S. G. Jadhav

625 total citations
12 papers, 293 citations indexed

About

S. G. Jadhav is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, S. G. Jadhav has authored 12 papers receiving a total of 293 indexed citations (citations by other indexed papers that have themselves been cited), including 12 papers in Electrical and Electronic Engineering, 8 papers in Mechanical Engineering and 5 papers in Materials Chemistry. Recurrent topics in S. G. Jadhav's work include Electronic Packaging and Soldering Technologies (10 papers), Aluminum Alloys Composites Properties (6 papers) and Microstructure and mechanical properties (4 papers). S. G. Jadhav is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), Aluminum Alloys Composites Properties (6 papers) and Microstructure and mechanical properties (4 papers). S. G. Jadhav collaborates with scholars based in United States. S. G. Jadhav's co-authors include I. Dutta, Dongdong Pan, Robert A. Marks, J. P. Lucas, K. N. Subramanian, Thomas R. Bieler, Ravi Mahajan, Sol Haberman, Nachiket Raravikar and Rahul Panat and has published in prestigious journals such as Materials Science and Engineering A, Journal of Materials Science and Review of Scientific Instruments.

In The Last Decade

S. G. Jadhav

11 papers receiving 288 citations

Peers

Countries citing papers authored by S. G. Jadhav

Since Specialization

Citations

This map shows the geographic impact of S. G. Jadhav's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. G. Jadhav with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. G. Jadhav more than expected).

Fields of papers citing papers by S. G. Jadhav

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by S. G. Jadhav. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. G. Jadhav. The network helps show where S. G. Jadhav may publish in the future.

Co-authorship network of co-authors of S. G. Jadhav

This figure shows the co-authorship network connecting the top 25 collaborators of S. G. Jadhav. A scholar is included among the top collaborators of S. G. Jadhav based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with S. G. Jadhav. S. G. Jadhav is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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12 of 12 papers shown

#	Work	Indexed citations
1	Comparative Study of Microleakage in Nanofilled and Conventional Composite Resins Used in Class II Restorations 2025 ·(unknown), (unknown), (unknown), S. G. Jadhav, (unknown), Vineet M. Arora	0
2	Silicon photonic integrated circuit for co-packaging with switch ASIC 2021 ·Saeed Fathololoumi, David Hui, S. G. Jadhav, Kimchau N. Nguyen, Meer Sakib, Zhi Li, Hari Mahalingam, (unknown), (unknown), Harel Frish, Ling Liao	3
3	Tombstone Initiation Model for Small Form-Factor Surface Mount Passives 2012 ·IEEE Transactions on Components Packaging and Manufacturing Technology ·Nachiket Raravikar, Rahul Panat, S. G. Jadhav	7
4	Effect of Ag and Cu Concentrations on Creep of Sn-Based Solders 2007 ·(unknown), I. Dutta, S. G. Jadhav	3
5	A comparison of impression and compression creep behavior of polycrystalline Sn 2007 ·Journal of Materials Science ·(unknown), (unknown), Sol Haberman, (unknown), I. Dutta, Ravi Mahajan, S. G. Jadhav	33
6	Novel Process Techniques to Reduce Voids in Solder Thermal Interface Materials Used for Flip-Chip Package Applications 2005 ·Marcelo Montaño, J. Garay Garcia, Weimin Shi, (unknown), (unknown), (unknown), (unknown), Manel Vallès, (unknown), (unknown), S. G. Jadhav, Esteban Bernal, (unknown)	9
7	Impression creep testing and microstructurally adaptive creep modeling of lead free solder interconnects 2005 ·I. Dutta, Dongdong Pan, S. G. Jadhav	23
8	Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders 2005 ·Materials Science and Engineering A ·I. Dutta, Dongdong Pan, Robert A. Marks, S. G. Jadhav	128
9	Impression creep characterization of 90Pb-10Sn microelectronic solder balls at subsolvus and supersolvus temperatures 2005 ·Journal of Electronic Materials ·Dongdong Pan, I. Dutta, S. G. Jadhav, (unknown), (unknown)	15
10	Miniaturized impression creep testing of ball grid array solder balls attached to microelectronic packaging substrates 2004 ·Review of Scientific Instruments ·Dongdong Pan, Robert A. Marks, I. Dutta, Ravi Mahajan, S. G. Jadhav	25
11	Impression creep testing and constitutive modeling of Sn-based solder interconnects 2004 ·Robert A. Marks, (unknown), I. Dutta, S. G. Jadhav	4
12	Stress relaxation behavior of composite and eutectic Sn-Ag solder joints 2001 ·Journal of Electronic Materials ·S. G. Jadhav, Thomas R. Bieler, K. N. Subramanian, J. P. Lucas	43

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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