S. L. Burkett
- Electrical and Electronic Engineering top 5%
- Electronic, Optical and Magnetic Materials top 10%
- Mechanical Engineering top 10%
- Biomedical Engineering
- Atomic and Molecular Physics, and Optics top 10%
- Co-authors
- Ying FengL.W. SchaperZia Ur RahmanSushma KotruStephen E. RussekMark E. BarkeyJohn C. LusthEdward Sazonov
- Topics
- 3D IC and TSV technologies (22 papers)Semiconductor materials and devices (18 papers)Electronic Packaging and Soldering Technologies (15 papers)
- Cited by
- Electrical and Electronic EngineeringElectronic, Optical and Magnetic MaterialsAutomotive Engineering
- Partner nations
- United StatesUnited KingdomChina
In The Last Decade
S. L. Burkett
68 papers receiving 986 citations
Peers
Comparison fields: 5 of 74
- Electrical and Electronic Engineering 688
- Electronic, Optical and Magnetic Materials 207
- Mechanical Engineering 183
- Biomedical Engineering 180
- Atomic and Molecular Physics, and Optics 175
Countries citing papers authored by S. L. Burkett
This map shows the geographic impact of S. L. Burkett's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. L. Burkett with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. L. Burkett more than expected).
Fields of papers citing papers by S. L. Burkett
This network shows the impact of papers produced by S. L. Burkett. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. L. Burkett. The network helps show where S. L. Burkett may publish in the future.
Co-authorship network of co-authors of S. L. Burkett
This figure shows the co-authorship network connecting the top 25 collaborators of S. L. Burkett. A scholar is included among the top collaborators of S. L. Burkett based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with S. L. Burkett. S. L. Burkett is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 3 | |
| 3 | 27 | |
| 4 | 3 | |
| 5 | 41 | |
| 6 | 0 | |
| 7 | 6 | |
| 8 | 7 | |
| 9 | 7 | |
| 10 | 5 | |
| 11 | 24 | |
| 12 | 2 | |
| 13 | 1 | |
| 14 | 24 | |
| 15 | 16 | |
| 16 | 39 | |
| 17 | 2 | |
| 18 | Processing techniques for 3-D integration techniques | 1 |
| 19 | 5 | |
| 20 | 6 |
About S. L. Burkett
S. L. Burkett is a scholar working on Architecture, Media Technology and Electronic, Optical and Magnetic Materials, having authored 74 papers that have together received 1.0k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (22 papers), Semiconductor materials and devices (18 papers) and Electronic Packaging and Soldering Technologies (15 papers). The work is most often cited by research in Electrical and Electronic Engineering (688 citations), Electronic, Optical and Magnetic Materials (207 citations) and Automotive Engineering (77 citations). S. L. Burkett has collaborated with scholars based in United States, United Kingdom and China. Frequent co-authors include Ying Feng, L.W. Schaper, Zia Ur Rahman, Sushma Kotru, Stephen E. Russek, Mark E. Barkey, John C. Lusth, Edward Sazonov, Samit Roy and Li Cai. Their work appears in journals such as Applied Physics Letters, Journal of Applied Physics and Thin Solid Films.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.