Tae-Sung Oh

996 total citations
58 papers, 840 citations indexed

About

Tae-Sung Oh is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Mechanical Engineering. According to data from OpenAlex, Tae-Sung Oh has authored 58 papers receiving a total of 840 indexed citations (citations by other indexed papers that have themselves been cited), including 36 papers in Electrical and Electronic Engineering, 35 papers in Materials Chemistry and 17 papers in Mechanical Engineering. Recurrent topics in Tae-Sung Oh's work include Advanced Thermoelectric Materials and Devices (27 papers), Electronic Packaging and Soldering Technologies (17 papers) and 3D IC and TSV technologies (14 papers). Tae-Sung Oh is often cited by papers focused on Advanced Thermoelectric Materials and Devices (27 papers), Electronic Packaging and Soldering Technologies (17 papers) and 3D IC and TSV technologies (14 papers). Tae-Sung Oh collaborates with scholars based in South Korea, Australia and Japan. Tae-Sung Oh's co-authors include Minyoung Kim, Kwang-Yong Lee, Jaeho Lee, Chunghyun Ryu, Joungho Kim, Young‐Hwan Kim, Seung‐Chul Lee, Sung-Kyu Kim, Minyoung Kim and Jaehwan Kim and has published in prestigious journals such as Journal of The Electrochemical Society, Journal of Materials Science and Scripta Materialia.

In The Last Decade

Tae-Sung Oh

52 papers receiving 799 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Tae-Sung Oh South Korea 16 569 510 198 98 81 58 840
Bushra Jabar China 21 882 1.6× 617 1.2× 275 1.4× 87 0.9× 42 0.5× 38 1.1k
Dongwei Ao China 15 1.0k 1.8× 524 1.0× 317 1.6× 108 1.1× 75 0.9× 38 1.2k
Mohamed Hamid Elsheikh Malaysia 8 770 1.4× 332 0.7× 243 1.2× 76 0.8× 62 0.8× 13 940
Aparporn Sakulkalavek Thailand 15 544 1.0× 249 0.5× 138 0.7× 52 0.5× 40 0.5× 66 609
Rachsak Sakdanuphab Thailand 15 535 0.9× 246 0.5× 138 0.7× 52 0.5× 39 0.5× 62 596
Majid Kabiri Samani Sweden 17 900 1.6× 264 0.5× 218 1.1× 24 0.2× 59 0.7× 30 1.1k
Guangyu Jiang China 13 742 1.3× 268 0.5× 115 0.6× 28 0.3× 38 0.5× 26 919
Hsu-Shen Chu Taiwan 13 1.1k 1.9× 276 0.5× 515 2.6× 171 1.7× 27 0.3× 19 1.2k
Junhao Qiu China 9 374 0.7× 182 0.4× 113 0.6× 30 0.3× 46 0.6× 20 497
Jiangtao Wei China 4 466 0.8× 195 0.4× 99 0.5× 23 0.2× 40 0.5× 10 608

Countries citing papers authored by Tae-Sung Oh

Since Specialization
Citations

This map shows the geographic impact of Tae-Sung Oh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tae-Sung Oh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tae-Sung Oh more than expected).

Fields of papers citing papers by Tae-Sung Oh

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Tae-Sung Oh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tae-Sung Oh. The network helps show where Tae-Sung Oh may publish in the future.

