J.M. Knecht

996 total citations
37 papers, 735 citations indexed

About

J.M. Knecht is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics and Biomedical Engineering. According to data from OpenAlex, J.M. Knecht has authored 37 papers receiving a total of 735 indexed citations (citations by other indexed papers that have themselves been cited), including 34 papers in Electrical and Electronic Engineering, 5 papers in Atomic and Molecular Physics, and Optics and 4 papers in Biomedical Engineering. Recurrent topics in J.M. Knecht's work include 3D IC and TSV technologies (14 papers), Thin-Film Transistor Technologies (12 papers) and Semiconductor materials and devices (12 papers). J.M. Knecht is often cited by papers focused on 3D IC and TSV technologies (14 papers), Thin-Film Transistor Technologies (12 papers) and Semiconductor materials and devices (12 papers). J.M. Knecht collaborates with scholars based in United States and Germany. J.M. Knecht's co-authors include C.L. Keast, P.W. Wyatt, D. Yost, C.K. Chen, J.A. Burns, Vyshnavi Suntharalingam, K. Warner, Brian F. Aull, C. O. Bozler and M.A. Gouker and has published in prestigious journals such as Applied Physics Letters, IEEE Transactions on Electron Devices and IEEE Electron Device Letters.

In The Last Decade

J.M. Knecht

35 papers receiving 660 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
J.M. Knecht United States	12	684	142	112	78	43	37	735
D. Yost United States	12	640 0.9×	96 0.7×	167 1.5×	65 0.8×	15 0.3×	41	743
K. Warner United States	12	766 1.1×	115 0.8×	106 0.9×	80 1.0×	36 0.8×	42	875
Vyshnavi Suntharalingam United States	10	500 0.7×	68 0.5×	46 0.4×	53 0.7×	30 0.7×	44	566
C.K. Chen United States	10	525 0.8×	70 0.5×	111 1.0×	56 0.7×	17 0.4×	25	560
Philippe Soussan Belgium	18	861 1.3×	282 2.0×	188 1.7×	99 1.3×	45 1.0×	91	1.0k
Makoto Motoyoshi Japan	7	420 0.6×	93 0.7×	58 0.5×	59 0.8×	8 0.2×	19	485
Noboru Ishihara Japan	19	1.1k 1.6×	247 1.7×	161 1.4×	5 0.1×	23 0.5×	171	1.2k
Mohammad Azim Karami Iran	11	359 0.5×	142 1.0×	43 0.4×	9 0.1×	20 0.5×	103	481
N. Sillon France	19	895 1.3×	234 1.6×	59 0.5×	179 2.3×	12 0.3×	71	968
V. Chan United States	14	578 0.8×	101 0.7×	77 0.7×	7 0.1×	27 0.6×	38	639

Countries citing papers authored by J.M. Knecht

Since Specialization

Citations

This map shows the geographic impact of J.M. Knecht's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J.M. Knecht with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J.M. Knecht more than expected).

Fields of papers citing papers by J.M. Knecht

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J.M. Knecht. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J.M. Knecht. The network helps show where J.M. Knecht may publish in the future.

Co-authorship network of co-authors of J.M. Knecht

This figure shows the co-authorship network connecting the top 25 collaborators of J.M. Knecht. A scholar is included among the top collaborators of J.M. Knecht based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J.M. Knecht. J.M. Knecht is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Knecht, J.M., et al.. (2024). Planar 3D-Printing and Intrinsic Heat Generation Thermoforming of a Fully Customizable Ankle Orthosis – A Feasibility Approach. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–6.

Hazard, Thomas, Wayne Woods, Cyrus F. Hirjibehedin, et al.. (2023). Characterization of superconducting through-silicon vias as capacitive elements in quantum circuits. Applied Physics Letters. 123(15). 9 indexed citations

Spector, S. J., J.M. Knecht, R. T. Schulein, & David O. Caplan. (2015). Silicon Photonic Filters for Compact High Extinction Ratio Power Efficient (CHERPe) Transmitters§. 4. SW1N.4–SW1N.4. 2 indexed citations

Yost, D., J.M. Knecht, David Chapman, et al.. (2010). Wafer-scale 3D integration of InGaAs photodiode arrays with Si readout circuits by oxide bonding and through-oxide vias. Microelectronic Engineering. 88(1). 131–134. 9 indexed citations

Knecht, J.M., J. Kedzierski, Pascale Gouker, et al.. (2010). Improvement of SOI MOSFET RF Performance by Implant Optimization. IEEE Microwave and Wireless Components Letters. 20(5). 271–273. 5 indexed citations

Suntharalingam, Vyshnavi, R. Berger, J.M. Knecht, et al.. (2009). A 4-side tileable back illuminated 3D-integrated Mpixel CMOS image sensor. 38–39,39a. 30 indexed citations

Yost, D., J.M. Knecht, P.W. Wyatt, et al.. (2009). Wafer-Scale 3D Integration of Silicon-on-Insulator RF Amplifiers. DSpace@MIT (Massachusetts Institute of Technology). 23. 1–4. 8 indexed citations

Gouker, Pascale, et al.. (2009). Radiation effects in MIT Lincoln lab 3DIC technology. 1–2. 2 indexed citations

Chen, C.K., D. Yost, J.M. Knecht, et al.. (2008). Three-dimensional integration of silicon-on-insulator RF amplifier. Electronics Letters. 44(12). 746–747. 8 indexed citations

10.

Chen, C.K., P.W. Wyatt, J.M. Knecht, et al.. (2007). Fully Depleted SOI RF Switch with Dynamic Biasing. 13. 175–178. 7 indexed citations

11.

Young, Douglas, et al.. (2007). Deep-Trench Process Technology for Three-Dimensionally Integrated SOI-Based Image Sensors. 97–98. 3 indexed citations

12.

Aull, Brian F., J.A. Burns, C.L. Keast, et al.. (2006). Laser Radar Imager Based on 3D Integration of Geiger-Mode Avalanche Photodiodes with Two SOI Timing Circuit Layers. 1179–1188. 41 indexed citations

13.

Burns, J.A., Brian F. Aull, C.K. Chen, et al.. (2006). A wafer-scale 3-D circuit integration technology. IEEE Transactions on Electron Devices. 53(10). 2507–2516. 192 indexed citations

14.

Knecht, J.M., D. Yost, J.A. Burns, et al.. (2006). 3D Via Etch Development for 3D Circuit Integration in FDSOI. 104–105. 2 indexed citations

15.

Wyatt, P.W., et al.. (2005). X-band fully depleted SOI Amplifier with adaptive bias control. IEEE Microwave and Wireless Components Letters. 15(7). 451–453. 2 indexed citations

16.

Suntharalingam, Vyshnavi, R. Berger, J.A. Burns, et al.. (2005). Megapixel CMOS image sensor fabricated in three-dimensional integrated circuit technology. 356–357. 88 indexed citations

17.

Gouker, M.A., et al.. (2002). Multi-layer spiral inductors in a high-precision, fully-planar MCM-D process. 2. 1055–1058. 9 indexed citations

18.

Bozler, C. O., et al.. (2002). MEMS microswitch arrays for reconfigurable distributed microwave components. 1. 153–156. 51 indexed citations

19.

Burns, J.A., C.L. Keast, J.M. Knecht, et al.. (2002). Performance of a low power fully-depleted deep submicron SOI technology and its extension to 0.15 μm. 2440. 102–103. 3 indexed citations

20.

Fritze, M., S. C. Palmateer, P. A. Maki, et al.. (1999). Nanofabrication with deep-ultraviolet lithography and resolution enhancements. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 17(6). 3310–3313. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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