Petr Veselý

531 total citations
57 papers, 374 citations indexed

About

Petr Veselý is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Automotive Engineering. According to data from OpenAlex, Petr Veselý has authored 57 papers receiving a total of 374 indexed citations (citations by other indexed papers that have themselves been cited), including 35 papers in Electrical and Electronic Engineering, 24 papers in Mechanical Engineering and 16 papers in Automotive Engineering. Recurrent topics in Petr Veselý's work include Electronic Packaging and Soldering Technologies (30 papers), Additive Manufacturing and 3D Printing Technologies (16 papers) and 3D IC and TSV technologies (15 papers). Petr Veselý is often cited by papers focused on Electronic Packaging and Soldering Technologies (30 papers), Additive Manufacturing and 3D Printing Technologies (16 papers) and 3D IC and TSV technologies (15 papers). Petr Veselý collaborates with scholars based in Czechia, Hungary and United States. Petr Veselý's co-authors include Karel Dušek, David Bušek, Tomáš Tichý, Jaroslav Kučera, J. Jančář, Attila Géczy, Olivér Krammer, Pavel Mach, Josef Sedláček and Josef Jančář and has published in prestigious journals such as SHILAP Revista de lepidopterología, Journal of Chromatography A and Journal of Materials Science.

In The Last Decade

Petr Veselý

51 papers receiving 357 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Petr Veselý Czechia 12 184 96 85 78 50 57 374
Haoyu Chen China 11 227 1.2× 118 1.2× 147 1.7× 64 0.8× 93 1.9× 26 543
Ning Feng China 11 275 1.5× 117 1.2× 153 1.8× 46 0.6× 41 0.8× 28 470
V. G. Nazarov Russia 13 80 0.4× 146 1.5× 100 1.2× 203 2.6× 75 1.5× 105 542
Pratik Koirala United States 8 79 0.4× 236 2.5× 167 2.0× 92 1.2× 43 0.9× 22 461
Zhenyu Lei China 12 62 0.3× 40 0.4× 238 2.8× 53 0.7× 98 2.0× 48 531
M. Gardon Spain 11 171 0.9× 68 0.7× 155 1.8× 129 1.7× 159 3.2× 15 488
Carla I. Martins Portugal 13 89 0.5× 78 0.8× 258 3.0× 56 0.7× 75 1.5× 39 582
Rut Benavente Spain 15 89 0.5× 55 0.6× 213 2.5× 62 0.8× 205 4.1× 36 524
Shirley Savetlana Indonesia 7 80 0.4× 37 0.4× 135 1.6× 75 1.0× 24 0.5× 25 333

Countries citing papers authored by Petr Veselý

Since Specialization
Citations

This map shows the geographic impact of Petr Veselý's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Petr Veselý with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Petr Veselý more than expected).

Fields of papers citing papers by Petr Veselý

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Petr Veselý. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Petr Veselý. The network helps show where Petr Veselý may publish in the future.

Co-authorship network of co-authors of Petr Veselý

This figure shows the co-authorship network connecting the top 25 collaborators of Petr Veselý. A scholar is included among the top collaborators of Petr Veselý based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Petr Veselý. Petr Veselý is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Dušek, Karel, et al.. (2024). Biodegradable Substrates for Rigid and Flexible Circuit Boards: A Review. Advanced Sustainable Systems. 9(1). 15 indexed citations
2.
Veselý, Petr, et al.. (2024). Electrochemical Migration Resistance of Gold Surface Finishes. 1–5. 1 indexed citations
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Veselý, Petr, et al.. (2024). SnAgCu Solder Joint Microstructure Evolution During Thermal Aging: Influence of Flux. Advanced Engineering Materials. 26(23). 1 indexed citations
6.
Veselý, Petr, et al.. (2024). Influence of Solder Mask on Electrochemical Migration on Printed Circuit Boards. Materials. 17(17). 4242–4242. 2 indexed citations
7.
Pop‐Georgievski, Ognen, et al.. (2024). Wettability in lead-free soldering: Effect of plasma treatment in dependence on flux type. Applied Surface Science. 668. 160447–160447. 3 indexed citations
8.
Veselý, Petr, et al.. (2023). Application of solid-phase microextraction arrows for characterizing volatile organic compounds from 3D printing of acrylonitrile-styrene-acrylate filament. Journal of Chromatography A. 1705. 464180–464180. 3 indexed citations
9.
Veselý, Petr, et al.. (2023). Analysis of solder mask roughness and stencil shape influence on void formation in solder joints. Welding in the World. 67(5). 1347–1355. 10 indexed citations
10.
Veselý, Petr, et al.. (2023). Dielectric spectroscopy of PETG/TiO 2 composite intended for 3D printing. Virtual and Physical Prototyping. 18(1). 14 indexed citations
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12.
Veselý, Petr, et al.. (2022). Electrochemical Migration Issues Related to Improper Solder Mask Application. 1–6. 2 indexed citations
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Dušek, Karel, et al.. (2021). Investigation of Impacts on Printed Circuit Board Laminated Composites Caused by Surface Finish Application. Polymers. 13(19). 3203–3203. 4 indexed citations
15.
Veselý, Petr, et al.. (2021). Evaluation of Anisotropy of Additively Manufactured Structures. 1–6. 3 indexed citations
16.
Veselý, Petr, et al.. (2020). Study of Voids Inside Solder Joints Based on SAC305 Solder Paste with Different Properties. 1–5. 3 indexed citations
17.
Ctibor, Pavel, et al.. (2020). Dielectric Properties of Lithium Silicate Fired by Spark Plasma Sintering. ECS Journal of Solid State Science and Technology. 9(7). 73003–73003.
18.
Dušek, Karel, et al.. (2020). Analysis of a failure in a molded package caused by electrochemical migration. Engineering Failure Analysis. 121. 105128–105128. 7 indexed citations
19.
Veselý, Petr, et al.. (2019). Evaluation of Bismuth/Tin Solder Intermetallic Layers Based on Heating Factor. 1–6. 7 indexed citations
20.
Veselý, Petr, et al.. (1970). SOME CHEMICAL AND ANALYTICAL PROBLEMS CONNECTED WITH /sup 99m/Tc GENERATORS.. OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information). 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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