Yan‐Cheong Chan

461 total citations
20 papers, 379 citations indexed

About

Yan‐Cheong Chan is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Media Technology. According to data from OpenAlex, Yan‐Cheong Chan has authored 20 papers receiving a total of 379 indexed citations (citations by other indexed papers that have themselves been cited), including 16 papers in Electrical and Electronic Engineering, 8 papers in Electronic, Optical and Magnetic Materials and 5 papers in Media Technology. Recurrent topics in Yan‐Cheong Chan's work include Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (9 papers) and Copper Interconnects and Reliability (8 papers). Yan‐Cheong Chan is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (9 papers) and Copper Interconnects and Reliability (8 papers). Yan‐Cheong Chan collaborates with scholars based in Hong Kong, China and Finland. Yan‐Cheong Chan's co-authors include Ze Zhu, Fengshun Wu, Yi Li, Shafiq Ismathullakhan, Ning‐Bew Wong, Lauri Sydänheimo, Rebecca Cheung, Chee Lip Gan, Leena Ukkonen and Toni Björninen and has published in prestigious journals such as Materials Science and Engineering A, Japanese Journal of Applied Physics and IEEE Antennas and Wireless Propagation Letters.

In The Last Decade

Yan‐Cheong Chan

19 papers receiving 359 citations

Peers

Countries citing papers authored by Yan‐Cheong Chan

Since Specialization

Citations

This map shows the geographic impact of Yan‐Cheong Chan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yan‐Cheong Chan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yan‐Cheong Chan more than expected).

Fields of papers citing papers by Yan‐Cheong Chan

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yan‐Cheong Chan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yan‐Cheong Chan. The network helps show where Yan‐Cheong Chan may publish in the future.

Co-authorship network of co-authors of Yan‐Cheong Chan

This figure shows the co-authorship network connecting the top 25 collaborators of Yan‐Cheong Chan. A scholar is included among the top collaborators of Yan‐Cheong Chan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yan‐Cheong Chan. Yan‐Cheong Chan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing 2018 ·Microelectronics Reliability ·Ze Zhu, Yan‐Cheong Chan, Fengshun Wu	14
2	Effect of alternating current (AC) stressing on the microstructure and mechanical properties of low-silver content solder interconnect 2018 ·Microelectronics Reliability ·Ze Zhu, Yan‐Cheong Chan, Fengshun Wu	15
3	Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder 2018 ·Materials Science and Engineering A ·Ze Zhu, Yan‐Cheong Chan, Zhong Chen, Chee Lip Gan, Fengshun Wu	53
4	Review on test vehicles for electromigration (EM) study in solder interconnects 2017 ·Ze Zhu, Yan‐Cheong Chan, Fengshun Wu, Chee Lip Gan, Zhong Chen	1
5	Reliability of wearable electronics — Case of water proof tests on smartwatch 2017 ·(unknown), Ze Zhu, Yan‐Cheong Chan	6
6	Enhanced electromigration (EM) reliability of Sn58Bi solder due to the incorporation of ZrO<inf>2</inf> nanoparticles 2016 ·Ze Zhu, Yi Li, (unknown), Yan‐Cheong Chan	1
7	Comparative study of the microstructure and mechanical strength of tin-copper (Sn0.7Cu) solder modified with silver (Ag) by both alloying and doping methods 2016 ·Journal of Materials Science Materials in Electronics ·Ze Zhu, Huayu Sun, Fengshun Wu, Yan‐Cheong Chan	11
8	Implementation and wireless readout of passive UHF RFID strain sensor tags based on electro-textile antennas 2015 ·European Conference on Antennas and Propagation ·(unknown), Xiaodong Zhang, Toni Björninen, Johanna Virkki, Lauri Sydänheimo, Yan‐Cheong Chan, Leena Ukkonen	35
9	Effect of nano Al2O3 particles doping on electromigration and mechanical properties of Sn–58Bi solder joints 2015 ·Microelectronics Reliability ·(unknown), Yi Li, Yan‐Cheong Chan, (unknown)	53
10	Electromigration study of SnCu0.7 solder joints with Ag added by different methods 2015 ·Ze Zhu, Huayu Sun, Yan‐Cheong Chan, Fengshun Wu	2
11	Effects of ZrO₂ nanoparticles on the mechanical properties of Sn₄₂Bi₅₈ solder joint 2015 ·Ze Zhu, Yan‐Cheong Chan, Fengshun Wu	6
12	Brush-painted silver UHF RFID tags on environmental-friendly and flexible substrates 2015 ·(unknown), Johanna Virkki, Lauri Sydänheimo, Leena Ukkonen, Yan‐Cheong Chan	1
13	Impact of antenna-fiber alignment and recurrent stretching on the performance of passive UHF RFID tags based on textile antennas 2014 ·Xiao Dong Zhang, (unknown), Johanna Virkki, Toni Björninen, Sari Merilampi, Lauri Sydänheimo, Yan‐Cheong Chan, Leena Ukkonen	1
14	Experimental Study on the Washing Durability of Electro-Textile UHF RFID Tags 2014 ·IEEE Antennas and Wireless Propagation Letters ·Yan Fu, (unknown), (unknown), Yan‐Cheong Chan, Johanna Virkki, Toni Björninen, Lauri Sydänheimo, Leena Ukkonen	47
15	Modeling Electromigration for Microelectronics Design 2013 ·Greenwich Academic Literature Archive (University of Greenwich) ·Zhu Xiao, Hiren R. Kotadia, Sha Xu, Hua Lu, S.H. Mannan, C. Bailey, Yan‐Cheong Chan	2
16	Enhanced electromigration reliability via Ag nanoparticles modified eutectic Sn–58Bi solder joint 2012 ·Microsystem Technologies ·Shafiq Ismathullakhan, (unknown), Yan‐Cheong Chan	32
17	Efficient field emission and optical properties of In-doped cadmium sulphide nanopens and nanopencils 2011 ·Micro & Nano Letters ·Shafiq Ismathullakhan, Yan‐Cheong Chan	2
18	Surfactant‐assisted processing of polyimide/multiwall carbon nanotube nanocomposites for microelectronics applications 2010 ·Polymer International ·Qi Tang, Yan‐Cheong Chan, Ning‐Bew Wong, Rebecca Cheung	45
19	Moisture effects on the reliability of ACF interconnections 2005 ·Chunyan Yin, Hua Lu, C. Bailey, Yan‐Cheong Chan	0
20	Improved Time-of-Flight Technique for Measuring Carrier Mobility in Thin Films of Organic Electroluminescent Materials 2000 ·Japanese Journal of Applied Physics ·Baijun Chen, Chun‐Sing Lee, Shuit‐Tong Lee, (unknown), Yan‐Cheong Chan, W.A. Gambling, He Tian, Weihong Zhu	52

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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