Shreepad Panth

972 total citations
29 papers, 642 citations indexed

About

Shreepad Panth is a scholar working on Electrical and Electronic Engineering, Computer Networks and Communications and Hardware and Architecture. According to data from OpenAlex, Shreepad Panth has authored 29 papers receiving a total of 642 indexed citations (citations by other indexed papers that have themselves been cited), including 28 papers in Electrical and Electronic Engineering, 6 papers in Computer Networks and Communications and 4 papers in Hardware and Architecture. Recurrent topics in Shreepad Panth's work include 3D IC and TSV technologies (26 papers), Semiconductor materials and devices (10 papers) and Advancements in Photolithography Techniques (8 papers). Shreepad Panth is often cited by papers focused on 3D IC and TSV technologies (26 papers), Semiconductor materials and devices (10 papers) and Advancements in Photolithography Techniques (8 papers). Shreepad Panth collaborates with scholars based in United States, South Korea and United Kingdom. Shreepad Panth's co-authors include Sung Kyu Lim, Yang Du, Kambiz Samadi, Sandeep Kumar Samal, Yun Seop Yu, Moongon Jung, Krishnendu Chakrabarty, Mehdi Saedi, Azad Naeemi and Brandon Noia and has published in prestigious journals such as IEEE Transactions on Electron Devices, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems and IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

In The Last Decade

Shreepad Panth

28 papers receiving 630 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Shreepad Panth United States 13 597 161 151 36 21 29 642
Jinwoo Kim South Korea 12 443 0.7× 99 0.6× 121 0.8× 34 0.9× 43 2.0× 63 530
Akram Ben Ahmed Japan 12 446 0.7× 338 2.1× 140 0.9× 22 0.6× 20 1.0× 48 525
P. Morrow United States 3 464 0.8× 271 1.7× 245 1.6× 44 1.2× 36 1.7× 3 584
Kyungwook Chang United States 12 384 0.6× 97 0.6× 131 0.9× 20 0.6× 6 0.3× 29 438
Eren Kursun United States 16 458 0.8× 163 1.0× 274 1.8× 57 1.6× 35 1.7× 39 592
Sandeep Kumar Samal United States 12 370 0.6× 100 0.6× 92 0.6× 17 0.5× 13 0.6× 28 415
Kyung Whan Kim South Korea 6 263 0.4× 117 0.7× 122 0.8× 17 0.5× 18 0.9× 7 328
Kyu-Myung Choi South Korea 14 485 0.8× 158 1.0× 304 2.0× 7 0.2× 34 1.6× 62 637
Clair Webb United States 9 668 1.1× 354 2.2× 355 2.4× 34 0.9× 43 2.0× 16 807
Krit Athikulwongse Thailand 13 612 1.0× 146 0.9× 90 0.6× 83 2.3× 84 4.0× 33 667

Countries citing papers authored by Shreepad Panth

Since Specialization
Citations

This map shows the geographic impact of Shreepad Panth's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Shreepad Panth with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Shreepad Panth more than expected).

Fields of papers citing papers by Shreepad Panth

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Shreepad Panth. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Shreepad Panth. The network helps show where Shreepad Panth may publish in the future.

