John Parry

707 citations

32 papers · 544 indexed · h-index 13

Impact in

Electrical and Electronic Engineering top 10%
- Silicon Carbide Semiconductor Technologies
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
Mechanical Engineering top 10%
- Heat Transfer and Optimization

Papers in

Mechanical Engineering 20
- Heat Transfer and Optimization 17
Electrical and Electronic Engineering 20
- Electronic Packaging and Soldering Technologies 14
- 3D IC and TSV technologies 5
- Silicon Carbide Semiconductor Technologies 5
- Electromagnetic Compatibility and Noise Suppression 4

Co-authors: H.I. Rosten Clemens Lasance Robin Bornoff John P. Wilson Jukka Rantala Péter Szabó M. Rencz Gábor Farkas
Journals: IEEE Transactions on Components and Packaging Technologies (3 papers)Microelectronics Reliability (1 paper)SAE technical papers on CD-ROM/SAE technical paper series (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology Part A (3 papers)Computing & Control Engineering Journal (1 paper)
Partner nations: United Kingdom United States Netherlands

In The Last Decade

John Parry

31 papers receiving 506 citations

Peers

Countries citing papers authored by John Parry

Since Specialization

Citations

This map shows the geographic impact of John Parry's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by John Parry with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites John Parry more than expected).

Fields of papers citing papers by John Parry

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by John Parry. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by John Parry. The network helps show where John Parry may publish in the future.

Co-authorship network

The 25 scholars most cited alongside John Parry, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with John Parry Line = papers co-authored together John Parry links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	Sustainable Immersion Cooling of Servers George R. Simno, John Parry, Robin Bornoff	2024	1
2	Partition-based approach to parametric dynamic compact thermal modeling Microelectronics Reliability ·Lorenzo Codecasa, Vincenzo d’Alessandro, Alessandro Magnani, N. Rinaldi, A. Metzger, Robin Bornoff, John Parry	2017	8
3	Co-design, modelling and simulation challenges: From components to systems C. Bailey, John Parry	2017	2
4	Reliability of Double Side Silver Sintered Devices with various Substrate Metallization Teuvo Heimonen, Laila Dimiyati, O. A. Plunkett, Junot, Gualberto Yamamura, O. Khaselev, 徐金春, Клюева Ксения Валентиновна, Am Siega-Riz, Min Sun, N. Jansen, Yi-Shiou Chiou, Zoltán Sárkány, Bruno Colombo Muller, John Parry	2016	3
5	Novel MOR approach for extracting dynamic compact thermal models with massive numbers of heat sources Lorenzo Codecasa, Alessandro Magnani, Vincenzo d’Alessandro, N. Rinaldi, A. Metzger, Robin Bornoff, John Parry	2016	22
6	An additive design heatsink geometry topology identification and optimisation algorithm Robin Bornoff, John Parry	2015	30
7	Heat sink design optimization using the thermal bottleneck concept Robin Bornoff, Ding Bi-jiao, John Parry	2011	9
8	Thermal Measurement and Modeling of Multi-Die Packages IEEE Transactions on Components and Packaging Technologies ·A. Poppe, Yan Zhang, John P. Wilson, Gábor Farkas, Péter Szabó, John Parry, M. Rencz, Vladimı́r Székely	2009	79
9	DELPHI Style Compact Modeling of Stacked Die Packages A. Poppe, Gábor Farkas, John Parry, Péter Szabó, M. Rencz, Vladimı́r Székely	2007	10
10	Thermal measurement and modeling of multi-die packages arXiv (Cornell University) ·A. Poppe, Varsha Kakatkar, John P. Wilson, Gábor Farkas, Péter Szabó, John Parry	2007	4
11	Solder life prediction in a thermal analysis software environment Greenwich Academic Literature Archive (University of Greenwich) ·S. Robbestad, John Parry, C. Bailey, Hua Lu	2004	7
12	An integrated approach to flow, thermal and mechanical modeling of electronics devices Greenwich Academic Literature Archive (University of Greenwich) ·John Parry, Den Burg, S. Robbestad, C. Bailey, K. Pericleous	2003	3
13	The development of component-level thermal compact models of a C4/CBGA interconnect technology: the Motorola PowerPC 603/sup TM/ and PowerPC 604/sup TM/ RISC microprocessors John Parry, H.I. Rosten, Christine Salva	2002	34
14	Enhanced electronic system reliability - challenges for temperature prediction IEEE Transactions on Components and Packaging Technologies ·John Parry, Jukka Rantala, Clemens Lasance	2002	31
15	Effect of circuit board parameters on thermal performance of electronic components in natural convection cooling 李付春, Deborah Spencer, John Parry, H.I. Rosten	2002	3
16	Multiphysics modelling for electronics design Greenwich Academic Literature Archive (University of Greenwich) ·John Parry, C. Bailey, Syed Imran Haider	2002	15
17	The development of component-level thermal compact models of a C4/CBGA interconnect technology: the Motorola PowerPC 603 and PowerPC 604 RISC microprocessors IEEE Transactions on Components Packaging and Manufacturing Technology Part A ·John Parry, H.I. Rosten, Christine Salva	1998	29
18	The world of thermal characterization according to DELPHI-Part II: Experimental and numerical methods IEEE Transactions on Components Packaging and Manufacturing Technology Part A ·Clemens Lasance, H.I. Rosten, John Parry	1997	63
19	The world of thermal characterization according to DELPHI-Part I: Background to DELPHI IEEE Transactions on Components Packaging and Manufacturing Technology Part A ·H.I. Rosten, Clemens Lasance, John Parry	1997	76
20	Control of Sequential Fuel Injection and Distributorless Ignition for Modern SI Engines SAE technical papers on CD-ROM/SAE technical paper series ·M. L. HEIDINGSFELD, H. F., Wahid Shareef, John Parry, علي بن حسن الشاعر	1993	1

About John Parry

John Parry is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering, Computational Theory and Mathematics, Hardware and Architecture and Computer Graphics and Computer-Aided Design, having authored 32 papers that have together received 544 indexed citations. Recurring topics across this work include Heat Transfer and Optimization (17 papers), Electronic Packaging and Soldering Technologies (14 papers), Thermal properties of materials (5 papers), Advanced Multi-Objective Optimization Algorithms (5 papers), 3D IC and TSV technologies (5 papers), Silicon Carbide Semiconductor Technologies (5 papers), Electromagnetic Compatibility and Noise Suppression (4 papers) and Building Energy and Comfort Optimization (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (364 citations), Mechanical Engineering (227 citations), Statistics, Probability and Uncertainty (29 citations), Statistical and Nonlinear Physics (46 citations) and Condensed Matter Physics (41 citations). John Parry has collaborated with scholars based in United Kingdom, United States and Netherlands. Frequent co-authors include H.I. Rosten, Clemens Lasance, Robin Bornoff, John P. Wilson, Jukka Rantala, Péter Szabó, M. Rencz, Gábor Farkas, Vladimı́r Székely and A. Poppe. Their work appears in journals such as IEEE Transactions on Components and Packaging Technologies, Microelectronics Reliability, SAE technical papers on CD-ROM/SAE technical paper series, IEEE Transactions on Components Packaging and Manufacturing Technology Part A and Computing & Control Engineering Journal.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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