Minghui Lin
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 10%
- Mechanics of Materials top 10%
- Electronic, Optical and Magnetic Materials
- Materials Chemistry
- Co-authors
- Cemal BasaranHua YeJuan GómezHanjun GaoXin LiDouglas C. HopkinsYidu ZhangQiong Wu
- Topics
- Electronic Packaging and Soldering Technologies (12 papers)Copper Interconnects and Reliability (7 papers)Metal and Thin Film Mechanics (6 papers)
- Cited by
- Electronic, Optical and Magnetic MaterialsMechanics of MaterialsElectrical and Electronic Engineering
- Journals
- International Journal of Solids and StructuresThe International Journal of Advanced Manufacturing TechnologyQJM
- Partner nations
- United StatesChinaCanada
In The Last Decade
Minghui Lin
16 papers receiving 462 citations
Peers
Comparison fields: 5 of 43
- Electrical and Electronic Engineering 322
- Mechanical Engineering 166
- Mechanics of Materials 145
- Electronic, Optical and Magnetic Materials 139
- Materials Chemistry 96
Countries citing papers authored by Minghui Lin
This map shows the geographic impact of Minghui Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Minghui Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Minghui Lin more than expected).
Fields of papers citing papers by Minghui Lin
This network shows the impact of papers produced by Minghui Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Minghui Lin. The network helps show where Minghui Lin may publish in the future.
Co-authorship network of co-authors of Minghui Lin
This figure shows the co-authorship network connecting the top 25 collaborators of Minghui Lin. A scholar is included among the top collaborators of Minghui Lin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Minghui Lin. Minghui Lin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 1 | |
| 3 | 0 | |
| 4 | 20 | |
| 5 | 6 | |
| 6 | 3 | |
| 7 | 3 | |
| 8 | 28 | |
| 9 | 69 | |
| 10 | 26 | |
| 11 | 21 | |
| 12 | 1 | |
| 13 | 17 | |
| 14 | 7 | |
| 15 | 50 | |
| 16 | 94 | |
| 17 | 124 | |
| 18 | Failure modes and FEM analysis of power electronic packaging | 1 |
About Minghui Lin
Minghui Lin is a scholar working on Mechanics of Materials, Electronic, Optical and Magnetic Materials and Ecological Modeling, having authored 18 papers that have together received 471 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (12 papers), Copper Interconnects and Reliability (7 papers) and Metal and Thin Film Mechanics (6 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (139 citations), Mechanics of Materials (145 citations) and Electrical and Electronic Engineering (322 citations). Minghui Lin has collaborated with scholars based in United States, China and Canada. Frequent co-authors include Cemal Basaran, Hua Ye, Juan Gómez, Hanjun Gao, Xin Li, Douglas C. Hopkins, Yidu Zhang, Qiong Wu, Shidong Li and Qiong Wu. Their work appears in journals such as International Journal of Solids and Structures, The International Journal of Advanced Manufacturing Technology and QJM.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.