Ming‐Hua Shiao
- Materials Chemistry top 10%
- Mechanics of Materials top 5%
- Electrical and Electronic Engineering
- Mechanical Engineering top 10%
- Electronic, Optical and Magnetic Materials top 10%
- Co-authors
- Fuh‐Sheng ShieuDu‐Cheng TsaiZue‐Chin ChangHung Ji HuangTai‐Nan LinBing-Hau KuoShou-Yi ChangShih-Chang Liang
- Topics
- Metal and Thin Film Mechanics (26 papers)Copper Interconnects and Reliability (10 papers)Diamond and Carbon-based Materials Research (8 papers)
- Partner nations
- TaiwanJapanUnited States
In The Last Decade
Ming‐Hua Shiao
60 papers receiving 859 citations
Peers
Comparison fields: 5 of 60
- Materials Chemistry 379
- Mechanics of Materials 373
- Electrical and Electronic Engineering 282
- Mechanical Engineering 232
- Electronic, Optical and Magnetic Materials 211
Countries citing papers authored by Ming‐Hua Shiao
This map shows the geographic impact of Ming‐Hua Shiao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ming‐Hua Shiao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ming‐Hua Shiao more than expected).
Fields of papers citing papers by Ming‐Hua Shiao
This network shows the impact of papers produced by Ming‐Hua Shiao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ming‐Hua Shiao. The network helps show where Ming‐Hua Shiao may publish in the future.
Co-authorship network of co-authors of Ming‐Hua Shiao
This figure shows the co-authorship network connecting the top 25 collaborators of Ming‐Hua Shiao. A scholar is included among the top collaborators of Ming‐Hua Shiao based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ming‐Hua Shiao. Ming‐Hua Shiao is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 2 | |
| 3 | 3 | |
| 4 | 18 | |
| 5 | 12 | |
| 6 | 11 | |
| 7 | 11 | |
| 8 | 5 | |
| 9 | 1 | |
| 10 | 3 | |
| 11 | 6 | |
| 12 | 72 | |
| 13 | 5 | |
| 14 | 5 | |
| 15 | 11 | |
| 16 | 14 | |
| 17 | 10 | |
| 18 | 17 | |
| 19 | 9 | |
| 20 | 9 |
About Ming‐Hua Shiao
Ming‐Hua Shiao is a scholar working on Mechanics of Materials, Electronic, Optical and Magnetic Materials and Surfaces, Coatings and Films, having authored 64 papers that have together received 881 indexed citations. Recurring topics across this work include Metal and Thin Film Mechanics (26 papers), Copper Interconnects and Reliability (10 papers) and Diamond and Carbon-based Materials Research (8 papers). The work is most often cited by research in Mechanics of Materials (373 citations), Electronic, Optical and Magnetic Materials (211 citations) and Materials Chemistry (379 citations). Ming‐Hua Shiao has collaborated with scholars based in Taiwan, Japan and United States. Frequent co-authors include Fuh‐Sheng Shieu, Du‐Cheng Tsai, Zue‐Chin Chang, Hung Ji Huang, Tai‐Nan Lin, Bing-Hau Kuo, Shou-Yi Chang, Shih-Chang Liang, Chien‐Nan Hsiao and Chun-Ting Lin. Their work appears in journals such as Journal of The Electrochemical Society, Electrochimica Acta and Sensors.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.