Immediate Impact
5 standout
Citing Papers
Determination of gradient residual stress for elastoplastic materials by nanoindentation
2023 Standout
Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management
2021 Standout
Works of Jong‐Kai Lin being referenced
Tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps
2004
Characterization of lead-free solders and under bump metallurgies for flip-chip package
2002
Author Peers
| Author | Last Decade | Papers | Cites | ||||
|---|---|---|---|---|---|---|---|
| Jong‐Kai Lin | 147 | 94 | 7 | 15 | 12 | 156 | |
| Anthony Primavera | 146 | 94 | 7 | 34 | 8 | 180 | |
| Yasumitsu Orii | 148 | 74 | 16 | 9 | 22 | 164 | |
| Kuo-Chuan Liu | 212 | 154 | 4 | 13 | 12 | 228 | |
| Ning-Cheng Lee | 221 | 174 | 3 | 16 | 20 | 230 | |
| Young-Doo Jeon | 192 | 100 | 18 | 20 | 10 | 202 | |
| Chaoran Yang | 106 | 74 | 3 | 20 | 24 | 124 | |
| Ivy Qin | 93 | 62 | 13 | 13 | 12 | 126 | |
| E. Zakel | 108 | 36 | 12 | 26 | 16 | 120 | |
| Paresh Limaye | 152 | 96 | 16 | 41 | 11 | 185 | |
| Hun Shen Ng | 206 | 49 | 5 | 51 | 9 | 212 |
All Works
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