Tomohito Iwashige

519 total citations
17 papers, 427 citations indexed

About

Tomohito Iwashige is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Tomohito Iwashige has authored 17 papers receiving a total of 427 indexed citations (citations by other indexed papers that have themselves been cited), including 15 papers in Electrical and Electronic Engineering, 13 papers in Mechanical Engineering and 3 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Tomohito Iwashige's work include Electronic Packaging and Soldering Technologies (15 papers), Aluminum Alloys Composites Properties (8 papers) and 3D IC and TSV technologies (5 papers). Tomohito Iwashige is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), Aluminum Alloys Composites Properties (8 papers) and 3D IC and TSV technologies (5 papers). Tomohito Iwashige collaborates with scholars based in Japan. Tomohito Iwashige's co-authors include Katsuaki Suganuma, Chuantong Chen, Kazuhiro Tsuruta, Kazuhiko Sugiura, Shijo Nagao, Tohru Sugahara, Hao Zhang, Jinting Jiu, Tsuyoshi Funaki and Yumi Matsumiya and has published in prestigious journals such as Applied Physics Letters, Macromolecules and Acta Materialia.

In The Last Decade

Tomohito Iwashige

17 papers receiving 417 citations

Peers

Tomohito Iwashige

EEE

EOMM

Kazuhiko Sugiura Japan

Vemal Raja Manikam Malaysia

Thomas G. Lei United States

Wan Fahmin Faiz Wan Ali Malaysia

Zou Guisheng China

J. K. Shang United States

Kyung Deuk Min South Korea

Mohammed Salah Egypt

Weizhong Liang China

B. Mondal India

Kazuhiko Sugiura Japan

Tomohito Iwashige

454 ×1.3

EEE

319 ×1.2

69 ×1.2

EOMM

51 ×1.1

60 ×1.3

Citations per year, relative to Tomohito Iwashige Tomohito Iwashige (= 1×) peers Kazuhiko Sugiura

Countries citing papers authored by Tomohito Iwashige

Since Specialization

Citations

This map shows the geographic impact of Tomohito Iwashige's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tomohito Iwashige with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tomohito Iwashige more than expected).

Fields of papers citing papers by Tomohito Iwashige

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Tomohito Iwashige. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tomohito Iwashige. The network helps show where Tomohito Iwashige may publish in the future.

Co-authorship network of co-authors of Tomohito Iwashige

This figure shows the co-authorship network connecting the top 25 collaborators of Tomohito Iwashige. A scholar is included among the top collaborators of Tomohito Iwashige based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tomohito Iwashige. Tomohito Iwashige is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

17 of 17 papers shown

Sugiura, Kazuhiko, Tomohito Iwashige, Kazuhiro Tsuruta, et al.. (2019). In situ TEM observation of sintered Ag die-attach layer with added tungsten carbide particles while heating to high temperature. Japanese Journal of Applied Physics. 58(10). 100910–100910. 1 indexed citations

Iwashige, Tomohito, Takeshi Endo, Kazuhiko Sugiura, et al.. (2019). Effect of annealing Co-W-P metallization substrate onto its resin adhesion. Journal of Materials Science Materials in Electronics. 30(14). 13247–13257. 1 indexed citations

Sugiura, Kazuhiko, Tomohito Iwashige, Kazuhiro Tsuruta, et al.. (2019). Thermal stability improvement of sintered Ag die-attach materials by addition of transition metal compound particles. Applied Physics Letters. 114(16). 14 indexed citations

Iwashige, Tomohito, Takeshi Endo, Kazuhiko Sugiura, et al.. (2019). CoW metallization for high strength bonding to both sintered Ag joints and encapsulation resins. Journal of Materials Science Materials in Electronics. 30(12). 11151–11163. 8 indexed citations

Iwashige, Tomohito, Takeshi Endo, Kazuhiko Sugiura, et al.. (2019). Effect of W content in Co-W-P metallization on both oxidation resistance and resin adhesion. Journal of Materials Science. 55(2). 644–659. 2 indexed citations

Sugiura, Kazuhiko, Tomohito Iwashige, Kazuhiro Tsuruta, et al.. (2019). Reliability Evaluation of SiC Power Module With Sintered Ag Die Attach and Stress-Relaxation Structure. IEEE Transactions on Components Packaging and Manufacturing Technology. 9(4). 609–615. 56 indexed citations

Iwashige, Tomohito, Kazuhiko Sugiura, Takeshi Endo, et al.. (2018). Metallization technology of SiC power module in high temperature operation. 371–374. 1 indexed citations

Sugiura, Kazuhiko, Tomohito Iwashige, Jun Kawai, et al.. (2017). Prominent interface structure and bonding material of power module for high temperature operation. 491–494. 6 indexed citations

Chen, Chuantong, Shijo Nagao, Tohru Sugahara, et al.. (2017). Effect of size and shape of Ag particles for mechanical properties of sintered Ag joints evaluated by micro-compression test. 130–134. 6 indexed citations

10.

Chen, Chuantong, Katsuaki Suganuma, Tomohito Iwashige, Kazuhiko Sugiura, & Kazuhiro Tsuruta. (2017). High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates. Journal of Materials Science Materials in Electronics. 29(3). 1785–1797. 94 indexed citations

11.

Chen, Chuantong, Shijo Nagao, Katsuaki Suganuma, et al.. (2017). Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices. Acta Materialia. 129. 41–51. 88 indexed citations

12.

Sugiura, Kazuhiko, Tomohito Iwashige, Kazuhiro Tsuruta, et al.. (2017). First failure point of a SiC power module with sintered Ag die-attach on reliability tests. 97–100. 7 indexed citations

13.

Chen, Chuantong, Shijo Nagao, Hao Zhang, et al.. (2016). Low-Stress Design for SiC Power Modules with Sintered Porous Ag Interconnection. 2058–2062. 11 indexed citations

14.

Chen, Chuantong, Shijo Nagao, Hao Zhang, et al.. (2016). Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design. Journal of Electronic Materials. 46(3). 1576–1586. 75 indexed citations

15.

Chen, Chuantong, Shijo Nagao, Katsuaki Suganuma, et al.. (2016). Self-healing of cracks in Ag joining layer for die-attachment in power devices. Applied Physics Letters. 109(9). 39 indexed citations

16.

Shishido, Tetsuya, et al.. (2010). Synthesis and Catalytic Performance of Organic–Inorganic Hybrid Mesoporous Material Having Basic Nanospace. Catalysis Letters. 140(3-4). 121–126. 3 indexed citations

17.

Matsumiya, Yumi, Tadashi Inoue, Tomohito Iwashige, & Hiroshi Watanabe. (2009). Dielectric Relaxation of Polymer/Carbon Dioxide Systems. Macromolecules. 42(13). 4712–4718. 15 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact