K. Ramakrishna
- Mechanical Engineering top 5%
- Heat Transfer Mechanisms 15
- Heat Transfer and Optimization 14
- Computational Mechanics top 5%
- Fluid Dynamics and Turbulent Flows 8
- Biomedical Engineering top 10%
- Nanofluid Flow and Heat Transfer 11
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- Electronic Packaging and Soldering Technologies 17
- 3D IC and TSV technologies 12
- Electromagnetic Compatibility and Noise Suppression 5
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- Food Drying and Modeling 5
- Co-authors
- Abhishek DasoreManjunatha PattabiS. G. RubinP. K. KhoslaSai Santosh Kumar RaaviP. S. PatilS.M. DharmaprakashHoong‐Kun Fun
- Journals
- SHILAP Revista de lepidopterología (1 paper)Journal of Applied Physics (1 paper)Journal of Computational Physics (1 paper)
- Partner nations
- IndiaUnited StatesNepal
In The Last Decade
K. Ramakrishna
75 papers receiving 836 citations
Peers
Comparison fields: 5 of 102
- Mechanical Engineering 415
- Computational Mechanics 193
- Biomedical Engineering 311
- Fluid Flow and Transfer Processes 35
- Electronic, Optical and Magnetic Materials 82
Countries citing papers authored by K. Ramakrishna
This map shows the geographic impact of K. Ramakrishna's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by K. Ramakrishna with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites K. Ramakrishna more than expected).
Fields of papers citing papers by K. Ramakrishna
This network shows the impact of papers produced by K. Ramakrishna. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by K. Ramakrishna. The network helps show where K. Ramakrishna may publish in the future.
Co-authorship network
The 25 scholars most cited alongside K. Ramakrishna, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 0 | |
| 2 | 2025 | 1 | |
| 3 | 2023 | 1 | |
| 4 | 2023 | 1 | |
| 5 | 2020 | 9 | |
| 6 | 2020 | 1 | |
| 7 | 2019 | 2 | |
| 8 | 2019 | 8 | |
| 9 | 2014 | 32 | |
| 10 | 2014 | 1 | |
| 11 | Improvement of Engine Performance and Emissions with Ethyl Hexyl Nitrate and Diesel-Biodiesel Blends | 2012 | 3 |
| 12 | 2005 | 4 | |
| 13 | 2004 | 29 | |
| 14 | 2003 | 4 | |
| 15 | 2002 | 28 | |
| 16 | 2002 | 2 | |
| 17 | 1994 | 1 | |
| 18 | Effect of solder thickness on mechanical reliability of die-bonded chip package during chip encapsulation and accelerated thermal cycling | 1993 | 1 |
| 19 | Laminar natural convection along vertical corners and rectangular channels | 1980 | 2 |
| 20 | 1978 | 4 |
About K. Ramakrishna
K. Ramakrishna is a scholar working on Mechanical Engineering, Computational Mechanics and Fluid Flow and Transfer Processes, having authored 77 papers that have together received 966 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (17 papers), Heat Transfer Mechanisms (15 papers), Heat Transfer and Optimization (14 papers), 3D IC and TSV technologies (12 papers), Nanofluid Flow and Heat Transfer (11 papers), Fluid Dynamics and Turbulent Flows (8 papers), Food Drying and Modeling (5 papers) and Electromagnetic Compatibility and Noise Suppression (5 papers). The work is most often cited by research in Mechanical Engineering (415 citations), Computational Mechanics (193 citations) and Biomedical Engineering (311 citations). K. Ramakrishna has collaborated with scholars based in India, United States and Nepal. Frequent co-authors include Abhishek Dasore, Manjunatha Pattabi, S. G. Rubin, P. K. Khosla, Sai Santosh Kumar Raavi, P. S. Patil, S.M. Dharmaprakash, Hoong‐Kun Fun, D. Narayana Rao and Upendra Rajak. Their work appears in journals such as SHILAP Revista de lepidopterología, Journal of Applied Physics and Journal of Computational Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.