Tetsu Tanaka

7.0k total citations · 2 hit papers
410 papers, 5.4k citations indexed

About

Tetsu Tanaka is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Tetsu Tanaka has authored 410 papers receiving a total of 5.4k indexed citations (citations by other indexed papers that have themselves been cited), including 299 papers in Electrical and Electronic Engineering, 82 papers in Biomedical Engineering and 63 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Tetsu Tanaka's work include 3D IC and TSV technologies (155 papers), Semiconductor materials and devices (94 papers) and Electronic Packaging and Soldering Technologies (73 papers). Tetsu Tanaka is often cited by papers focused on 3D IC and TSV technologies (155 papers), Semiconductor materials and devices (94 papers) and Electronic Packaging and Soldering Technologies (73 papers). Tetsu Tanaka collaborates with scholars based in Japan, United States and Canada. Tetsu Tanaka's co-authors include Takafumi Fukushima, Mitsumasa Koyanagi, Masahiro Hosoe, M. Miyake, Toshiharu Teranishi, Hiroshi Horie, Ken Suzuki, Y. Tosaka, Y. Arimoto and Kangwook Lee and has published in prestigious journals such as Journal of Geophysical Research Atmospheres, Applied Physics Letters and Journal of Applied Physics.

In The Last Decade

Tetsu Tanaka

382 papers receiving 5.2k citations

Hit Papers

align trajectories

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

Size Control of Monodispersed Pt Nanoparticles and Their 2D Organization by Electrophoretic Deposition

1999 582 citations Tetsu Tanaka et al. profile →
Scaling theory for double-gate SOI MOSFET's

1993 427 citations Tetsu Tanaka, Y. Tosaka et al. IEEE Transactions on Electron Devices profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Tetsu Tanaka Japan	32	3.9k	919	862	640	617	410	5.4k
P.M. Sarro Netherlands	40	4.7k 1.2×	1.7k 1.8×	2.9k 3.3×	394 0.6×	1.8k 2.8×	433	6.9k
Philippe Godignon Spain	28	5.2k 1.3×	1.4k 1.6×	1.8k 2.1×	383 0.6×	1.6k 2.5×	344	7.1k
Linwei Yu China	39	3.5k 0.9×	2.0k 2.2×	2.5k 2.9×	179 0.3×	665 1.1×	205	4.7k
Li Tao China	41	3.9k 1.0×	2.0k 2.2×	1.5k 1.7×	329 0.5×	787 1.3×	197	6.0k
Jinsong Liu China	31	3.1k 0.8×	696 0.8×	583 0.7×	100 0.2×	1.1k 1.8×	265	4.6k
Frank Richter Germany	37	1.5k 0.4×	2.2k 2.4×	532 0.6×	464 0.7×	489 0.8×	212	4.4k
Yong Zhao China	39	3.0k 0.8×	2.0k 2.2×	930 1.1×	409 0.6×	405 0.7×	584	6.6k
Keith A. Williams United States	29	1.3k 0.3×	3.6k 3.9×	1.1k 1.2×	469 0.7×	653 1.1×	96	5.5k
Haidan Wen United States	25	1.2k 0.3×	1.0k 1.1×	382 0.4×	570 0.9×	698 1.1×	84	2.7k
Henri Jansen Netherlands	36	3.1k 0.8×	1.1k 1.2×	3.1k 3.6×	460 0.7×	1.1k 1.8×	145	5.4k

Countries citing papers authored by Tetsu Tanaka

Since Specialization

Citations

This map shows the geographic impact of Tetsu Tanaka's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tetsu Tanaka with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tetsu Tanaka more than expected).

Fields of papers citing papers by Tetsu Tanaka

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Tetsu Tanaka. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tetsu Tanaka. The network helps show where Tetsu Tanaka may publish in the future.

Co-authorship network of co-authors of Tetsu Tanaka

This figure shows the co-authorship network connecting the top 25 collaborators of Tetsu Tanaka. A scholar is included among the top collaborators of Tetsu Tanaka based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tetsu Tanaka. Tetsu Tanaka is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Liu, Chang, et al.. (2024). Bendability enhancement of 3D interconnections with out-of-plane corrugation for flexible hybrid electronics. Japanese Journal of Applied Physics. 63(4). 04SP74–04SP74. 1 indexed citations

Liu, Chang, et al.. (2023). Room-Temperature Direct Cu Semi-Additive Plating (SAP) Bonding for Chip-on-Wafer 3D Heterogenous Integration With μLED. IEEE Electron Device Letters. 44(3). 500–503. 6 indexed citations

