T.F. Lemczyk
- Mechanical Engineering top 10%
- Heat Transfer and Optimization 5
- Heat Transfer and Boiling Studies 2
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- 3D IC and TSV technologies 4
- Silicon Carbide Semiconductor Technologies 3
- Electronic Packaging and Soldering Technologies 2
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- Adhesion, Friction, and Surface Interactions 4
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- Thermal properties of materials 3
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- Brake Systems and Friction Analysis 3
- Journals
- International Journal of Heat and Mass Transfer (2 papers)Journal of Electronic Packaging (2 papers)Heat Transfer Engineering (1 paper)
- Partner nations
- CanadaUnited States
In The Last Decade
T.F. Lemczyk
14 papers receiving 315 citations
Peers
Comparison fields: 5 of 44
- Mechanical Engineering 205
- Electrical and Electronic Engineering 122
- Mechanics of Materials 46
- Computational Mechanics 37
- Hardware and Architecture 10
Countries citing papers authored by T.F. Lemczyk
This map shows the geographic impact of T.F. Lemczyk's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T.F. Lemczyk with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T.F. Lemczyk more than expected).
Fields of papers citing papers by T.F. Lemczyk
This network shows the impact of papers produced by T.F. Lemczyk. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T.F. Lemczyk. The network helps show where T.F. Lemczyk may publish in the future.
Co-authorship network
The 4 scholars most cited alongside T.F. Lemczyk, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2003 | 2 | |
| 2 | 2003 | 35 | |
| 3 | 2002 | 20 | |
| 4 | 2000 | 34 | |
| 5 | 1999 | 133 | |
| 6 | 1992 | 22 | |
| 7 | 1988 | 14 | |
| 8 | 1988 | 11 | |
| 9 | 1988 | 20 | |
| 10 | 1988 | 1 | |
| 11 | 1988 | 13 | |
| 12 | 1988 | 21 | |
| 13 | 1987 | 20 | |
| 14 | 1986 | 1 |
About T.F. Lemczyk
T.F. Lemczyk is a scholar working on Automotive Engineering, Algebra and Number Theory and Modeling and Simulation, having authored 14 papers that have together received 347 indexed citations. Recurring topics across this work include Heat Transfer and Optimization (5 papers), 3D IC and TSV technologies (4 papers), Adhesion, Friction, and Surface Interactions (4 papers), Thermal properties of materials (3 papers), Brake Systems and Friction Analysis (3 papers), Silicon Carbide Semiconductor Technologies (3 papers), Electronic Packaging and Soldering Technologies (2 papers) and Heat Transfer and Boiling Studies (2 papers). The work is most often cited by research in Mechanical Engineering (205 citations), Electrical and Electronic Engineering (122 citations) and Mechanics of Materials (46 citations). T.F. Lemczyk has collaborated with scholars based in Canada and United States. Frequent co-authors include M. M. Yovanovich, J. R. Culham, P. Teertstra and G. M. L. Gladwell. Their work appears in journals such as International Journal of Heat and Mass Transfer, Journal of Electronic Packaging, Heat Transfer Engineering, Computers & Mathematics with Applications and SAE technical papers on CD-ROM/SAE technical paper series.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.