K. Ramakrishna

1.5k total citations
77 papers, 966 citations indexed

About

K. Ramakrishna is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Biomedical Engineering. According to data from OpenAlex, K. Ramakrishna has authored 77 papers receiving a total of 966 indexed citations (citations by other indexed papers that have themselves been cited), including 30 papers in Mechanical Engineering, 29 papers in Electrical and Electronic Engineering and 18 papers in Biomedical Engineering. Recurrent topics in K. Ramakrishna's work include Electronic Packaging and Soldering Technologies (17 papers), Heat Transfer Mechanisms (15 papers) and Heat Transfer and Optimization (14 papers). K. Ramakrishna is often cited by papers focused on Electronic Packaging and Soldering Technologies (17 papers), Heat Transfer Mechanisms (15 papers) and Heat Transfer and Optimization (14 papers). K. Ramakrishna collaborates with scholars based in India, United States and Nepal. K. Ramakrishna's co-authors include Abhishek Dasore, Manjunatha Pattabi, S. G. Rubin, P. K. Khosla, Sai Santosh Kumar Raavi, P. S. Patil, S.M. Dharmaprakash, Hoong‐Kun Fun, D. Narayana Rao and Upendra Rajak and has published in prestigious journals such as SHILAP Revista de lepidopterología, Journal of Applied Physics and Journal of Computational Physics.

In The Last Decade

K. Ramakrishna

75 papers receiving 836 citations

Peers

K. Ramakrishna
Marwan Amin Kutbi Saudi Arabia
Xia Li China
Weihong Zhang China
Mohamed Hussien Saudi Arabia
Ante Jukić Croatia
P. Kalyanasundaram India
Doo-Hyun Kim South Korea
Mei Liu China
Adel Mhamdi Germany
Tianyi Gao China
Marwan Amin Kutbi Saudi Arabia
K. Ramakrishna
Citations per year, relative to K. Ramakrishna K. Ramakrishna (= 1×) peers Marwan Amin Kutbi

Countries citing papers authored by K. Ramakrishna

Since Specialization
Citations

This map shows the geographic impact of K. Ramakrishna's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by K. Ramakrishna with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites K. Ramakrishna more than expected).

Fields of papers citing papers by K. Ramakrishna

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by K. Ramakrishna. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by K. Ramakrishna. The network helps show where K. Ramakrishna may publish in the future.

Co-authorship network of co-authors of K. Ramakrishna

This figure shows the co-authorship network connecting the top 25 collaborators of K. Ramakrishna. A scholar is included among the top collaborators of K. Ramakrishna based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with K. Ramakrishna. K. Ramakrishna is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
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Ramakrishna, K., et al.. (2023). A comparative study of the efficacy and safety of thiocolchicoside and chlorzoxazone in patients with acute musculoskeletal pain. SHILAP Revista de lepidopterología. 14(8). 203–206. 1 indexed citations
4.
Dasore, Abhishek, et al.. (2023). Numerical and empirical simulation of fluid flow in a spiral plate heat exchanger with Nusselt number correlation development. International Journal on Interactive Design and Manufacturing (IJIDeM). 18(5). 3103–3113. 1 indexed citations
5.
Dasore, Abhishek, K. Ramakrishna, & B. Kiran Naik. (2020). EVALUATION OF HEAT AND MASS TRANSFER COEFFICIENTS AT BEETROOT-AIR INTERFACE DURING CONVECTIVE DRYING. Interfacial phenomena and heat transfer. 8(4). 303–319. 9 indexed citations
6.
Pal, Bishnu P., et al.. (2020). Development of Test Protocol for Accelerated Creep and Transient Thermo-mechanical Testing of AUSC Steam Turbine Rotor in High-Temperature Spin Test Rig. Transactions of Indian National Academy of Engineering. 5(1). 83–88. 1 indexed citations
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Dasore, Abhishek & K. Ramakrishna. (2019). Numerical Simulation of air Temperature and air flow Distribution in a Cabinet tray Dryer. International Journal of Innovative Technology and Exploring Engineering. 8(11). 1836–1854. 2 indexed citations
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Dasore, Abhishek, K. Ramakrishna, & Naveen Puppala. (2019). Method for Determining the Appropriate Thin Layer Drying Model for a Feedstock. International Journal of Recent Technology and Engineering (IJRTE). 8(3). 3627–3632. 8 indexed citations
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Ramakrishna, K., et al.. (2014). Radiation and mass transfer effects on unsteady MHD convective flow past an infinite vertical plate with Dufour and Soret effects. Ain Shams Engineering Journal. 6(1). 363–371. 32 indexed citations
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Ramakrishna, K., et al.. (2012). Improvement of Engine Performance and Emissions with Ethyl Hexyl Nitrate and Diesel-Biodiesel Blends. International Energy Journal. 13(2). 3 indexed citations
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Ying, Ming, et al.. (2005). Design considerations on solder joint reliability of dual row quad flat no-lead packages. 308–312. 4 indexed citations
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Sammakia, Bahgat, et al.. (2004). A Numerical Study of the Thermal Performance of an Impingement Heat Sink—Fin Shape Optimization. IEEE Transactions on Components and Packaging Technologies. 27(4). 710–717. 29 indexed citations
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Ramakrishna, K., et al.. (2002). Thermal sub-modeling of the wirebonded plastic ball grid array package. 1–9. 28 indexed citations
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Subbarayan, Ganesh, et al.. (2002). Mechanical integrity of vias in a thin-film package during manufacture, assembly, and stress-test. 1. 276–279. 2 indexed citations
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Ramakrishna, K., I. M. Cohen, & P. S. Ayyaswamy. (1994). Effect of negative ions on electrical breakdown in a nonuniform air gap between a wire and a plane. Physics of Plasmas. 1(5). 1349–1358. 1 indexed citations
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Ramakrishna, K., et al.. (1993). Effect of solder thickness on mechanical reliability of die-bonded chip package during chip encapsulation and accelerated thermal cycling. 13–27. 1 indexed citations
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Ramakrishna, K., P. K. Khosla, & S. G. Rubin. (1980). Laminar natural convection along vertical corners and rectangular channels. 981–994. 2 indexed citations
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Ramakrishna, K., K. N. Seetharamu, & P. K. Sarma. (1978). Turbulent Heat Transfer by Free Convection from a Rough Surface. Journal of Heat Transfer. 100(4). 727–729. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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