results in a higher response rate and longer time to treatment failure in patients with lymphoplasmacytic lymphoma: results of a randomized trial of the German Low-Grade Lymphoma Study Group (GLSG) 2008 ·Leukemia ·Christian Buske, Eva Hoster, Martin Dreyling, Hartmut Eimermacher, H. Wandt, Bernd Metzner, Roland J. Fuchs, (unknown), Bernhard J. Woermann, Karin Hohloch, (unknown), W-D Ludwig, (unknown), S. Schmitz, Michael Kneba, Marcel Reiser, Ullrich Graeven, Wolfram Klapper, Michael Unterhalt, Wolfgang Hiddemann	99
9	A 0.14mW/Gbps high-density capacitive interface for 3D system integration 2006 ·Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·A. Fazzi, (unknown), (unknown), R. Canegallo, S. Schmitz, R. Guerrieri	22
10	3D Integration for Hybrid Integration of Integrated Circuits 2006 ·Archivio istituzionale della ricerca (Alma Mater Studiorum Università di Bologna) ·Erik Jung, S. Schmitz, (unknown), (unknown), A. Fazzi, Roberto Guerrieri, R. Canegallo	2
11	Industrially compatible PCB stacking technology for miniaturized sensor systems 2005 ·Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·K.-D. Lang, (unknown), (unknown), J.K. Wolf, (unknown), S. Schmitz, (unknown), (unknown), H. Reichl	0
12	Current loadability of ICA for flip chip applications 2002 ·(unknown), (unknown), S. Schmitz, Christine Kallmayer, R. Aschenbrenner, H. Reichl	4
13	Data Retention in SOI-DRAM with Trench Capacitor Cell 1998 ·European Solid-State Device Research Conference ·H.I. Hanafi, T. Kanarsky, S. Schmitz, (unknown)	2

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact