T.F. Lemczyk

468 total citations
14 papers, 347 citations indexed

About

T.F. Lemczyk is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Mechanics of Materials. According to data from OpenAlex, T.F. Lemczyk has authored 14 papers receiving a total of 347 indexed citations (citations by other indexed papers that have themselves been cited), including 7 papers in Mechanical Engineering, 6 papers in Electrical and Electronic Engineering and 4 papers in Mechanics of Materials. Recurrent topics in T.F. Lemczyk's work include Heat Transfer and Optimization (5 papers), 3D IC and TSV technologies (4 papers) and Adhesion, Friction, and Surface Interactions (4 papers). T.F. Lemczyk is often cited by papers focused on Heat Transfer and Optimization (5 papers), 3D IC and TSV technologies (4 papers) and Adhesion, Friction, and Surface Interactions (4 papers). T.F. Lemczyk collaborates with scholars based in Canada and United States. T.F. Lemczyk's co-authors include M. M. Yovanovich, J. R. Culham, P. Teertstra and G. M. L. Gladwell and has published in prestigious journals such as International Journal of Heat and Mass Transfer, SAE technical papers on CD-ROM/SAE technical paper series and Computers & Mathematics with Applications.

In The Last Decade

T.F. Lemczyk

14 papers receiving 315 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
T.F. Lemczyk Canada	11	205	122	55	46	37	14	347
Sergio Lupi Italy	11	348 1.7×	158 1.3×	18 0.3×	36 0.8×	88 2.4×	50	423
Jing Yin China	11	204 1.0×	59 0.5×	101 1.8×	93 2.0×	35 0.9×	32	349
Byoung-Gook Loh South Korea	7	183 0.9×	47 0.4×	73 1.3×	45 1.0×	87 2.4×	17	362
Yuji Tsuchida Japan	11	330 1.6×	148 1.2×	15 0.3×	92 2.0×	19 0.5×	69	412
York Christian Gerstenmaier Germany	12	155 0.8×	395 3.2×	103 1.9×	17 0.4×	20 0.5×	31	525
Eric Monier-Vinard France	12	162 0.8×	218 1.8×	39 0.7×	19 0.4×	26 0.7×	44	334
Gert Goch Germany	8	153 0.7×	51 0.4×	88 1.6×	159 3.5×	73 2.0×	23	336
Nicolas Lhermet France	7	107 0.5×	113 0.9×	74 1.3×	45 1.0×	14 0.4×	28	353
Takashi Nagata Japan	6	67 0.3×	67 0.5×	157 2.9×	79 1.7×	31 0.8×	19	312
Paul Labbé Canada	10	50 0.2×	95 0.8×	52 0.9×	41 0.9×	150 4.1×	21	289

Countries citing papers authored by T.F. Lemczyk

Since Specialization

Citations

This map shows the geographic impact of T.F. Lemczyk's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T.F. Lemczyk with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T.F. Lemczyk more than expected).

Fields of papers citing papers by T.F. Lemczyk

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by T.F. Lemczyk. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T.F. Lemczyk. The network helps show where T.F. Lemczyk may publish in the future.

Co-authorship network of co-authors of T.F. Lemczyk

This figure shows the co-authorship network connecting the top 25 collaborators of T.F. Lemczyk. A scholar is included among the top collaborators of T.F. Lemczyk based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with T.F. Lemczyk. T.F. Lemczyk is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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14 of 14 papers shown

Lemczyk, T.F., et al.. (2003). F/sub opt/-a thermal optimization factor for microelectronic packages. 89–94. 2 indexed citations

Lemczyk, T.F., et al.. (2003). Analysis of thermal vias in high density interconnect technology. 55–61. 35 indexed citations

Lemczyk, T.F., et al.. (2002). PCB trace thermal analysis and effective conductivity. 15–22. 20 indexed citations

Culham, J. R., M. M. Yovanovich, & T.F. Lemczyk. (2000). Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution. Journal of Electronic Packaging. 122(3). 233–239. 34 indexed citations

Teertstra, P., M. M. Yovanovich, J. R. Culham, & T.F. Lemczyk. (1999). Analytical forced convection modeling of plate fin heat sinks. 34–41. 133 indexed citations

Lemczyk, T.F., et al.. (1992). PCB Trace Thermal Analysis and Effective Conductivity. Journal of Electronic Packaging. 114(4). 413–419. 22 indexed citations

Gladwell, G. M. L. & T.F. Lemczyk. (1988). Thermal constriction resistance of a contact on a circular cylinder with mixed convective boundaries. Proceedings of the Royal Society of London A Mathematical and Physical Sciences. 420(1859). 323–354. 14 indexed citations

Lemczyk, T.F. & M. M. Yovanovich. (1988). Efficient evaluation of incomplete elliptic integrals and functions. Computers & Mathematics with Applications. 16(9). 747–757. 11 indexed citations

Lemczyk, T.F. & M. M. Yovanovich. (1988). Thermal constriction resistance with convective boundary conditions—1. Half-space contacts. International Journal of Heat and Mass Transfer. 31(9). 1861–1872. 20 indexed citations

10.

Yovanovich, M. M., J. R. Culham, & T.F. Lemczyk. (1988). Simplified solutions to circular annular fins with contact resistance and end cooling. Journal of Thermophysics and Heat Transfer. 2(2). 152–157. 21 indexed citations

11.

Lemczyk, T.F., et al.. (1988). Optimization of Louvered Fins in Intermittent Contact with Plate Heat Exchanger Passageways. SAE technical papers on CD-ROM/SAE technical paper series. 1. 1 indexed citations

12.

Lemczyk, T.F. & M. M. Yovanovich. (1988). Thermal constriction resistance with convective boundary conditions—2. Layered half-space contacts. International Journal of Heat and Mass Transfer. 31(9). 1873–1883. 13 indexed citations

13.

Lemczyk, T.F. & M. M. Yovanovich. (1987). New Models and Methodology for Predicting Thermal Contact Resistance in Compound Cylinders and Finned Tubes. Heat Transfer Engineering. 8(2). 35–48. 20 indexed citations

14.

Yovanovich, M. M., J. R. Culham, & T.F. Lemczyk. (1986). Simplified analytical solutions and numerical computation of one andtwo-dimensional circular fins with contact conductance and end cooling. 24th Aerospace Sciences Meeting. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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