H.I. Rosten

738 total citations
14 papers, 519 citations indexed

About

H.I. Rosten is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, H.I. Rosten has authored 14 papers receiving a total of 519 indexed citations (citations by other indexed papers that have themselves been cited), including 10 papers in Electrical and Electronic Engineering, 9 papers in Mechanical Engineering and 7 papers in Materials Chemistry. Recurrent topics in H.I. Rosten's work include Electronic Packaging and Soldering Technologies (9 papers), Heat Transfer and Optimization (7 papers) and Thermal properties of materials (7 papers). H.I. Rosten is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), Heat Transfer and Optimization (7 papers) and Thermal properties of materials (7 papers). H.I. Rosten collaborates with scholars based in Netherlands, United States and Ireland. H.I. Rosten's co-authors include Clemens Lasance, John Parry, R. Viswanath, Mark Davies, M.R. Malin and W. M. Temmerman and has published in prestigious journals such as International Journal of Heat and Mass Transfer and IEEE Transactions on Components Packaging and Manufacturing Technology Part A.

In The Last Decade

H.I. Rosten

14 papers receiving 474 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
H.I. Rosten Netherlands 11 333 170 83 61 59 14 519
Tamara Bechtold Germany 12 290 0.9× 194 1.1× 89 1.1× 51 0.8× 56 0.9× 75 563
York Christian Gerstenmaier Germany 12 395 1.2× 155 0.9× 24 0.3× 20 0.3× 103 1.7× 31 525
Brian Murphy United States 14 115 0.3× 298 1.8× 19 0.2× 24 0.4× 18 0.3× 49 568
John Parry United Kingdom 13 364 1.1× 227 1.3× 11 0.1× 35 0.6× 65 1.1× 32 544
Yen-Liang Yeh Taiwan 13 122 0.4× 144 0.8× 151 1.8× 40 0.7× 77 1.3× 36 577
Eric Monier-Vinard France 12 218 0.7× 162 1.0× 25 0.3× 26 0.4× 39 0.7× 44 334
František Mach Czechia 10 94 0.3× 175 1.0× 73 0.9× 30 0.5× 12 0.2× 56 300

Countries citing papers authored by H.I. Rosten

Since Specialization
Citations

This map shows the geographic impact of H.I. Rosten's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H.I. Rosten with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H.I. Rosten more than expected).

Fields of papers citing papers by H.I. Rosten

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by H.I. Rosten. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H.I. Rosten. The network helps show where H.I. Rosten may publish in the future.

Co-authorship network of co-authors of H.I. Rosten

This figure shows the co-authorship network connecting the top 25 collaborators of H.I. Rosten. A scholar is included among the top collaborators of H.I. Rosten based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with H.I. Rosten. H.I. Rosten is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

14 of 14 papers shown
2.
Rosten, H.I. & R. Viswanath. (2002). Thermal modelling of the Pentium processor package. 421–428. 23 indexed citations
5.
Lasance, Clemens, et al.. (2002). A novel approach for the thermal characterization of electronic parts. 1–9. 78 indexed citations
6.
Rosten, H.I., et al.. (2002). Development, validation and application of a thermal model of a plastic quad flat pack. 1140–1151. 29 indexed citations
8.
Parry, John, et al.. (1998). The development of component-level thermal compact models of a C4/CBGA interconnect technology: the Motorola PowerPC 603 and PowerPC 604 RISC microprocessors. IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 21(1). 104–112. 29 indexed citations
9.
Lasance, Clemens, H.I. Rosten, & John Parry. (1997). The world of thermal characterization according to DELPHI-Part II: Experimental and numerical methods. IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 20(4). 392–398. 63 indexed citations
10.
Rosten, H.I., Clemens Lasance, & John Parry. (1997). The world of thermal characterization according to DELPHI-Part I: Background to DELPHI. IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 20(4). 384–391. 76 indexed citations
11.
Lasance, Clemens, et al.. (1995). Thermal characterization of electronic devices with boundary condition independent compact models. IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 18(4). 723–731. 62 indexed citations
12.
Malin, M.R. & H.I. Rosten. (1985). APPLICATION OF PHOENICS TO FLOW AROUND SHIPS' HULLS. 7 indexed citations
13.
Rosten, H.I.. (1980). Thermomechanics of magnetic fluids. International Journal of Heat and Mass Transfer. 23(8). 1170–1170. 82 indexed citations
14.
Malin, M.R., et al.. (1979). Three-dimensional computations of flows in centrifugal pumps and compressors. 33–45. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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