I. Charles Ume

1.4k total citations
106 papers, 1.1k citations indexed

About

I. Charles Ume is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, I. Charles Ume has authored 106 papers receiving a total of 1.1k indexed citations (citations by other indexed papers that have themselves been cited), including 67 papers in Electrical and Electronic Engineering, 47 papers in Mechanics of Materials and 46 papers in Mechanical Engineering. Recurrent topics in I. Charles Ume's work include Electronic Packaging and Soldering Technologies (55 papers), Ultrasonics and Acoustic Wave Propagation (35 papers) and 3D IC and TSV technologies (31 papers). I. Charles Ume is often cited by papers focused on Electronic Packaging and Soldering Technologies (55 papers), Ultrasonics and Acoustic Wave Propagation (35 papers) and 3D IC and TSV technologies (31 papers). I. Charles Ume collaborates with scholars based in United States and Germany. I. Charles Ume's co-authors include Sheng Liu, Hai Ding, Jin Yang, George Graham, Lizheng Zhang, David L. McDowell, Yarom Polsky, Lei Yang, Jie Gong and Sung-Bum Kang and has published in prestigious journals such as The Journal of the Acoustical Society of America, The International Journal of Advanced Manufacturing Technology and IEEE Transactions on Instrumentation and Measurement.

In The Last Decade

I. Charles Ume

103 papers receiving 1.1k citations

Peers

I. Charles Ume
Zhenzhi He China
Sehun Rhee South Korea
Chih-Chun Cheng Taiwan
G.L. Samuel India
C. R. Liu United States
Jun-Hyub Park South Korea
Kai Zhong China
Qingchang Tan China
Changcai Cui China
Hongkun Wu China
Zhenzhi He China
I. Charles Ume
Citations per year, relative to I. Charles Ume I. Charles Ume (= 1×) peers Zhenzhi He

Countries citing papers authored by I. Charles Ume

Since Specialization
Citations

This map shows the geographic impact of I. Charles Ume's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by I. Charles Ume with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites I. Charles Ume more than expected).

Fields of papers citing papers by I. Charles Ume

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by I. Charles Ume. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by I. Charles Ume. The network helps show where I. Charles Ume may publish in the future.

Co-authorship network of co-authors of I. Charles Ume

This figure shows the co-authorship network connecting the top 25 collaborators of I. Charles Ume. A scholar is included among the top collaborators of I. Charles Ume based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with I. Charles Ume. I. Charles Ume is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Ume, I. Charles, et al.. (2021). Evaluation of the Quality of BGA Solder Balls in FCBGA Packages Subjected to Thermal Cycling Reliability Test Using Laser Ultrasonic Inspection Technique. IEEE Transactions on Components Packaging and Manufacturing Technology. 11(4). 589–597. 11 indexed citations
2.
Ume, I. Charles, et al.. (2019). Evaluation of FCBGA Package Subjected to Four-Point Bend Reliability Test Using Fiber Array Laser Ultrasonic Inspection System. IEEE Transactions on Components Packaging and Manufacturing Technology. 9(7). 1219–1226. 12 indexed citations
3.
Ume, I. Charles, et al.. (2019). Feasibility Studies and Advantages of Using Dual Fiber Array in Laser Ultrasonic Inspection of Electronic Chip Packages. IEEE Transactions on Components Packaging and Manufacturing Technology. 9(7). 1284–1290. 8 indexed citations
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Yang, Lei & I. Charles Ume. (2015). Inspection of notch depths in thin structures using transmission coefficients of laser-generated Lamb waves. Ultrasonics. 63. 168–173. 16 indexed citations
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Ume, I. Charles, et al.. (2012). Prediction and experimental validation of penetration depth of butt welds in thin plates using superimposed laser sources. NDT & E International. 50. 10–19. 6 indexed citations
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Yang, Jin & I. Charles Ume. (2010). Laser ultrasonic technique for evaluating solder bump defects in flip chip packages using modal and signal analysis methods. IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control. 57(4). 920–932. 15 indexed citations
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Ume, I. Charles, et al.. (2004). Online–Offline Laser Ultrasonic Quality Inspection Tool for Multilayer Ceramic Capacitors—Part I. IEEE Transactions on Advanced Packaging. 27(4). 647–653. 16 indexed citations
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Ding, Hai, et al.. (2002). A projection moiré system for measuring warpage with case studies. 25(1). 130–135. 14 indexed citations
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Ume, I. Charles, et al.. (2002). Inspection of flip chip and chip scale package interconnects using laser ultrasound and interferometric techniques. 25(1). 1–14. 7 indexed citations
16.
Polsky, Yarom, et al.. (2000). A comparison of PWB warpage due to simulated infrared and wave soldering processes. IEEE Transactions on Electronics Packaging Manufacturing. 23(3). 191–199. 16 indexed citations
17.
Graham, George, et al.. (1998). Laser Array/EMAT Ultrasonic Measurement of the Penetration Depth in a Liquid Weld Pool. Journal of Manufacturing Science and Engineering. 122(1). 70–75. 4 indexed citations
18.
Graham, George & I. Charles Ume. (1997). Automated system for laser ultrasonic sensing of weld penetration. Mechatronics. 7(8). 711–721. 38 indexed citations
19.
Ume, I. Charles, et al.. (1997). System for Real-Time Measurement of Thermally Induced PWB/PWA Warpage. Journal of Electronic Packaging. 119(1). 1–7. 29 indexed citations
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Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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