John G. Bai

1.9k total citations
49 papers, 1.5k citations indexed

About

John G. Bai is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, John G. Bai has authored 49 papers receiving a total of 1.5k indexed citations (citations by other indexed papers that have themselves been cited), including 36 papers in Electrical and Electronic Engineering, 7 papers in Materials Chemistry and 6 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in John G. Bai's work include Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (11 papers) and Semiconductor Lasers and Optical Devices (8 papers). John G. Bai is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (11 papers) and Semiconductor Lasers and Optical Devices (8 papers). John G. Bai collaborates with scholars based in United States and China. John G. Bai's co-authors include Guo‐Quan Lu, Jesus N. Calata, Ziyang Zhang, Zhiye Zhang, J.D. van Wyk, Jian Yin, Xingsheng Liu, Howard A. Kuhn, Thomas G. Lei and D. Viehland and has published in prestigious journals such as Applied Physics Letters, Journal of Power Sources and Chemical Engineering Journal.

In The Last Decade

John G. Bai

40 papers receiving 1.4k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
John G. Bai United States 20 1.3k 551 261 207 154 49 1.5k
Chin C. Lee United States 21 975 0.8× 450 0.8× 245 0.9× 113 0.5× 130 0.8× 94 1.3k
J. Pstruś Poland 25 1.1k 0.9× 1.2k 2.1× 442 1.7× 78 0.4× 96 0.6× 81 1.7k
Paul T. Vianco United States 23 2.1k 1.7× 1.6k 2.9× 270 1.0× 177 0.9× 55 0.4× 133 2.4k
James D. Scofield United States 18 901 0.7× 158 0.3× 234 0.9× 151 0.7× 68 0.4× 76 1.1k
Kejun Zeng United States 17 923 0.7× 725 1.3× 305 1.2× 245 1.2× 40 0.3× 40 1.4k
Joo‐Youl Huh South Korea 22 722 0.6× 382 0.7× 629 2.4× 65 0.3× 110 0.7× 74 1.3k
Z.P. Jin China 22 400 0.3× 897 1.6× 517 2.0× 82 0.4× 128 0.8× 72 1.3k
Haisheng Fang China 17 379 0.3× 186 0.3× 242 0.9× 63 0.3× 168 1.1× 74 862
S. K. Kang United States 23 1.5k 1.2× 821 1.5× 181 0.7× 111 0.5× 62 0.4× 57 1.6k
Albert T. Wu Taiwan 22 998 0.8× 408 0.7× 538 2.1× 282 1.4× 47 0.3× 88 1.3k

Countries citing papers authored by John G. Bai

Since Specialization
Citations

This map shows the geographic impact of John G. Bai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by John G. Bai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites John G. Bai more than expected).

Fields of papers citing papers by John G. Bai

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by John G. Bai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by John G. Bai. The network helps show where John G. Bai may publish in the future.

Co-authorship network of co-authors of John G. Bai

This figure shows the co-authorship network connecting the top 25 collaborators of John G. Bai. A scholar is included among the top collaborators of John G. Bai based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with John G. Bai. John G. Bai is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
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Wang, Dewu, et al.. (2025). Hydrodynamics of a tridimensional rotational flow sieve tray with gas–liquid concurrent downflow under roll motion. Separation and Purification Technology. 364. 132183–132183. 1 indexed citations
3.
Zhang, Jiahe, Gang Jia, Weidong Sun, et al.. (2025). Self-rectifying memristors based on epitaxial AlScN for neuromorphic computing. Applied Physics Letters. 127(4).
4.
Xin, Y., Sitao Zhang, Wei Xu, et al.. (2025). Risk factors for suicidality among college students: A systematic review and meta-analysis. Journal of Affective Disorders. 382. 567–578. 1 indexed citations
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Wang, Xudong, John G. Bai, Jie Fan, et al.. (2025). Analysis of chemical composition, antibacterial activity, antioxidant properties, and cytotoxicity of essential oils from four plant fruits. Microbial Pathogenesis. 209. 108133–108133.
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Xu, Wei, Guangwei Zhang, Qian Liu, et al.. (2025). The effectiveness of art-based interventions among older adults with dementia: A systematic review and meta-analysis. Psychiatry Research. 354. 116781–116781.
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Bai, John G., et al.. (2025). Structure Thermal Domain Size in μm-Thick Single Crystalline Sapphire Wafer Uncovered by Low-Momentum Phonon Scattering. The Journal of Physical Chemistry C. 129(11). 5754–5761. 3 indexed citations
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Bai, John G., et al.. (2024). Exceptional thermal conductivity increase of Nafion by hydrogen-bonded water molecules. Applied Physics Letters. 124(26). 3 indexed citations
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Bai, John G., et al.. (2023). 3D strongly anisotropic intrinsic thermal conductivity of polypropylene separator. Journal of Power Sources. 580. 233377–233377. 12 indexed citations
14.
Bai, John G., et al.. (2017). High Pulse Energy Chirally-Coupled-Core Yb-Doped Fiber Amplifier System. Conference on Lasers and Electro-Optics. JW2A.88–JW2A.88. 5 indexed citations
15.
Bai, John G., Zhigang Chen, Paul O. Leisher, et al.. (2012). High-efficiency kW-class QCW 88x-nm diode semiconductor laser bars with passive cooling. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 8241. 82410W–82410W. 3 indexed citations
16.
Bai, John G., Woon‐Hong Yeo, & Jae-Hyun Chung. (2008). Nanostructured biosensing platform—shadow edge lithography for high-throughput nanofabrication. Lab on a Chip. 9(3). 449–455. 12 indexed citations
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Bai, John G., et al.. (2005). Measurement of Solder/Copper Interfacial Thermal Resistance by the Flash Technique. International Journal of Thermophysics. 26(5). 1607–1615. 26 indexed citations
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Lu, Guo‐Quan, et al.. (2003). Strategies for Improving Reliability of Solder Joints on Power Semiconductor Devices. 247–256. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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