Brent Goplen

1.1k total citations
10 papers, 855 citations indexed

About

Brent Goplen is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture and Biomedical Engineering. According to data from OpenAlex, Brent Goplen has authored 10 papers receiving a total of 855 indexed citations (citations by other indexed papers that have themselves been cited), including 10 papers in Electrical and Electronic Engineering, 2 papers in Hardware and Architecture and 2 papers in Biomedical Engineering. Recurrent topics in Brent Goplen's work include 3D IC and TSV technologies (8 papers), VLSI and FPGA Design Techniques (7 papers) and Advancements in Photolithography Techniques (3 papers). Brent Goplen is often cited by papers focused on 3D IC and TSV technologies (8 papers), VLSI and FPGA Design Techniques (7 papers) and Advancements in Photolithography Techniques (3 papers). Brent Goplen collaborates with scholars based in United States, Switzerland and Taiwan. Brent Goplen's co-authors include Sachin S. Sapatnekar, Cristinel Ababei, Yan Feng, Kia Bazargan, Yong Zhan, Martin D. F. Wong, Guoqiang Chen, Haifeng Qian, Jeng-Liang Tsai and Sung‐Mo Kang and has published in prestigious journals such as Proceedings of the IEEE, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems and IEEE Design & Test of Computers.

In The Last Decade

Brent Goplen

10 papers receiving 822 citations

Peers

Countries citing papers authored by Brent Goplen

Since Specialization

Citations

This map shows the geographic impact of Brent Goplen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Brent Goplen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Brent Goplen more than expected).

Fields of papers citing papers by Brent Goplen

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Brent Goplen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Brent Goplen. The network helps show where Brent Goplen may publish in the future.

Co-authorship network of co-authors of Brent Goplen

This figure shows the co-authorship network connecting the top 25 collaborators of Brent Goplen. A scholar is included among the top collaborators of Brent Goplen based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Brent Goplen. Brent Goplen is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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10 of 10 papers shown

#	Work	Indexed citations
1	Placement of 3D ICs with Thermal and Interlayer Via Considerations 2007 ·Proceedings - ACM IEEE Design Automation Conference ·Brent Goplen, Sachin S. Sapatnekar	16
2	Placement of 3D ICs with thermal and interlayer via considerations 2007 ·Proceedings - ACM IEEE Design Automation Conference ·Brent Goplen, (unknown)	80
3	Placement of thermal vias in 3-D ICs using various thermal objectives 2006 ·IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems ·Brent Goplen, Sachin S. Sapatnekar	123
4	Temperature-Aware Placement for SOCs 2006 ·Proceedings of the IEEE ·Jeng-Liang Tsai, (unknown), Guoqiang Chen, Brent Goplen, Haifeng Qian, Yong Zhan, Sung‐Mo Kang, Martin D. F. Wong, Sachin S. Sapatnekar	45
5	Electrothermal analysis and optimization techniques for nanoscale integrated circuits 2006 ·Yong Zhan, Brent Goplen, Sachin S. Sapatnekar	13
6	Net weighting to reduce repeater counts during placement 2005 ·Brent Goplen, Prashant Saxena, Sachin S. Sapatnekar	4
7	Placement and Routing in 3D Integrated Circuits 2005 ·IEEE Design & Test of Computers ·Cristinel Ababei, Yan Feng, Brent Goplen, (unknown), (unknown), Kia Bazargan, Sachin S. Sapatnekar	101
8	Thermal via placement in 3D ICs 2005 ·Brent Goplen, Sachin S. Sapatnekar	157
9	Efficient thermal placement of standard cells in 3D ICs using a force directed approach 2004 ·Brent Goplen, Sachin S. Sapatnekar	145
10	Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach 2003 ·International Conference on Computer Aided Design ·Brent Goplen, Sachin S. Sapatnekar	171

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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