J. Liu

723 total citations
40 papers, 550 citations indexed

About

J. Liu is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanical Engineering. According to data from OpenAlex, J. Liu has authored 40 papers receiving a total of 550 indexed citations (citations by other indexed papers that have themselves been cited), including 23 papers in Electrical and Electronic Engineering, 13 papers in Biomedical Engineering and 12 papers in Mechanical Engineering. Recurrent topics in J. Liu's work include Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (10 papers) and Nanofabrication and Lithography Techniques (4 papers). J. Liu is often cited by papers focused on Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (10 papers) and Nanofabrication and Lithography Techniques (4 papers). J. Liu collaborates with scholars based in Sweden, China and Norway. J. Liu's co-authors include Z. Lai, Helge Kristiansen, M. Willander, Z.L. Zhang, Yifeng Fu, Cynthia Khoo, Masahiro Inoue, Ying Fu, S. J. Savage and James E. Morris and has published in prestigious journals such as SHILAP Revista de lepidopterología, Scientific Reports and Knowledge-Based Systems.

In The Last Decade

J. Liu

36 papers receiving 528 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
J. Liu Sweden 15 432 163 136 96 55 40 550
Olaf Wittler Germany 13 468 1.1× 150 0.9× 88 0.6× 151 1.6× 20 0.4× 97 598
Myung-Jin Yim South Korea 10 524 1.2× 138 0.8× 124 0.9× 114 1.2× 28 0.5× 25 557
Chin Yaw Tan Singapore 13 210 0.5× 83 0.5× 314 2.3× 118 1.2× 61 1.1× 18 510
Xiaodong Wang China 12 121 0.3× 92 0.6× 199 1.5× 297 3.1× 20 0.4× 62 541
Soonwan Chung South Korea 9 262 0.6× 143 0.9× 51 0.4× 112 1.2× 17 0.3× 30 366
Wencai Li China 10 141 0.3× 111 0.7× 55 0.4× 86 0.9× 29 0.5× 28 406
Fabien Amiot France 12 112 0.3× 157 1.0× 97 0.7× 122 1.3× 15 0.3× 30 445
Changsoo Jang United States 12 273 0.6× 133 0.8× 64 0.5× 107 1.1× 32 0.6× 37 384
Seokmoo Hong South Korea 10 182 0.4× 107 0.7× 71 0.5× 171 1.8× 14 0.3× 68 419

Countries citing papers authored by J. Liu

Since Specialization
Citations

This map shows the geographic impact of J. Liu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Liu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Liu more than expected).

Fields of papers citing papers by J. Liu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. Liu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Liu. The network helps show where J. Liu may publish in the future.

Co-authorship network of co-authors of J. Liu

This figure shows the co-authorship network connecting the top 25 collaborators of J. Liu. A scholar is included among the top collaborators of J. Liu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J. Liu. J. Liu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
3.
Wan, Bo, et al.. (2025). Multisource Adversarial Feature Disentanglement Method for Cross-Subject Gesture Recognition Using sEMG Signals. IEEE Transactions on Instrumentation and Measurement. 74. 1–12.
4.
Ding, Yuhan, et al.. (2024). FI‐Net: Rethinking Feature Interactions for Medical Image Segmentation. SHILAP Revista de lepidopterología. 6(12). 2 indexed citations
5.
Liu, J., et al.. (2024). High-Resolution Image Rotation Acceleration System Based on the ZYNQ Platform. Journal of Circuits Systems and Computers. 34(12).
6.
Kuylenstierna, Dan, et al.. (2008). A compact V-band planar wideband bandpass filter based on Liquid Crystal Polymer substrates. 163–168. 11 indexed citations
7.
8.
Liu, J., Yu Wang, James E. Morris, & Helge Kristiansen. (2005). Development of ontology for the anisotropic conductive adhesive interconnect technology in electronics applications. 193–208. 6 indexed citations
9.
Liu, J., Z. Lai, Helge Kristiansen, & Cynthia Khoo. (2002). Overview of conductive adhesive joining technology in electronics packaging applications. 1–18. 51 indexed citations
10.
11.
Mannan, S.H., et al.. (2002). The effect of temperature ramp rate on flip-chip joint quality and reliability using anisotropically conductive adhesive on FR-4 substrate. Loughborough University Institutional Repository (Loughborough University). 2 indexed citations
12.
Liu, J.. (2002). Recent advances in conductive adhesives for direct chip attach applications. 19. 107–122. 4 indexed citations
13.
Fu, Ying, M. Willander, & J. Liu. (2001). Statistics of electric conductance through anisotropically conductive adhesive. IEEE Transactions on Components and Packaging Technologies. 24(2). 250–255. 21 indexed citations
14.
Fu, Yifeng, J. Liu, & M. Willander. (1999). Conduction modelling of a conductive adhesive with bimodal distribution of conducting element. International Journal of Adhesion and Adhesives. 19(4). 281–286. 27 indexed citations
15.
Liu, J.. (1998). Recent advances in conductive adhesives for direct chip attach applications. Microsystem Technologies. 5(2). 72–80. 30 indexed citations
16.
Liu, J., et al.. (1997). Surface characteristics, reliability, and failure mechanisms of tin/lead, copper, and gold metallizations. IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 20(1). 21–30. 41 indexed citations
17.
Liu, J., et al.. (1995). Reliability of thermo-setting anisotropically conductive adhesives in Chip on Glass application. Microsystem Technologies. 2(1). 32–37. 5 indexed citations
18.
Liu, J., H. Tomioka, L. Arnberg, & S. J. Savage. (1989). Improved corrosion resistance in silicon-alloyed stainless steel wires by rapid solidification. Materials Letters. 8(9). 381–384. 2 indexed citations
19.
Liu, J., L. Arnberg, & S. J. Savage. (1989). On the mechanisms of formation of directly cast rapidly solidified wires. Journal of Materials Science Letters. 8(1). 122–124. 2 indexed citations
20.
Liu, J., et al.. (1988). Hot extrusion and mechanical properties of rapidly solidified Al and Cu alloy powders. Materials Science and Engineering. 98. 419–423. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Olaf Wittler Breakdown of academic impact, for papers by Myung-Jin Yim Breakdown of academic impact, for papers by Chin Yaw Tan Breakdown of academic impact, for papers by Xiaodong Wang Breakdown of academic impact, for papers by Soonwan Chung Breakdown of academic impact, for papers by Wencai Li Breakdown of academic impact, for papers by Fabien Amiot Breakdown of academic impact, for papers by Changsoo Jang Breakdown of academic impact, for papers by Seokmoo Hong
Rankless by CCL
2026