K. Warner

1.2k total citations
42 papers, 875 citations indexed

About

K. Warner is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering and Biomedical Engineering. According to data from OpenAlex, K. Warner has authored 42 papers receiving a total of 875 indexed citations (citations by other indexed papers that have themselves been cited), including 36 papers in Electrical and Electronic Engineering, 6 papers in Aerospace Engineering and 6 papers in Biomedical Engineering. Recurrent topics in K. Warner's work include 3D IC and TSV technologies (15 papers), Thin-Film Transistor Technologies (11 papers) and CCD and CMOS Imaging Sensors (10 papers). K. Warner is often cited by papers focused on 3D IC and TSV technologies (15 papers), Thin-Film Transistor Technologies (11 papers) and CCD and CMOS Imaging Sensors (10 papers). K. Warner collaborates with scholars based in United States. K. Warner's co-authors include J.A. Burns, C.L. Keast, P.W. Wyatt, J.M. Knecht, Vyshnavi Suntharalingam, Brian F. Aull, D. Yost, C.K. Chen, N.E. McGruer and Andrew H. Loomis and has published in prestigious journals such as IEEE Transactions on Electron Devices, IEEE Electron Device Letters and Electronics Letters.

In The Last Decade

K. Warner

39 papers receiving 812 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
K. Warner United States	12	766	115	106	80	80	42	875
J.M. Knecht United States	12	684 0.9×	142 1.2×	112 1.1×	78 1.0×	34 0.4×	37	735
Deniz Sabuncuoglu Tezcan Belgium	18	893 1.2×	326 2.8×	105 1.0×	92 1.1×	16 0.2×	89	1.1k
D. Yost United States	12	640 0.8×	96 0.8×	167 1.6×	65 0.8×	32 0.4×	41	743
Vyshnavi Suntharalingam United States	10	500 0.7×	68 0.6×	46 0.4×	53 0.7×	40 0.5×	44	566
Philippe Soussan Belgium	18	861 1.1×	282 2.5×	188 1.8×	99 1.2×	11 0.1×	91	1.0k
Jinwook Burm South Korea	21	1.0k 1.3×	295 2.6×	341 3.2×	6 0.1×	44 0.6×	84	1.5k
Yu Lei China	13	299 0.4×	53 0.5×	57 0.5×	17 0.2×	7 0.1×	82	499
Maarten Kuijk Belgium	25	1.7k 2.2×	500 4.3×	444 4.2×	6 0.1×	143 1.8×	152	1.9k
M. Rosmeulen Belgium	18	1.1k 1.4×	124 1.1×	75 0.7×	3 0.0×	40 0.5×	99	1.2k
Manabu Kagami Japan	17	785 1.0×	210 1.8×	339 3.2×	19 0.2×	494 6.2×	58	1.2k

Countries citing papers authored by K. Warner

Since Specialization

Citations

This map shows the geographic impact of K. Warner's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by K. Warner with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites K. Warner more than expected).

Fields of papers citing papers by K. Warner

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by K. Warner. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by K. Warner. The network helps show where K. Warner may publish in the future.

Co-authorship network of co-authors of K. Warner

This figure shows the co-authorship network connecting the top 25 collaborators of K. Warner. A scholar is included among the top collaborators of K. Warner based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with K. Warner. K. Warner is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Miller, Eric D., James A. Gregory, Marshall W. Bautz, et al.. (2024). Curved detectors for future x-ray astrophysics missions. 217–217. 1 indexed citations

Suntharalingam, Vyshnavi, et al.. (2023). CCD imagers for the Transiting Exoplanet Survey Satellite from benchtop to space environment. Astronomische Nachrichten. 344(8-9).

Aull, Brian F., et al.. (2014). A Study of Crosstalk in a <inline-formula> <tex-math notation="LaTeX">$256 \times 256$ </tex-math></inline-formula> Photon Counting Imager Based on Silicon Geiger-Mode Avalanche Photodiodes. IEEE Sensors Journal. 15(4). 2123–2132. 50 indexed citations

Ryu, Kevin, Barry E. Burke, Vyshnavi Suntharalingam, et al.. (2014). Development of CCDs for REXIS on OSIRIS-REx. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 9144. 91444O–91444O. 8 indexed citations

Suntharalingam, Vyshnavi, R. Berger, J.M. Knecht, et al.. (2009). A 4-side tileable back illuminated 3D-integrated Mpixel CMOS image sensor. 38–39,39a. 30 indexed citations

Yost, D., J.M. Knecht, P.W. Wyatt, et al.. (2009). Wafer-Scale 3D Integration of Silicon-on-Insulator RF Amplifiers. DSpace@MIT (Massachusetts Institute of Technology). 23. 1–4. 8 indexed citations

Chen, C.K., D. Yost, J.M. Knecht, et al.. (2008). Three-dimensional integration of silicon-on-insulator RF amplifier. Electronics Letters. 44(12). 746–747. 8 indexed citations

Liang, Di, Alexander W. Fang, Hyundai Park, et al.. (2008). Low-Temperature, Strong SiO2-SiO2 Covalent Wafer Bonding for III–V Compound Semiconductors-to-Silicon Photonic Integrated Circuits. Journal of Electronic Materials. 37(10). 1552–1559. 76 indexed citations

Young, Douglas, et al.. (2007). Deep-Trench Process Technology for Three-Dimensionally Integrated SOI-Based Image Sensors. 97–98. 3 indexed citations

10.

Aull, Brian F., J.A. Burns, C.L. Keast, et al.. (2006). Laser Radar Imager Based on 3D Integration of Geiger-Mode Avalanche Photodiodes with Two SOI Timing Circuit Layers. 1179–1188. 41 indexed citations

11.

Burns, J.A., Brian F. Aull, C.K. Chen, et al.. (2006). A wafer-scale 3-D circuit integration technology. IEEE Transactions on Electron Devices. 53(10). 2507–2516. 192 indexed citations

12.

Knecht, J.M., D. Yost, J.A. Burns, et al.. (2006). 3D Via Etch Development for 3D Circuit Integration in FDSOI. 104–105. 2 indexed citations

13.

Warner, K., et al.. (2005). An investigation of wafer-to-wafer alignment tolerances for three-dimensional integrated circuit fabrication. 71–72. 8 indexed citations

14.

Gouker, Pascale, et al.. (2003). Substrate removal and BOX thinning effects on total dose response of FDSOI NMOSFET. IEEE Transactions on Nuclear Science. 50(6). 1776–1783. 19 indexed citations

15.

Burns, J.A., et al.. (2002). RF characterisation of fully depleted SOI MOSFET with Si substrate removed. Electronics Letters. 38(5). 256–257. 3 indexed citations

16.

Burns, J.A., L.G. McIlrath, C.L. Keast, et al.. (2002). Three-dimensional integrated circuits for low-power, high-bandwidth systems on a chip. 268–269,. 111 indexed citations

17.

Hopwood, Jeffrey, et al.. (1997). Creating 3D circuits using transferred films. IEEE Circuits and Devices Magazine. 13(6). 27–30. 10 indexed citations

18.

Qin, Shu, et al.. (1996). N-Type Doping by Plasma Ion Implantation Using a PH₃ SDS System. MRS Proceedings. 438. 2 indexed citations

19.

Warner, K., et al.. (1995). Constriction resistance of microcone-based contacts. IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 18(2). 385–389. 3 indexed citations

20.

Warner, K., et al.. (1992). Silver Teflon blanket: LDEF tray C-08. 3134. 861. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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