S. L. Burkett

1.3k total citations
74 papers, 1.0k citations indexed

About

S. L. Burkett is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering. According to data from OpenAlex, S. L. Burkett has authored 74 papers receiving a total of 1.0k indexed citations (citations by other indexed papers that have themselves been cited), including 43 papers in Electrical and Electronic Engineering, 17 papers in Electronic, Optical and Magnetic Materials and 17 papers in Biomedical Engineering. Recurrent topics in S. L. Burkett's work include 3D IC and TSV technologies (22 papers), Semiconductor materials and devices (18 papers) and Electronic Packaging and Soldering Technologies (15 papers). S. L. Burkett is often cited by papers focused on 3D IC and TSV technologies (22 papers), Semiconductor materials and devices (18 papers) and Electronic Packaging and Soldering Technologies (15 papers). S. L. Burkett collaborates with scholars based in United States, United Kingdom and China. S. L. Burkett's co-authors include Ying Feng, L.W. Schaper, Zia Ur Rahman, Stephen E. Russek, Sushma Kotru, Mark E. Barkey, John C. Lusth, Edward Sazonov, Samit Roy and Li Cai and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Thin Solid Films.

In The Last Decade

S. L. Burkett

68 papers receiving 986 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
S. L. Burkett United States 20 688 207 183 180 175 74 1.0k
Shiwei Feng China 18 609 0.9× 139 0.7× 125 0.7× 207 1.1× 161 0.9× 159 1.1k
Jae‐Eung Oh South Korea 23 446 0.6× 245 1.2× 218 1.2× 358 2.0× 244 1.4× 114 1.4k
Tae Sung Oh South Korea 20 599 0.9× 142 0.7× 223 1.2× 171 0.9× 111 0.6× 76 1.3k
Hamed Haftbaradaran Iran 17 744 1.1× 128 0.6× 160 0.9× 83 0.5× 197 1.1× 33 1.2k
Ping Zhao China 16 612 0.9× 51 0.2× 217 1.2× 181 1.0× 357 2.0× 55 1.0k
Soshu Kirihara Japan 19 386 0.6× 100 0.5× 349 1.9× 271 1.5× 435 2.5× 140 1.2k
H. Walter Germany 21 970 1.4× 171 0.8× 393 2.1× 367 2.0× 128 0.7× 109 1.5k
Seiichi Hata Japan 19 528 0.8× 124 0.6× 613 3.3× 366 2.0× 146 0.8× 148 1.3k
Nety Krishna United States 9 538 0.8× 255 1.2× 109 0.6× 189 1.1× 68 0.4× 18 854
Kyung W. Paik South Korea 17 726 1.1× 150 0.7× 302 1.7× 283 1.6× 43 0.2× 58 1.1k

Countries citing papers authored by S. L. Burkett

Since Specialization
Citations

This map shows the geographic impact of S. L. Burkett's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. L. Burkett with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. L. Burkett more than expected).

Fields of papers citing papers by S. L. Burkett

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by S. L. Burkett. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. L. Burkett. The network helps show where S. L. Burkett may publish in the future.

Co-authorship network of co-authors of S. L. Burkett

This figure shows the co-authorship network connecting the top 25 collaborators of S. L. Burkett. A scholar is included among the top collaborators of S. L. Burkett based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with S. L. Burkett. S. L. Burkett is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Hyslop, W. Brian, et al.. (2024). Solving The Dual Career Dilemma: Three Case Studies. Papers on Engineering Education Repository (American Society for Engineering Education). 4.463.1–4.463.8.
2.
Anderson, Monica, et al.. (2020). Engineering Collaborations With Liberal Arts. 14.544.1–14.544.5. 3 indexed citations
3.
Burkett, S. L., et al.. (2020). Tutorial on forming through-silicon vias. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 38(3). 27 indexed citations
4.
Feng, Ying, et al.. (2017). Process for patterning features in poly(acrylic acid) for microelectronic applications. Journal of Micromechanics and Microengineering. 27(5). 55007–55007. 3 indexed citations
5.
6.
Rao, Madhav, John C. Lusth, & S. L. Burkett. (2015). A Solder Based Self Assembly Project In An Introductory IC Fabrication Course. 6(1). 11–26.
7.
Burkett, S. L., Sushma Kotru, John C. Lusth, Debra Moehle McCallum, & Sarah Dunlap. (2014). Introducing Creativity In A Design Laboratory For A Freshman Level Electrical And Computer Engineering Course. 5(1). 11–26. 7 indexed citations
8.
Rao, Madhav, John C. Lusth, & S. L. Burkett. (2012). Study of solder bridging for the purpose of assembling three-dimensional structures. Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena. 30(3). 7 indexed citations
9.
Liu, Yang, et al.. (2011). Integration of Tantalum Pentoxide Capacitors With Through-Silicon Vias. IEEE Transactions on Components Packaging and Manufacturing Technology. 1(10). 1508–1516. 5 indexed citations
10.
Gordon, Matt, et al.. (2007). Finite Element Analysis of Power Dissipation and Stress in 3-D Stack-Up Geometries. 194–198. 1 indexed citations
11.
Gordon, Matt, et al.. (2007). Optical Emission Spectroscopy in a Reactive Ion Etching System. 189–193. 2 indexed citations
12.
Lam, Timothy T.-Y., Li Cai, S. L. Burkett, et al.. (2006). Copper electroplating to fill blind vias for three-dimensional integration. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 24(4). 1277–1282. 24 indexed citations
13.
Lam, Timothy T.-Y., et al.. (2006). Back side exposure of variable size through silicon vias. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 24(5). 2460–2466. 16 indexed citations
14.
Burkett, S. L., et al.. (2003). Temperature and field dependence of high-frequency magnetic noise in spin valve devices. Applied Physics Letters. 82(1). 91–93. 39 indexed citations
15.
16.
Burkett, S. L., et al.. (2001). Processing techniques for 3-D integration techniques. Superficies y Vacío. 13(13). 1–6. 1 indexed citations
17.
Goodman, Ashley, K. O’Grady, M.R. Parker, & S. L. Burkett. (1999). Hysteresis phenomena in the hard loop of spin-valve structures. Journal of Magnetism and Magnetic Materials. 198-199. 12–14. 5 indexed citations
18.
Sharma, Rahul, et al.. (1998). Study of electrical properties of polymeric materials using electrochemical impedance spectroscopy. Journal of Applied Polymer Science. 68(4). 553–560. 6 indexed citations
19.
Burkett, S. L., et al.. (1997). Effect of corrosion on magnetic properties for FeMn and NiO spin valves. Journal of Applied Physics. 81(8). 4912–4914. 9 indexed citations
20.
Burkett, S. L., et al.. (1996). Effect of silicon processing on giant magnetoresistance. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 14(4). 3131–3135. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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