Minghui Lin

618 total citations
18 papers, 471 citations indexed

About

Minghui Lin is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Minghui Lin has authored 18 papers receiving a total of 471 indexed citations (citations by other indexed papers that have themselves been cited), including 12 papers in Electrical and Electronic Engineering, 11 papers in Mechanics of Materials and 7 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Minghui Lin's work include Electronic Packaging and Soldering Technologies (12 papers), Copper Interconnects and Reliability (7 papers) and Metal and Thin Film Mechanics (6 papers). Minghui Lin is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), Copper Interconnects and Reliability (7 papers) and Metal and Thin Film Mechanics (6 papers). Minghui Lin collaborates with scholars based in United States, China and Canada. Minghui Lin's co-authors include Cemal Basaran, Hua Ye, Juan Gómez, Hanjun Gao, Xin Li, Douglas C. Hopkins, Yidu Zhang, Qiong Wu, Shidong Li and Qiong Wu and has published in prestigious journals such as International Journal of Solids and Structures, The International Journal of Advanced Manufacturing Technology and QJM.

In The Last Decade

Minghui Lin

16 papers receiving 462 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Minghui Lin United States	9	322	166	145	139	96	18	471
Scott Irving United States	11	423 1.3×	132 0.8×	122 0.8×	80 0.6×	29 0.3×	51	476
Jici Wen China	9	192 0.6×	67 0.4×	73 0.5×	36 0.3×	65 0.7×	24	330
Pilin Liu United States	8	332 1.0×	169 1.0×	42 0.3×	34 0.2×	76 0.8×	20	377
A. Nishimura Japan	16	540 1.7×	109 0.7×	278 1.9×	26 0.2×	47 0.5×	52	610
Shengjie Yu China	11	60 0.2×	190 1.1×	84 0.6×	48 0.3×	180 1.9×	46	447
Nora Leuning Germany	13	233 0.7×	544 3.3×	68 0.5×	532 3.8×	73 0.8×	50	644
Richard C. Blish United States	14	335 1.0×	120 0.7×	68 0.5×	64 0.5×	95 1.0×	33	441
W. J. Nam South Korea	17	113 0.4×	429 2.6×	187 1.3×	61 0.4×	344 3.6×	35	589

Countries citing papers authored by Minghui Lin

Since Specialization

Citations

This map shows the geographic impact of Minghui Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Minghui Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Minghui Lin more than expected).

Fields of papers citing papers by Minghui Lin

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Minghui Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Minghui Lin. The network helps show where Minghui Lin may publish in the future.

Co-authorship network of co-authors of Minghui Lin

This figure shows the co-authorship network connecting the top 25 collaborators of Minghui Lin. A scholar is included among the top collaborators of Minghui Lin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Minghui Lin. Minghui Lin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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18 of 18 papers shown

Gamsjäger, Ernst, et al.. (2025). In-situ austenite grain growth measurements in an X80 line pipe steel. Materials Characterization. 224. 114998–114998.

Gao, Hanjun, et al.. (2023). A simulation modeling methodology considering random multiple shots for shot peening process. REVIEWS ON ADVANCED MATERIALS SCIENCE. 62(1). 1 indexed citations

Lin, Minghui, et al.. (2023). In situ measurement of austenite grain growth and recrystallization using laser ultrasonics. Journal of Physics Conference Series. 2635(1). 12039–12039.

Gao, Hanjun, Xin Li, Qiong Wu, Minghui Lin, & Yidu Zhang. (2022). Effects of residual stress and equivalent bending stiffness on the dimensional stability of the thin-walled parts. The International Journal of Advanced Manufacturing Technology. 119(7-8). 4907–4924. 20 indexed citations

Chen, Shuguang, et al.. (2022). Research on process optimization and rapid prediction method of thermal vibration stress relief for 2219 aluminum alloy rings. REVIEWS ON ADVANCED MATERIALS SCIENCE. 61(1). 292–305. 6 indexed citations

Lin, Minghui, et al.. (2015). Black oesophagus: Figure 1.. QJM. 108(10). 839–840. 3 indexed citations

Basaran, Cemal, Minghui Lin, & Shidong Li. (2007). Computational simulation of electromigration induced damage in copper interconnects. Summer Computer Simulation Conference. 261–268. 3 indexed citations

Basaran, Cemal & Minghui Lin. (2007). Damage mechanics of electromigration in microelectronics copper interconnects. International Journal of Materials and Structural Integrity. 1(1/2/3). 16–16. 28 indexed citations

Basaran, Cemal & Minghui Lin. (2007). Damage mechanics of electromigration induced failure. Mechanics of Materials. 40(1-2). 66–79. 69 indexed citations

10.

Basaran, Cemal & Minghui Lin. (2006). Electromigration induced strain field simulations for nanoelectronics lead-free solder joints. International Journal of Solids and Structures. 44(14-15). 4909–4924. 26 indexed citations

11.

Gómez, Juan, Minghui Lin, & Cemal Basaran. (2006). Damage Mechanics Modeling of Concurrent Thermal and Vibration Loading on Electronics Packaging. Multidiscipline Modeling in Materials and Structures. 2(3). 309–326. 21 indexed citations

12.

Li, Shidong, et al.. (2006). Thermomigration Induced Strain Field Simulation for Microelectronic Lead Free Solder Joints. 235–239. 1 indexed citations

13.

Ye, Hua, Cemal Basaran, Douglas C. Hopkins, & Minghui Lin. (2005). Modeling deformation in microelectronics BGA solder joints under high current density. Part I. Simulation and testing. 2. 1437–1444. 17 indexed citations

14.

Basaran, Cemal, Minghui Lin, & Hua Ye. (2004). A thermodynamic model for electrical current induced damage. 125. 1738–1745. 7 indexed citations

15.

Lin, Minghui & Cemal Basaran. (2004). Electromigration induced stress analysis using fully coupled mechanical–diffusion equations with nonlinear material properties. Computational Materials Science. 34(1). 82–98. 50 indexed citations

16.

Basaran, Cemal, Minghui Lin, & Hua Ye. (2003). A thermodynamic model for electrical current induced damage. International Journal of Solids and Structures. 40(26). 7315–7327. 94 indexed citations

17.

Ye, Hua, Minghui Lin, & Cemal Basaran. (2002). Failure modes and FEM analysis of power electronic packaging. Finite Elements in Analysis and Design. 38(7). 601–612. 124 indexed citations

18.

Ye, Hua, Minghui Lin, & Cemal Basaran. (2001). Failure modes and FEM analysis of power electronic packaging. Scopus. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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