Nety Krishna

1.1k citations

18 papers · 854 indexed · 1 hit paper · h-index 9

Impact in

Mechanics of Materials top 5%
- Metal and Thin Film Mechanics
- Numerical methods in engineering
- Mechanical Behavior of Composites
Electronic, Optical and Magnetic Materials top 10%
- Copper Interconnects and Reliability

Papers in

Ceramics and Composites 2
Electronic, Optical and Magnetic Materials 6
- Copper Interconnects and Reliability 6

Co-authors: Michael Lane Reinhold H. Dauskardt Qing Ma Souvik Mahapatra P. Sridhar Akhila Kumar Sahu N. Chandrakumar Santoshkumar D. Bhat
Journals: IEEE Electron Device Letters (2 papers)Journal of Membrane Science (1 paper)Microelectronic Engineering (1 paper)Journal of materials research/Pratt's guide to venture capital sources (1 paper)Engineering Fracture Mechanics (1 paper)
Partner nations: United States India

In The Last Decade

Nety Krishna

18 papers receiving 835 citations

Hit Papers

align trajectories log scale

Adhesion and debonding of multi-layer thin film structures 1998 · 510 citations

Peers

Countries citing papers authored by Nety Krishna

Since Specialization

Citations

This map shows the geographic impact of Nety Krishna's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Nety Krishna with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Nety Krishna more than expected).

Fields of papers citing papers by Nety Krishna

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Nety Krishna. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Nety Krishna. The network helps show where Nety Krishna may publish in the future.

Co-authors

The 25 scholars most cited alongside Nety Krishna, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Nety Krishna Line = papers co-authored together Nety Krishna links everyone, so they are left out of the graph.

