Clemens Lasance
Impact in
- Condensed Matter Physics top 5%
- GaN-based semiconductor devices and materials
-
- Silicon Carbide Semiconductor Technologies
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Semiconductor Lasers and Optical Devices
Papers in
-
- Electronic Packaging and Soldering Technologies 19
- Silicon Carbide Semiconductor Technologies 10
- Semiconductor Lasers and Optical Devices 6
- 3D IC and TSV technologies 5
-
- Heat Transfer and Optimization 17
- Heat Transfer Mechanisms 5
- Co-authors
- A. Poppe (4 shared papers)H.I. Rosten (5 shared papers)John Parry (5 shared papers)Dick den Hertog (1 shared paper)Ronald M. Aarts (3 shared papers)Jukka Rantala (3 shared papers)M. Rencz (1 shared paper)Eric Bosch (1 shared paper)
- Journals
- IEEE Transactions on Components and Packaging Technologies (8 papers)Journal of Electronic Packaging (2 papers)International Journal of Heat and Fluid Flow (1 paper)Heat Transfer Engineering (1 paper)Advanced Materials (1 paper)
- Partner nations
- NetherlandsFinlandHungary
In The Last Decade
Clemens Lasance
51 papers receiving 1.3k citations
Peers
Comparison fields: 5 of 65
- Condensed Matter Physics 183
- Electrical and Electronic Engineering 873
- Mechanical Engineering 505
- Statistics, Probability and Uncertainty 75
- Statistical and Nonlinear Physics 121
Countries citing papers authored by Clemens Lasance
This map shows the geographic impact of Clemens Lasance's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Clemens Lasance with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Clemens Lasance more than expected).
Fields of papers citing papers by Clemens Lasance
This network shows the impact of papers produced by Clemens Lasance. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Clemens Lasance. The network helps show where Clemens Lasance may publish in the future.
Co-authors
The 25 scholars most cited alongside Clemens Lasance, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 52 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2013 | 169 | |
| 2 | 2008 | 92 | |
| 3 | 2002 | 78 | |
| 4 | 1997 | 76 | |
| 5 | 1997 | 63 | |
| 6 | 2001 | 63 | |
| 7 | 1995 | 62 | |
| 8 | 2003 | 60 | |
| 9 | 2009 | 53 | |
| 10 | 2003 | 53 | |
| 11 | 2006 | 48 | |
| 12 | 1997 | 42 | |
| 13 | 2003 | 39 | |
| 14 | 2002 | 37 | |
| 15 | 1997 | 32 | |
| 16 | 2008 | 31 | |
| 17 | 2002 | 31 | |
| 18 | 2003 | 31 | |
| 19 | 2002 | 24 | |
| 20 | 2008 | 24 |
About Clemens Lasance
Clemens Lasance is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry, Mechanics of Materials and Condensed Matter Physics, having authored 52 papers that have together received 1.4k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (19 papers), Thermal properties of materials (17 papers), Heat Transfer and Optimization (17 papers), Silicon Carbide Semiconductor Technologies (10 papers), Semiconductor Lasers and Optical Devices (6 papers), Heat Transfer Mechanisms (5 papers), 3D IC and TSV technologies (5 papers) and GaN-based semiconductor devices and materials (4 papers). The work is most often cited by research in Condensed Matter Physics (183 citations), Electrical and Electronic Engineering (873 citations), Mechanical Engineering (505 citations), Statistics, Probability and Uncertainty (75 citations) and Statistical and Nonlinear Physics (121 citations). Clemens Lasance has collaborated with scholars based in Netherlands, Finland and Hungary. Frequent co-authors include A. Poppe, H.I. Rosten, John Parry, Dick den Hertog, Ronald M. Aarts, Jukka Rantala, M. Rencz, Eric Bosch, Kemal Hanjalić and Th.H. van der Meer. Their work appears in journals such as IEEE Transactions on Components and Packaging Technologies, Journal of Electronic Packaging, International Journal of Heat and Fluid Flow, Heat Transfer Engineering and Advanced Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.