Co-authorship network of co-authors of Tae-Sung Oh

This figure shows the co-authorship network connecting the top 25 collaborators of Tae-Sung Oh. A scholar is included among the top collaborators of Tae-Sung Oh based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tae-Sung Oh. Tae-Sung Oh is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Kim, Jaehwan, et al.. (2016). Thermoelectric Thin Film Devices for Energy Harvesting with the Heat Dissipated from High-Power Light-Emitting Diodes. Journal of Electronic Materials. 45(7). 3410–3417. 6 indexed citations
2.
3.
Kim, Minyoung, et al.. (2014). Processing and warpage evaluation of Package-on-Packages with various epoxy molding compounds. Electronic Materials Letters. 10(2). 467–471. 3 indexed citations
4.
5.
Kim, Minyoung & Tae-Sung Oh. (2012). Thermoelectric Thin Film Device of Cross-Plane Configuration Processed by Electrodeposition and Flip-Chip Bonding. MATERIALS TRANSACTIONS. 53(12). 2160–2165. 29 indexed citations
6.
Kim, Minyoung, Sung-Kyu Kim, & Tae-Sung Oh. (2012). Formation of Through-Silicon-Vias Using Pressure Infiltration of Molten Tin. MATERIALS TRANSACTIONS. 53(10). 1810–1815.
7.
Kim, Minyoung, et al.. (2012). Thermoelectric characteristics of the p-type (Bi0.2Sb0.8)2Te3 nanocomposites processed with SbTe nanowire dispersion. Electronic Materials Letters. 8(3). 269–273. 15 indexed citations
8.
Kim, Minyoung, et al.. (2010). Thermoelectric Properties of Bi-Te Thin Films Processed by Coevaporation. Journal of the Microelectronics and Packaging Society. 17(4). 89–94.
9.
10.
Park, Sun Hee & Tae-Sung Oh. (2008). Contact Resistance of the Flip-Chip Joints Processed with Cu Mushroom Bumps. Journal of the Microelectronics and Packaging Society. 15(3). 9–17. 1 indexed citations
11.
Lee, Kwang-Yong & Tae-Sung Oh. (2007). Thermoelectric Characteristics of the Electroplated Bi-Te Films and Photoresist Process for Fabrication of Micro Thermoelectric Devices. Journal of the Microelectronics and Packaging Society. 14(2). 9–15. 1 indexed citations
12.
Ryu, Chunghyun, Jiwoong Park, Jun So Pak, et al.. (2007). Suppression of Power/Ground Inductive Impedance and Simultaneous Switching Noise Using Silicon Through-Via in a 3-D Stacked Chip Package. IEEE Microwave and Wireless Components Letters. 17(12). 855–857. 10 indexed citations
13.
Park, Sun Hee, et al.. (2006). Surface Roughness of the Electroplated Sn with Variations of Electrodeposition Parameters and Contact Resistance of the Flip-chip-bonded Sn Bumps. Journal of the Microelectronics and Packaging Society. 13(4). 37–43. 1 indexed citations
14.
Ryu, Chunghyun, Daehyun Chung, Jun Ho Lee, et al.. (2006). High frequency electrical circuit model of chip-to-chip vertical via interconnection for 3-D chip stacking package. 151–154. 39 indexed citations
15.
Choi, Jaehoon, et al.. (2005). Contact Resistance of the Chip-on-Glass Bonded 48Sn–52In Solder Joint. MATERIALS TRANSACTIONS. 46(5). 1042–1046. 15 indexed citations
16.
Oh, Tae-Sung, et al.. (2002). Mechanical Properties and Shear Strength of Sn-3.5Ag-Bi Solder Alloys. MATERIALS TRANSACTIONS. 43(8). 1864–1867. 11 indexed citations
17.
18.
Oh, Tae-Sung, et al.. (2000). Adhesion Strength and Peeling Angle Measured on the Polyimide/Cr Interfaces. MRS Proceedings. 629(1). 2 indexed citations
19.
Ha, Heon-Phil, et al.. (1999). 90% Bi2Te3-10% Bi2Se3 단결정의 밴드갭 에너지와 열전특성. Korean Journal of Materials Research. 9(4). 349–354.
20.
Kim, Hee-Jeong, et al.. (1998). Thermoelectric Properties of the Hot-Pressed Bi$_{2}$(Te$_{1-x}$Se$_{ x}$)$_{3}$ Alloys with the $Bi_{2}Se_{3}$ Content. Korean Journal of Materials Research. 8(5). 408–412.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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