C.C. Lee

1.1k total citations
44 papers, 877 citations indexed

About

C.C. Lee is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics and Mechanical Engineering. According to data from OpenAlex, C.C. Lee has authored 44 papers receiving a total of 877 indexed citations (citations by other indexed papers that have themselves been cited), including 38 papers in Electrical and Electronic Engineering, 11 papers in Atomic and Molecular Physics, and Optics and 11 papers in Mechanical Engineering. Recurrent topics in C.C. Lee's work include Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (21 papers) and Photonic and Optical Devices (6 papers). C.C. Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (21 papers) and Photonic and Optical Devices (6 papers). C.C. Lee collaborates with scholars based in United States, Taiwan and South Korea. C.C. Lee's co-authors include G. Matijasevic, Ricky W. Chuang, Jeong Park, W.W. So, Jungjae Park, C.S. Tsai, Moo Whan Shin, Daewon Kim, Arthur Palisoc and Moo Whan Shin and has published in prestigious journals such as IEEE Transactions on Electron Devices, Journal of Lightwave Technology and IEEE Electron Device Letters.

In The Last Decade

C.C. Lee

42 papers receiving 827 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
C.C. Lee United States 16 738 194 189 186 112 44 877
R. de Reus Netherlands 13 313 0.4× 312 1.6× 91 0.5× 220 1.2× 213 1.9× 33 740
James D. Scofield United States 18 901 1.2× 158 0.8× 151 0.8× 131 0.7× 234 2.1× 76 1.1k
D. P. Seraphim United States 16 364 0.5× 169 0.9× 228 1.2× 177 1.0× 173 1.5× 36 848
R.J. Stierman United States 11 694 0.9× 385 2.0× 150 0.8× 59 0.3× 88 0.8× 20 918
John Osenbach United States 18 742 1.0× 171 0.9× 30 0.2× 100 0.5× 224 2.0× 70 876
Koji Takei Japan 11 402 0.5× 99 0.5× 91 0.5× 124 0.7× 86 0.8× 34 581
Toru Takayama Japan 12 177 0.2× 165 0.9× 77 0.4× 90 0.5× 156 1.4× 37 464
L.J. Masur United States 12 145 0.2× 224 1.2× 348 1.8× 42 0.2× 80 0.7× 25 643
Tae-Hyun Sung South Korea 16 173 0.2× 109 0.6× 403 2.1× 149 0.8× 203 1.8× 55 768
M. Mirzamaani United States 15 101 0.1× 101 0.5× 97 0.5× 421 2.3× 135 1.2× 29 557

Countries citing papers authored by C.C. Lee

Since Specialization
Citations

This map shows the geographic impact of C.C. Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C.C. Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C.C. Lee more than expected).

Fields of papers citing papers by C.C. Lee

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C.C. Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C.C. Lee. The network helps show where C.C. Lee may publish in the future.

Co-authorship network of co-authors of C.C. Lee

This figure shows the co-authorship network connecting the top 25 collaborators of C.C. Lee. A scholar is included among the top collaborators of C.C. Lee based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C.C. Lee. C.C. Lee is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Kim, Hyunki, et al.. (2024). A microstructure-based numerical approach for uniaxial fatigue life-based non-uniaxial fatigue life prediction of hypo-eutectoid steels. Journal of Materials Research and Technology. 34. 785–796. 2 indexed citations
2.
Lee, C.C., et al.. (2012). Temperature measurement of high-density winding coils of electromagnets. IET Science Measurement & Technology. 6(1). 1–5. 5 indexed citations
3.
Lee, C.C., et al.. (2006). Fluxless Bonding of Silicon to Copper with High-temperature Ag-Sn Joint Made at Low Temperature. 8. 1706–1711. 3 indexed citations
4.
Lee, C.C., et al.. (2006). A New Configuration of Nematic Liquid Crystal Thermography With Applications to GaN-Based Devices. IEEE Transactions on Instrumentation and Measurement. 55(1). 273–279. 5 indexed citations
5.
Kim, Jeong Geun, Daewon Kim, & C.C. Lee. (2006). Fluxless Flip-Chip Solder Joint Fabrication Using Electroplated Sn-Rich Sn-Au Structures. IEEE Transactions on Advanced Packaging. 29(3). 473–482. 28 indexed citations
6.
Lee, C.C., et al.. (2005). Millimeter-wave coplanar strip (CPS) line flip chip packaging on PCBs. 2. 1807–1813. 5 indexed citations
7.
Lee, C.C. & Jongsung Kim. (2005). Fundamentals of fluxless soldering technology. 33–38. 14 indexed citations
8.
Lee, C.C. & Jongsung Kim. (2005). Wafer bonding using fluxless process with Sn-rich Sn-Au dual-layer structure. 8. 105–109. 1 indexed citations
9.
Kim, Jongsung, et al.. (2004). Electroplated Sn-Au structures for fabricating fluxless flip-chip Sn-rich solder joints. 26. 1642–1646. 5 indexed citations
10.
Park, Jungjae, Moo Whan Shin, & C.C. Lee. (2004). Thermal Modeling and Measurement of AlGaN–GaN HFETs Built on Sapphire and SiC Substrates. IEEE Transactions on Electron Devices. 51(11). 1753–1759. 43 indexed citations
11.
Park, Jeong, Moo Whan Shin, & C.C. Lee. (2003). Thermal modeling and measurement of GaN-based HFET devices. IEEE Electron Device Letters. 24(7). 424–426. 44 indexed citations
12.
Chuang, Ricky W., et al.. (2002). Fluxless Sn-Bi-Au bonding process using multilayer design. 50. 486–488. 3 indexed citations
13.
Chuang, Ricky W. & C.C. Lee. (2002). Silver-indium joints produced at low temperature for high temperature devices. IEEE Transactions on Components and Packaging Technologies. 25(3). 453–458. 95 indexed citations
14.
Tsai, C.S., Jun Su, & C.C. Lee. (1999). Wideband electronically tunable microwave bandstop filters using iron film-gallium arsenide waveguide structure. IEEE Transactions on Magnetics. 35(5). 3178–3180. 39 indexed citations
15.
Lee, C.C., et al.. (1993). Directly deposited fluxless lead-indium-gold composite solder. IEEE Transactions on Components Hybrids and Manufacturing Technology. 16(8). 789–793. 7 indexed citations
16.
Lee, C.C., et al.. (1992). Temperature solution of five-layer structure with a circular embedded source and its applications. IEEE Transactions on Components Hybrids and Manufacturing Technology. 15(5). 707–714. 18 indexed citations
17.
Lee, C.C., et al.. (1991). A new bonding technology using gold and tin multilayer composite structures. IEEE Transactions on Components Hybrids and Manufacturing Technology. 14(2). 407–412. 109 indexed citations
18.
Lee, C.C. & Arthur Palisoc. (1988). Real-time thermal design of integrated circuit devices. IEEE Transactions on Components Hybrids and Manufacturing Technology. 11(4). 485–492. 25 indexed citations
19.
Li, Q., C.S. Tsai, S. Sottini, & C.C. Lee. (1984). Acoustooptic Interaction in A LiNbO3 Spherical Waveguide. TuB2–TuB2. 2 indexed citations
20.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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