Fukushima, Takafumi, et al.. (2022). Direct fabrication of SU‐8 microchannel across an embedded chip for potentiometric bilayer lipid membrane sensor. Electronics and Communications in Japan. 105(2). 1 indexed citations

Kino, Hisashi, et al.. (2022). Electrochemical characterization of ZnO-based transparent materials as recording electrodes for neural probes in optogenetics. Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena. 40(5). 1 indexed citations

Kino, Hisashi, Takafumi Fukushima, & Tetsu Tanaka. (2022). Enhancement of carrier mobility in metal-oxide semiconductor field-effect transistors using negative thermal expansion gate electrodes. Applied Physics Express. 15(11). 111004–111004. 7 indexed citations

Fukushima, Takafumi, et al.. (2020). Significant Die-Shift Reduction and μLED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics. IEEE Transactions on Components Packaging and Manufacturing Technology. 10(8). 1419–1422. 5 indexed citations

Kino, Hisashi, Takafumi Fukushima, & Tetsu Tanaka. (2020). Generation of STDP With Non-Volatile Tunnel-FET Memory for Large-Scale and Low-Power Spiking Neural Networks. IEEE Journal of the Electron Devices Society. 8. 1266–1271. 3 indexed citations

Kino, Hisashi, et al.. (2019). The Effect of Tungsten Volume on Residual Stress and Cell Characteristics in MONOS. IEEE Journal of the Electron Devices Society. 7. 382–387. 3 indexed citations

Toàn, Nguyễn Văn, et al.. (2019). Investigation of the Impact of External Stress on Memory Characteristics by Modifying the Backside of Substrate. IEEE Transactions on Electron Devices. 66(4). 1741–1746. 2 indexed citations

10.

Kino, Hisashi, et al.. (2019). Investigation of TSV Liner Interface With Multiwell Structured TSV to Suppress Noise Propagation in Mixed-Signal 3D-IC. IEEE Journal of the Electron Devices Society. 7. 1225–1231. 4 indexed citations

11.

Chen, Zhiming, et al.. (2018). Development of Eccentric Spin Coating of Polymer Liner for Low-Temperature TSV Technology With Ultra-Fine Diameter. IEEE Electron Device Letters. 40(1). 95–98. 16 indexed citations

12.

Kino, Hisashi, et al.. (2018). The Effect of Mechanical Stress on Cell Characteristics in MONOS Structures. IEEE Transactions on Electron Devices. 65(10). 4313–4319. 5 indexed citations

13.

Kiyoyama, K., et al.. (2016). Design and Evaluation of EIT Measurement System with Square Wave Current Source. The Japan Society of Applied Physics.

14.

Tanaka, Tetsu, et al.. (2011). 3D LSI technology and reliability issues. Symposium on VLSI Technology. 184–185. 2 indexed citations

15.

Koyanagi, Mitsumasa, Takafumi Fukushima, & Tetsu Tanaka. (2009). High-Density Through Silicon Vias for 3-D LSIs : Silicon stacked chips that perform highly-parallel data transfer have been successfully fabricated for image processing, artificial retinas, and for microprocessor and memory testing. Proceedings of the IEEE. 97(1). 49–59. 1 indexed citations

16.

Tanaka, Tetsu, Keigo Sato, Ken Komiya, et al.. (2007). Fully Implantable Retinal Prosthesis Chip with Photodetector and Stimulus Current Generator. 1015–1018. 10 indexed citations

17.

Sugimura, Takeaki, et al.. (2006). Reconfigurable Stacked Memory System for Parallel Image Processing Using Three-Dimensional LSI Technology. 106(317). 43–48. 1 indexed citations

18.

Tanaka, Tetsu, et al.. (1999). High Frequency Characteristics of Dynamic Threshold-Voltage MOSFET (DTMOS) under Ultra-Low Supply Voltage (Special Issue on Ultra-High-Speed IC and LSI Technology). IEICE Transactions on Electronics. 82(3). 538–543. 1 indexed citations

19.

Suzuki, Kunihiro, et al.. (1995). High-Speed and Low-Power n^+-p^+ Double-Gate SOI CMOS. IEICE Transactions on Electronics. 78(4). 360–367. 3 indexed citations

20.

Tanaka, Tetsu, Hiroyoshi Hiratsuka, M Matsumoto, & Tomoko Kawamura. (1976). [Transapical aortic perfusion method with a double-barreled cannula].. PubMed. 29(9). 625–9. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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