Jiwoo Pak
- Electrical and Electronic Engineering top 10%
- Hardware and Architecture top 5%
- Artificial Intelligence top 10%
- Electronic, Optical and Magnetic Materials
- Computer Networks and Communications
- Co-authors
- David Z. PanSung Kyu LimMohit PathakJames LaudonAzalia MirhoseiniYoung‐Joon LeeQuoc V. LeE. Tuncer
- Topics
- 3D IC and TSV technologies (11 papers)Copper Interconnects and Reliability (7 papers)Electronic Packaging and Soldering Technologies (7 papers)
- Journals
- NatureIEEE Transactions on Computer-Aided Design of Integrated Circuits and SystemsInternational Conference on Computer Aided Design
- Partner nations
- United StatesSouth Korea
In The Last Decade
Jiwoo Pak
14 papers receiving 500 citations
Hit Papers
Peers
Comparison fields: 5 of 60
- Electrical and Electronic Engineering 369
- Hardware and Architecture 95
- Artificial Intelligence 94
- Electronic, Optical and Magnetic Materials 76
- Computer Networks and Communications 48
Countries citing papers authored by Jiwoo Pak
This map shows the geographic impact of Jiwoo Pak's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jiwoo Pak with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jiwoo Pak more than expected).
Fields of papers citing papers by Jiwoo Pak
This network shows the impact of papers produced by Jiwoo Pak. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jiwoo Pak. The network helps show where Jiwoo Pak may publish in the future.
Co-authorship network of co-authors of Jiwoo Pak
This figure shows the co-authorship network connecting the top 25 collaborators of Jiwoo Pak. A scholar is included among the top collaborators of Jiwoo Pak based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jiwoo Pak. Jiwoo Pak is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 3 | |
| 2 | A graph placement methodology for fast chip designbreakdown → | 312 |
| 3 | 11 | |
| 4 | 15 | |
| 5 | 9 | |
| 6 | 11 | |
| 7 | 10 | |
| 8 | 24 | |
| 9 | 21 | |
| 10 | 50 | |
| 11 | 18 | |
| 12 | 29 | |
| 13 | 4 | |
| 14 | 4 |
About Jiwoo Pak
Jiwoo Pak is a scholar working on Hardware and Architecture, Electronic, Optical and Magnetic Materials and Electrical and Electronic Engineering, having authored 14 papers that have together received 521 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (11 papers), Copper Interconnects and Reliability (7 papers) and Electronic Packaging and Soldering Technologies (7 papers). The work is most often cited by research in Hardware and Architecture (95 citations), Electrical and Electronic Engineering (369 citations) and Computational Mathematics (3 citations). Jiwoo Pak has collaborated with scholars based in United States and South Korea. Frequent co-authors include David Z. Pan, Sung Kyu Lim, Mohit Pathak, James Laudon, Azalia Mirhoseini, Young‐Joon Lee, Quoc V. Le, E. Tuncer, Eric N. Johnson and Joe Wenjie Jiang. Their work appears in journals such as Nature, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems and International Conference on Computer Aided Design.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.