All Works

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18 of 18 papers shown

#	Work
1	Mordenite-incorporated PVA–PSSA membranes as electrolytes for DMFCs Journal of Membrane Science ·Santoshkumar D. Bhat, Akhila Kumar Sahu, Christy George, S. Pitchumani, P. Sridhar, N. Chandrakumar, Christine Dominique C. Dolendo, Nety Krishna, Avanish Shukla	2009	61
2	Performance and Reliability of Au and Pt Single-Layer Metal Nanocrystal Flash Memory Under nand (FN/FN) Operation IEEE Transactions on Electron Devices ·Maura Lyons, Michael Pimental, 黄宝富, Nety Krishna, Souvik Mahapatra	2009	12
3	Reliability of single and dual Layer Pt nanocrystal devices for NAND flash applications: A 2-region model for endurance defect generation DSpace (IIT Bombay) ·Maura Lyons, Jun Wang, K. Rittig, Marcelle Ferreira Saldanha, Goutam Mukhopadhyay, Souvik Mahapatra, Michael Pimental, Damurussiri Kraykaw, Nety Krishna	2009	6
4	Self-assembled metallic nanocrystal structures for advanced non-volatile memory applications Microelectronic Engineering ·Michael Pimental, Nety Krishna	2008	8
5	The effect of band gap engineering of the nitride storage node on performance and reliability of charge trap flash Marcelle Ferreira Saldanha, Udayan Ganguly, Christine Dominique C. Dolendo, Chris Olsen, S. M. Seutter, G. Conti, Khaled Ahmed, Nety Krishna, J. Vasi, Souvik Mahapatra	2008	10
6	Au nanocrystal flash memory reliability and failure analysis Maura Lyons, 黄宝富, Michael Pimental, Mikiyas Teshome, Nety Krishna, Souvik Mahapatra	2008	7
7	Nitride engineering and the effect of interfaces on Charge Trap Flash performance and reliability DSpace (IIT Bombay) ·Marcelle Ferreira Saldanha, Udayan Ganguly, Christine Dominique C. Dolendo, Maura Lyons, Chris Olsen, S. M. Seutter, N. Akimkhankyzy, G. Conti, Khaled Ahmed, Nety Krishna, J. Vasi, Souvik Mahapatra	2008	19
8	Metal Nanocrystal Memory With Pt Single- and Dual-Layer NC With Low-Leakage $\hbox{Al}_{2}\hbox{O}_{3}$ Blocking Dielectric IEEE Electron Device Letters ·Maura Lyons, Jun Wang, Michael Pimental, Damurussiri Kraykaw, Nety Krishna, Souvik Mahapatra	2008	26
9	Development of A 3D Simulator for Metal Nanocrystal (NC) Flash Memories under NAND Operation DSpace (IIT Bombay) ·Aneesh Nainani, Sabarni Palit, Maura Lyons, Udayan Ganguly, Nety Krishna, J. Vasi, Souvik Mahapatra	2007	8
10	Tunable Workfunction with TaN Metal Gate on HfO₂-Hf_xSi_yO Dielectrics MRS Proceedings ·Tafadzwa Mlambo, Liana Santos Alves Peixoto, Khaled Ahmed, Shreyas S. Kher, Steven Hung, Nety Krishna, Jeff Chen, L. Daté, Lyu Linli, J. P. Campbell	2004	2
11	PVD aluminum dual damascene interconnection: yield comparison between counterbore and self aligned approaches Chethan Subramanya, DePuey Eg, Mas Rizalynda Mohd Razali, Thaís Massom, Gih‐Keong Lau, 徐燕辉, Mohammed Rashid Alathba, Fordyce Chilcen Pier, M Scott Lisa, 李秋玫, G. S. Varner, Jr. Souto-Maior, Nety Krishna, Junwei Su, EK Ofori, Xishun Xie, H Steiner	2003	1
12	Replacement metal-gate NMOSFETs with ALD TaN/EP-Cu, PVD Ta, and PVD TaN electrode IEEE Electron Device Letters ·Yanming Chen, Václav Káňa, Greene Brass Quintet, Wafa Sebki, Jr. Souto-Maior, Nety Krishna, Hua Chung, Cécile M. Antoine, Bin Yu, Qian Xiang, Toramatsu	2003	15
13	Adhesion and reliability of copper interconnects with Ta and TaN barrier layers Journal of materials research/Pratt's guide to venture capital sources ·Michael Lane, Reinhold H. Dauskardt, Nety Krishna, Alexandra Lebedeva	2000	150
14	Effect of Nitrogen Content on Interfacial Adhesion of the Ta/SiO₂Interface MRS Proceedings ·Michael Lane, Suad Khalid Rassam, Nety Krishna, Alexandra Lebedeva	1999	2
15	Subcritical Debonding of Multilayer Interconnect Structures: Temperature and Humidity Effects MRS Proceedings ·Michael Lane, Suad Khalid Rassam, Qing Ma, H. Fujimoto, Nety Krishna	1999	10
16	Adhesion and debonding of multi-layer thin film structures Engineering Fracture Mechanics ·Reinhold H. Dauskardt, Michael Lane, Qing Ma, Nety Krishna Hit paper breakdown →	1998	510
17	Debonding of Interfaces in Multilayer Interconnect Structures MRS Proceedings ·Michael Lane, Marina Oliveira Rodrigues, Suad Khalid Rassam, Qing Ma, H. Fujimoto, Nety Krishna	1998	3
18	Effects of Interface Nonplanarity on the Interface Fracture Energy of the TiN/SiO₂System MRS Proceedings ·Michael Lane, Marina Oliveira Rodrigues, Suad Khalid Rassam, Qing Ma, H. Fujimoto, Nety Krishna	1997	4

About Nety Krishna

Nety Krishna is a scholar working on Ceramics and Composites, Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Mechanics of Materials and Renewable Energy, Sustainability and the Environment, having authored 18 papers that have together received 854 indexed citations. Recurring topics across this work include Semiconductor materials and devices (13 papers), Advanced Memory and Neural Computing (7 papers), Copper Interconnects and Reliability (6 papers), Electronic Packaging and Soldering Technologies (4 papers), Ferroelectric and Negative Capacitance Devices (4 papers), Advancements in Semiconductor Devices and Circuit Design (4 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers) and Metal and Thin Film Mechanics (2 papers). The work is most often cited by research in Mechanics of Materials (378 citations), Electronic, Optical and Magnetic Materials (255 citations), Ceramics and Composites (68 citations), Electrical and Electronic Engineering (538 citations) and Biomedical Engineering (189 citations). Nety Krishna has collaborated with scholars based in United States and India. Frequent co-authors include Michael Lane, Reinhold H. Dauskardt, Qing Ma, Souvik Mahapatra, P. Sridhar, Akhila Kumar Sahu, N. Chandrakumar, Santoshkumar D. Bhat, S. Pitchumani and Christy George. Their work appears in journals such as IEEE Electron Device Letters, Journal of Membrane Science, Microelectronic Engineering, Journal of materials research/Pratt's guide to venture capital sources and Engineering Fracture Mechanics.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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