Yanfu Yan

405 total citations
29 papers, 298 citations indexed

About

Yanfu Yan is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Computer Vision and Pattern Recognition. According to data from OpenAlex, Yanfu Yan has authored 29 papers receiving a total of 298 indexed citations (citations by other indexed papers that have themselves been cited), including 17 papers in Mechanical Engineering, 17 papers in Electrical and Electronic Engineering and 5 papers in Computer Vision and Pattern Recognition. Recurrent topics in Yanfu Yan's work include Electronic Packaging and Soldering Technologies (16 papers), Aluminum Alloys Composites Properties (9 papers) and 3D IC and TSV technologies (8 papers). Yanfu Yan is often cited by papers focused on Electronic Packaging and Soldering Technologies (16 papers), Aluminum Alloys Composites Properties (9 papers) and 3D IC and TSV technologies (8 papers). Yanfu Yan collaborates with scholars based in China, United States and Switzerland. Yanfu Yan's co-authors include Yao Shi, Zhidong Xia, Zhi‐Gang Chen, Jian Xue, Guodong Xu, Shuai Li, Tingting Gao, Ke Lü, Yongping Lei and Jiuba Wen and has published in prestigious journals such as Materials, IEEE Transactions on Circuits and Systems for Video Technology and IEEE Transactions on Multimedia.

In The Last Decade

Yanfu Yan

28 papers receiving 292 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Yanfu Yan China 9 213 188 44 41 31 29 298
Ranjit Pandher United States 8 291 1.4× 130 0.7× 54 1.2× 33 0.8× 3 0.1× 25 324
Kuo-Chuan Liu United States 11 333 1.6× 214 1.1× 52 1.2× 22 0.5× 2 0.1× 24 352
Liming Zhao China 7 20 0.1× 282 1.5× 71 1.6× 213 5.2× 30 1.0× 15 366
Tsung-Hsun Tsai Taiwan 10 109 0.5× 185 1.0× 29 0.7× 31 0.8× 21 0.7× 24 340
Young-Doo Jeon South Korea 11 345 1.6× 180 1.0× 10 0.2× 10 0.2× 6 0.2× 18 359
Steve Sprague United States 3 133 0.6× 189 1.0× 16 0.4× 35 0.9× 3 0.1× 5 315
Yoshinori Iguchi Japan 10 264 1.2× 113 0.6× 32 0.7× 28 0.7× 8 0.3× 38 335
Shiyu Zhou China 11 198 0.9× 52 0.3× 14 0.3× 389 9.5× 8 0.3× 19 661
Yon-Kyu Park South Korea 9 78 0.4× 73 0.4× 6 0.1× 9 0.2× 6 0.2× 26 312
Wenmei Huang China 10 136 0.6× 91 0.5× 6 0.1× 17 0.4× 5 0.2× 42 324

Countries citing papers authored by Yanfu Yan

Since Specialization
Citations

This map shows the geographic impact of Yanfu Yan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yanfu Yan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yanfu Yan more than expected).

Fields of papers citing papers by Yanfu Yan

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yanfu Yan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yanfu Yan. The network helps show where Yanfu Yan may publish in the future.

