H. Knapp
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- Radio Frequency Integrated Circuit Design 119
- Microwave Engineering and Waveguides 56
- Photonic and Optical Devices 51
- Advancements in PLL and VCO Technologies 46
- Electromagnetic Compatibility and Noise Suppression 21
- 3D IC and TSV technologies 12
- Semiconductor materials and devices 11
- Aerospace Engineering top 10%
- Hardware and Architecture top 10%
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- Semiconductor Quantum Structures and Devices 10
- Co-authors
- Klaus AufingerT.F. MeisterJ. BöckM. WurzerArpad L. ScholtzW. SimbürgerH.-D. WohlmuthS. Boguth
- Journals
- IEEE Journal of Solid-State Circuits (8 papers)IEEE Transactions on Microwave Theory and Techniques (6 papers)Electronics Letters (5 papers)
- Partner nations
- GermanyAustriaUnited States
In The Last Decade
H. Knapp
136 papers receiving 1.7k citations
Peers
Comparison fields: 5 of 50
- Electrical and Electronic Engineering 1.7k
- Aerospace Engineering 164
- Biomedical Engineering 236
- Hardware and Architecture 34
- Atomic and Molecular Physics, and Optics 121
Countries citing papers authored by H. Knapp
This map shows the geographic impact of H. Knapp's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. Knapp with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. Knapp more than expected).
Fields of papers citing papers by H. Knapp
This network shows the impact of papers produced by H. Knapp. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. Knapp. The network helps show where H. Knapp may publish in the future.
Co-authorship network
The 25 scholars most cited alongside H. Knapp, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2024 | 1 | |
| 2 | 2023 | 1 | |
| 3 | 2023 | 2 | |
| 4 | 2021 | 13 | |
| 5 | A 122-242 GHz Dynamic Frequency Divider in an Advanced BiCMOS Technology | 2021 | 1 |
| 6 | 2021 | 16 | |
| 7 | 2016 | 8 | |
| 8 | 2015 | 125 | |
| 9 | An 8 bit programmable 18 GHz frequency divider for mm-wave frequency synthesis | 2012 | 5 |
| 10 | 2012 | 3 | |
| 11 | 2011 | 10 | |
| 12 | Comparison of 24 GHz low-noise mixers in CMOS and SiGe:C technologies | 2009 | 13 |
| 13 | 2009 | 0 | |
| 14 | 2009 | 2 | |
| 15 | 2006 | 2 | |
| 16 | 2005 | 30 | |
| 17 | 100-Gb/s 27-1 and 54-Gb/s 2ll-l PRBS Generators in SiGe Bipolar Technology | 2004 | 1 |
| 18 | 2003 | 1 | |
| 19 | 2003 | 3 | |
| 20 | A 15 Gb/s 4:1 parallel–to–serial data multiplexer in 0.12µm CMOS | 2002 | 4 |
About H. Knapp
H. Knapp is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics and Condensed Matter Physics, having authored 139 papers that have together received 1.8k indexed citations. Recurring topics across this work include Radio Frequency Integrated Circuit Design (119 papers), Microwave Engineering and Waveguides (56 papers), Photonic and Optical Devices (51 papers), Advancements in PLL and VCO Technologies (46 papers), Electromagnetic Compatibility and Noise Suppression (21 papers), 3D IC and TSV technologies (12 papers), Semiconductor materials and devices (11 papers) and Semiconductor Quantum Structures and Devices (10 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.7k citations), Aerospace Engineering (164 citations) and Biomedical Engineering (236 citations). H. Knapp has collaborated with scholars based in Germany, Austria and United States. Frequent co-authors include Klaus Aufinger, T.F. Meister, J. Böck, M. Wurzer, Arpad L. Scholtz, W. Simbürger, H.-D. Wohlmuth, S. Boguth, Linus Maurer and Saverio Trotta. Their work appears in journals such as IEEE Journal of Solid-State Circuits, IEEE Transactions on Microwave Theory and Techniques, Electronics Letters, IEEE Microwave and Wireless Components Letters and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.