Gary S. May
- Electrical and Electronic Engineering top 10%
- Education top 5%
- Safety Research top 1%
- Media Technology top 1%
- Architecture top 0.2%
- Co-authors
- Daryl E. ChubinEleanor L. BabcoCostas J. SpanosSimon M. SzeMuhannad S. BakirSang Jeen HongApril S. BrownTaesu Cheong
- Topics
- 3D IC and TSV technologies (21 papers)Semiconductor Quantum Structures and Devices (12 papers)Advanced Semiconductor Detectors and Materials (10 papers)
- Partner nations
- United StatesSouth KoreaItaly
In The Last Decade
Gary S. May
72 papers receiving 1.2k citations
Peers
Comparison fields: 5 of 111
- Electrical and Electronic Engineering 412
- Education 337
- Safety Research 313
- Media Technology 261
- Architecture 172
Countries citing papers authored by Gary S. May
This map shows the geographic impact of Gary S. May's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Gary S. May with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Gary S. May more than expected).
Fields of papers citing papers by Gary S. May
This network shows the impact of papers produced by Gary S. May. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Gary S. May. The network helps show where Gary S. May may publish in the future.
Co-authorship network of co-authors of Gary S. May
This figure shows the co-authorship network connecting the top 25 collaborators of Gary S. May. A scholar is included among the top collaborators of Gary S. May based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Gary S. May. Gary S. May is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 4 | |
| 2 | 9 | |
| 3 | 15 | |
| 4 | 11 | |
| 5 | 10 | |
| 6 | 11 | |
| 7 | 9 | |
| 8 | 11 | |
| 9 | Fault Detection, Diagnosis, and Optimization of Wafer Manufacturing Processes utilizing Knowledge Creation | 7 |
| 10 | 40 | |
| 11 | 2 | |
| 12 | 1 | |
| 13 | 4 | |
| 14 | 1 | |
| 15 | 5 | |
| 16 | 240 | |
| 17 | Fundamentals of Semiconductor Fabrication | 103 |
| 18 | 5 | |
| 19 | 7 | |
| 20 | 2 |
About Gary S. May
Gary S. May is a scholar working on Architecture, Electrical and Electronic Engineering and Bioengineering, having authored 74 papers that have together received 1.3k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (21 papers), Semiconductor Quantum Structures and Devices (12 papers) and Advanced Semiconductor Detectors and Materials (10 papers). The work is most often cited by research in Architecture (172 citations), Safety Research (313 citations) and Media Technology (261 citations). Gary S. May has collaborated with scholars based in United States, South Korea and Italy. Frequent co-authors include Daryl E. Chubin, Eleanor L. Babco, Costas J. Spanos, Simon M. Sze, Muhannad S. Bakir, Sang Jeen Hong, April S. Brown, Taesu Cheong, Rebecca Morley and Giovanni Bruno. Their work appears in journals such as Applied Physics Letters, Journal of Applied Physics and ACS Applied Materials & Interfaces.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.