T. M. Tsai

422 total citations
24 papers, 342 citations indexed

About

T. M. Tsai is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, T. M. Tsai has authored 24 papers receiving a total of 342 indexed citations (citations by other indexed papers that have themselves been cited), including 20 papers in Electrical and Electronic Engineering, 19 papers in Electronic, Optical and Magnetic Materials and 7 papers in Materials Chemistry. Recurrent topics in T. M. Tsai's work include Copper Interconnects and Reliability (19 papers), Semiconductor materials and devices (17 papers) and Advanced Surface Polishing Techniques (4 papers). T. M. Tsai is often cited by papers focused on Copper Interconnects and Reliability (19 papers), Semiconductor materials and devices (17 papers) and Advanced Surface Polishing Techniques (4 papers). T. M. Tsai collaborates with scholars based in Taiwan, United States and Australia. T. M. Tsai's co-authors include Po‐Tsun Liu, Y. S. Mor, Simon M. Sze, Ting‐Chang Chang, C. W. Chen, Tien‐Chun Chang, Tseung‐Yuen Tseng, Fu‐Ming Pan, Wen-Fa Wu and Shubin Yan and has published in prestigious journals such as Applied Physics Letters, PLoS ONE and Journal of The Electrochemical Society.

In The Last Decade

T. M. Tsai

21 papers receiving 338 citations

Peers

T. M. Tsai

EEE

EOMM

Y. S. Mor Taiwan

Taiheui Cho United States

Larry Zhao Belgium

Alexey S. Vishnevskiy Russia

Д. С. Серегин Russia

Chen Wu Belgium

Markus Heyne Belgium

W. F. A. Besling Netherlands

Kai‐Erik Elers Finland

Gayle Murdoch Belgium

Y. S. Mor Taiwan

T. M. Tsai

356 ×1.3

EEE

326 ×1.6

EOMM

130 ×1.0

153 ×1.5

58 ×1.0

Citations per year, relative to T. M. Tsai T. M. Tsai (= 1×) peers Y. S. Mor

Countries citing papers authored by T. M. Tsai

Since Specialization

Citations

This map shows the geographic impact of T. M. Tsai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. M. Tsai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. M. Tsai more than expected).

Fields of papers citing papers by T. M. Tsai

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by T. M. Tsai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. M. Tsai. The network helps show where T. M. Tsai may publish in the future.

Co-authorship network of co-authors of T. M. Tsai

This figure shows the co-authorship network connecting the top 25 collaborators of T. M. Tsai. A scholar is included among the top collaborators of T. M. Tsai based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with T. M. Tsai. T. M. Tsai is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Ma, Hon‐Ping, Julie Brown, Hui-An Lin, et al.. (2025). Effects of aging and risk-taking behaviors on fatal injuries among old motorcyclists in Taiwan: Evidence from 2011 to 2022. PLoS ONE. 20(9). e0328832–e0328832.

Wu, Jia‐Ling, Chin‐Wei Kuo, Chuan‐Yu Chen, et al.. (2024). Institutional variation of smoking cessation success in Taiwan: A multi-level analysis of the National Second-Generation Tobacco Cessation Program Data. Journal of Substance Use and Addiction Treatment. 170. 209615–209615.

Chang, Tien‐Chun, et al.. (2005). Electrical Degradation of N-Channel Poly-Si TFT under AC Stress. Electrochemical and Solid-State Letters. 8(9). H69–H69. 8 indexed citations

Liu, Po‐Tsun, et al.. (2005). Leakage conduction behavior in electron-beam-cured nanoporous silicate films. Applied Physics Letters. 86(18). 5 indexed citations

Chen, C. W., et al.. (2004). Cu-penetration induced breakdown mechanism for a-SiCN. Thin Solid Films. 469-470. 388–392. 9 indexed citations

Liu, Po‐Tsun, et al.. (2004). Application of electron-beam illuminated low-k silicate to nanoscale interconnect technology. 110–110. 1 indexed citations

