C. Fuchs

726 total citations
9 papers, 70 citations indexed

About

C. Fuchs is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, C. Fuchs has authored 9 papers receiving a total of 70 indexed citations (citations by other indexed papers that have themselves been cited), including 8 papers in Electrical and Electronic Engineering, 4 papers in Biomedical Engineering and 2 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in C. Fuchs's work include 3D IC and TSV technologies (6 papers), Electronic Packaging and Soldering Technologies (5 papers) and Electromagnetic Compatibility and Noise Suppression (3 papers). C. Fuchs is often cited by papers focused on 3D IC and TSV technologies (6 papers), Electronic Packaging and Soldering Technologies (5 papers) and Electromagnetic Compatibility and Noise Suppression (3 papers). C. Fuchs collaborates with scholars based in France, Switzerland and Czechia. C. Fuchs's co-authors include A. Farcy, N. Sillon, Jean Charbonnier, P. Ancey, B. Fléchet, C. Bermond, Pierre Vincent, J. Casanueva Diaz, G. Parat and M. Clément and has published in prestigious journals such as Microelectronic Engineering, ECS Transactions and HAL (Le Centre pour la Communication Scientifique Directe).

In The Last Decade

C. Fuchs

9 papers receiving 68 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
C. Fuchs France	6	67	14	13	7	5	9	70
D. Henry France	5	61 0.9×	13 0.9×	16 1.2×	5 0.7×	5 1.0×	7	72
C. Weintraub United States	6	101 1.5×	11 0.8×	6 0.5×	4 0.6×		13	107
H. Ishino Japan	3	36 0.5×	10 0.7×	5 0.4×	17 2.4×	2 0.4×	5	48
D. Coolbaugh United States	6	117 1.7×	11 0.8×	8 0.6×	13 1.9×		12	117
D. Schepis United States	9	166 2.5×	12 0.9×	18 1.4×	4 0.6×		16	171
Sam Holt United Kingdom	2	115 1.7×	7 0.5×	16 1.2×	3 0.4×		2	123
S. M. Jang Taiwan	4	65 1.0×	14 1.0×	12 0.9×	10 1.4×		6	68
M. Inoue Japan	5	69 1.0×	13 0.9×	9 0.7×	7 1.0×		12	85
Tatsuhiro Otsuka South Korea	5	31 0.5×	19 1.4×	11 0.8×	5 0.7×		10	46
A. Margain France	4	73 1.1×	8 0.6×	9 0.7×	2 0.3×		6	78

Countries citing papers authored by C. Fuchs

Since Specialization

Citations

This map shows the geographic impact of C. Fuchs's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. Fuchs with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. Fuchs more than expected).

Fields of papers citing papers by C. Fuchs

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C. Fuchs. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. Fuchs. The network helps show where C. Fuchs may publish in the future.

Co-authorship network of co-authors of C. Fuchs

This figure shows the co-authorship network connecting the top 25 collaborators of C. Fuchs. A scholar is included among the top collaborators of C. Fuchs based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C. Fuchs. C. Fuchs is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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9 of 9 papers shown

1.

Lacrevaz, T., C. Bermond, Jean Charbonnier, et al.. (2012). Refined but handy electrical models of TSV usable from low to high density and for RF or fast digital signals in 3D-IC. 4. 1858–1865. 1 indexed citations

2.

Coudrain, P., et al.. (2011). A silicon platform with Through-silicon vias for heterogeneous RF 3D modules. 1173–1176. 8 indexed citations

3.

Lacrevaz, T., Jean Charbonnier, C. Fuchs, et al.. (2011). Extraction of equivalent high frequency models for TSV and RDL interconnects embedded in stacks of the 3D integration technology. 19. 61–64. 6 indexed citations

4.

Reinhardt, Alexandre, C. Fuchs, M. Clément, et al.. (2011). Multiple frequency Solidly Mounted BAW filters. UPM Digital Archive (Technical University of Madrid). 1–5. 4 indexed citations

5.

Fuchs, C., J. Casanueva Diaz, Pierre Vincent, et al.. (2011). Process and RF modelling of TSV last approach for 3D RF interposer. 1–3. 14 indexed citations

6.

Fuchs, C., Patrick Leduc, Aurélie Thuaire, et al.. (2010). Integration and Frequency Dependent Parametric Modeling of Through Silicon via Involved in High Density 3D Chip Stacking. ECS Transactions. 33(12). 1–21. 9 indexed citations

7.

Bermond, C., C. Fuchs, A. Farcy, et al.. (2009). RF characterization and modelling of high density Through Silicon Vias for 3D chip stacking. Microelectronic Engineering. 87(3). 491–495. 19 indexed citations

8.

Bonnet, D., David Brasse, C. Colledani, et al.. (2008). IMOTEPD: a low-jitter 16 channels time to digital converter based on delay locked loop for small animal PET imaging applications. HAL (Le Centre pour la Communication Scientifique Directe). 2 indexed citations

9.

Vincent, Pierre, et al.. (2008). A 1V 220MHz-Tuning-Range 2.2GHz VCO Using a BAW Resonator. 478–629. 7 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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