Co-authorship network of co-authors of Yanfu Yan

This figure shows the co-authorship network connecting the top 25 collaborators of Yanfu Yan. A scholar is included among the top collaborators of Yanfu Yan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yanfu Yan. Yanfu Yan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
3.
Yan, Yanfu, et al.. (2024). Enhancing Code Understanding for Impact Analysis by Combining Transformers and Program Dependence Graphs. Proceedings of the ACM on software engineering.. 1(FSE). 972–995. 1 indexed citations
4.
Yan, Yanfu, et al.. (2021). Fine-Grained Categorization From RGB-D Images. IEEE Transactions on Multimedia. 24. 917–928. 2 indexed citations
5.
Xue, Jian, et al.. (2021). Light Attention Embedding for Facial Expression Recognition. IEEE Transactions on Circuits and Systems for Video Technology. 32(4). 1834–1847. 26 indexed citations
6.
Yan, Yanfu, et al.. (2020). The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder. Materials. 13(19). 4443–4443. 24 indexed citations
7.
Wang, Cong, Ke Lü, Jian Xue, & Yanfu Yan. (2020). R-FENet: A Region-based Facial Expression Recognition Method Inspired by Semantic Information of Action Units. 43–51. 2 indexed citations
8.
Lu, Zhi, et al.. (2018). Effects of Pre-Treatments on Bioactivity of High-Purity Titanium. Materials. 11(5). 675–675. 3 indexed citations
9.
Li, Haitao, Yanfu Yan, Guangxin Wang, et al.. (2017). Hydrothermal solvothermal synthesis potassium sodium niobate lead-free piezoelectric ceramics assisted with microwave. Journal of Materials Science Materials in Electronics. 29(1). 746–752. 6 indexed citations
10.
Li, Shuai & Yanfu Yan. (2015). Intermetallic growth study at Sn–3.0Ag–0.5Cu/Cu solder joint interface during different thermal conditions. Journal of Materials Science Materials in Electronics. 26(12). 9470–9477. 18 indexed citations
11.
Shi, Yao, Yanfu Yan, Jianping Liu, et al.. (2010). Constitutive modeling on creep deformation for a SnPb-based composite solder reinforced with microsized Cu particles. Microelectronics Reliability. 50(12). 2020–2025. 7 indexed citations
12.
Ma, Jingling, et al.. (2009). Influence of Mg and Ti on the microstructure and electrochemical performance of aluminum alloy sacrificial anodes. Rare Metals. 28(2). 187–192. 20 indexed citations
13.
Yan, Yanfu. (2009). Effect of content of Cu on wettability and mechanical property of Bi5Sb solder alloy. The Chinese Journal of Nonferrous Metals. 1 indexed citations
14.
Yan, Yanfu, et al.. (2009). Effect of Ag and Ni on the melting point and solderability of SnSbCu solder alloys. International Journal of Minerals Metallurgy and Materials. 16(6). 691–695. 6 indexed citations
15.
Shi, Yao, Yanfu Yan, Jianping Liu, et al.. (2009). Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles. Journal of Electronic Materials. 38(9). 1866–1873. 16 indexed citations
16.
Yan, Yanfu, et al.. (2007). Influence of stress on the creep behavior of Cu particle enhancement SnPb based composite solder joints. Rare Metals. 26(1). 51–55. 5 indexed citations
17.
Yan, Yanfu, et al.. (2006). Creep behavior on Ag particle reinforced SnCu based composite solder joints. Transactions of Nonferrous Metals Society of China. 16(5). 1116–1120. 11 indexed citations
18.
Zhang, Keke, et al.. (2006). Effect of Rare Earths on Microstructure and Properties of Sn2.0Ag0.7CuRE Solder Alloy. 23. 1–4. 2 indexed citations
19.
Yan, Yanfu, Jianping Liu, Yao Shi, & Zhidong Xia. (2004). Study on Cu particles-enhanced SnPb composite solder. Journal of Electronic Materials. 33(3). 218–223. 8 indexed citations
20.
Chen, Zhi‐Gang, Yao Shi, Zhidong Xia, & Yanfu Yan. (2003). Properties of lead-free solder SnAgCu containing minute amounts of rare earth. Journal of Electronic Materials. 32(4). 235–243. 70 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Ranjit Pandher Breakdown of academic impact, for papers by Kuo-Chuan Liu Breakdown of academic impact, for papers by Liming Zhao Breakdown of academic impact, for papers by Tsung-Hsun Tsai Breakdown of academic impact, for papers by Young-Doo Jeon Breakdown of academic impact, for papers by Steve Sprague Breakdown of academic impact, for papers by Yoshinori Iguchi Breakdown of academic impact, for papers by Shiyu Zhou Breakdown of academic impact, for papers by Yon-Kyu Park Breakdown of academic impact, for papers by Wenmei Huang
Rankless by CCL
2026