Chen, C. W., Ting‐Chang Chang, Po‐Tsun Liu, T. M. Tsai, & Tseung‐Yuen Tseng. (2004). Effects of Oxygen Plasma Ashing on Barrier Dielectric SiCN Film. Electrochemical and Solid-State Letters. 8(1). G11–G11. 9 indexed citations

Chang, Tien‐Chun, Po‐Tsun Liu, Y. S. Mor, et al.. (2003). Moisture-Induced Material Instability of Porous Organosilicate Glass. Electrochemical and Solid-State Letters. 6(4). F13–F13. 12 indexed citations

Chang, Tien‐Chun, T. M. Tsai, Po‐Tsun Liu, et al.. (2003). CMP of ultra low-k material porous-polysilazane (PPSZ) for interconnect applications. Thin Solid Films. 447-448. 524–530. 10 indexed citations

10.

Chang, Ting‐Chang, et al.. (2003). Direct Patterning of Low-k Hydrogen Silsesquioxane Using X-Ray Exposure Technology. Electrochemical and Solid-State Letters. 6(5). G69–G69. 4 indexed citations

11.

Liu, Po‐Tsun, et al.. (2003). Dielectric characteristics of low-permittivity silicate using electron beam direct patterning for intermetal dielectric applications. Applied Physics Letters. 83(20). 4226–4228. 10 indexed citations

12.

Chang, Ting‐Chang, Y. S. Mor, Po‐Tsun Liu, et al.. (2002). Recovering Dielectric Loss of Low Dielectric Constant Organic Siloxane during the Photoresist Removal Process. Journal of The Electrochemical Society. 149(8). F81–F81. 33 indexed citations

13.

Chang, Tien‐Chun, T. M. Tsai, Po‐Tsun Liu, et al.. (2002). The novel pattern method of low-k hybrid-organic-siloxane-polymer film using X-ray exposure. Thin Solid Films. 420-421. 403–407. 12 indexed citations

14.

Liu, Po‐Tsun, Tien‐Chun Chang, Y. S. Mor, et al.. (2002). Effective Strategy for Porous Organosilicate to Suppress Oxygen Ashing Damage. Electrochemical and Solid-State Letters. 5(3). G11–G11. 16 indexed citations

15.

Chang, Ting‐Chang, Y. S. Mor, Po‐Tsun Liu, et al.. (2002). Preventing dielectric damage of low-k organic siloxane by passivation treatment. Microelectronic Engineering. 60(3-4). 469–475. 9 indexed citations

16.

Mor, Y. S., Ting‐Chang Chang, Po‐Tsun Liu, et al.. (2002). Effective repair to ultra-low-k dielectric material (k∼2.0) by hexamethyldisilazane treatment. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 20(4). 1334–1338. 64 indexed citations

17.

Chang, Ting‐Chang, Y. S. Mor, Po‐Tsun Liu, et al.. (2002). Trimethylchlorosilane Treatment of Ultralow Dielectric Constant Material after Photoresist Removal Processing. Journal of The Electrochemical Society. 149(10). F145–F145. 14 indexed citations

18.

Chang, Tien‐Chun, et al.. (2001). The effect of ammonia plasma treatment on low-k methyl-hybrido-silsesquioxane against photoresist stripping damage. Thin Solid Films. 398-399. 632–636. 17 indexed citations

19.

Chang, Ting‐Chang, Y. S. Mor, Po‐Tsun Liu, et al.. (2001). Improvement of low dielectric constant methylsilsesquioxane by boron implantation treatment. Thin Solid Films. 398-399. 637–640. 6 indexed citations

20.

Chang, Tien‐Chun, Y. S. Mor, Po‐Tsun Liu, et al.. (2001). Enhancing the resistance of low-k hydrogen silsesquioxane (HSQ) to wet stripper damage. Thin Solid Films. 398-399. 523–526. 20 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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