Co-authorship network of co-authors of Shreepad Panth

This figure shows the co-authorship network connecting the top 25 collaborators of Shreepad Panth. A scholar is included among the top collaborators of Shreepad Panth based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Shreepad Panth. Shreepad Panth is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Panth, Shreepad, Sandeep Kumar Samal, Kambiz Samadi, Yang Du, & Sung Kyu Lim. (2017). Tier Degradation of Monolithic 3-D ICs: A Power Performance Study at Different Technology Nodes. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 36(8). 1265–1273. 8 indexed citations
2.
Panth, Shreepad, Kambiz Samadi, Yang Du, & Sung Kyu Lim. (2017). Shrunk-2-D: A Physical Design Methodology to Build Commercial-Quality Monolithic 3-D ICs. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 36(10). 1716–1724. 65 indexed citations
3.
Samal, Sandeep Kumar, et al.. (2016). Adaptive Regression-Based Thermal Modeling and Optimization for Monolithic 3-D ICs. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 35(10). 1707–1720. 21 indexed citations
4.
Panth, Shreepad & Sung Kyu Lim. (2016). Probe-Pad Placement for Prebond Test of 3-D ICs. IEEE Transactions on Components Packaging and Manufacturing Technology. 6(4). 637–644. 2 indexed citations
5.
Song, Taigon, et al.. (2015). Three-Tier 3D ICs for More Power Reduction: Strategies in CAD, Design, and Bonding Selection. International Conference on Computer Aided Design. 752–757. 6 indexed citations
6.
Song, Taigon, et al.. (2015). Three-tier 3D ICs for more power reduction: Strategies in CAD, design, and bonding selection. 752–757. 5 indexed citations
7.
Panth, Shreepad, Kambiz Samadi, Yang Du, & Sung Kyu Lim. (2015). Placement-Driven Partitioning for Congestion Mitigation in Monolithic 3D IC Designs. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 34(4). 540–553. 51 indexed citations
8.
Panth, Shreepad, Kambiz Samadi, Yang Du, & Sung Kyu Lim. (2015). Tier-partitioning for power delivery vs cooling tradeoff in 3D VLSI for mobile applications. 1–6. 9 indexed citations
9.
Panth, Shreepad, Sandeep Kumar Samal, Yun Seop Yu, & Sung Kyu Lim. (2014). Design challenges and solutions for ultra-high-density monolithic 3D ICs. 1–2. 36 indexed citations
10.
Panth, Shreepad, Kambiz Samadi, Yang Du, & Sung Kyu Lim. (2014). Power-Performance Study of Block-Level Monolithic 3D-ICs Considering Inter-Tier Performance Variations. 1–6. 57 indexed citations
11.
Panth, Shreepad, Kambiz Samadi, Yang Du, & Sung Kyu Lim. (2014). Design and CAD methodologies for low power gate-level monolithic 3D ICs. 171–176. 104 indexed citations
12.
Noia, Brandon, Shreepad Panth, Krishnendu Chakrabarty, & Sung Kyu Lim. (2014). Scan Test of Die Logic in 3-D ICs Using TSV Probing. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 23(2). 317–330. 18 indexed citations
13.
14.
Samal, Sandeep Kumar, Shreepad Panth, Kambiz Samadi, et al.. (2014). Fast and Accurate Thermal Modeling and Optimization for Monolithic 3D ICs. 1–6. 45 indexed citations
15.
Lee, Jung­hee, Chrysostomos Nicopoulos, Hyung Gyu Lee, et al.. (2012). IsoNet: Hardware-Based Job Queue Management for Many-Core Architectures. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 21(6). 1080–1093. 11 indexed citations
16.
Noia, Brandon, Shreepad Panth, Krishnendu Chakrabarty, & Sung Kyu Lim. (2012). Scan test of die logic in 3D ICs using TSV probing. 2012. 1–8. 10 indexed citations
17.
Deutsch, Sergej, Krishnendu Chakrabarty, Shreepad Panth, & Sung Kyu Lim. (2012). TSV Stress-Aware ATPG for 3D Stacked ICs. 31–36. 8 indexed citations
18.
Panth, Shreepad & Sung Kyu Lim. (2012). Transition delay fault testing of 3D ICs with IR-drop study. 270–275. 5 indexed citations
19.
Panth, Shreepad & Sung Kyu Lim. (2011). Scan chain and power delivery network synthesis for pre-bond test of 3D ICs. 26–31. 10 indexed citations
20.
Jung, Moongon, Shreepad Panth, & Sung Kyu Lim. (2011). A study of TSV variation impact on power supply noise. 10 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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