Verena Hein

618 total citations · 1 hit paper
21 papers, 498 citations indexed

About

Verena Hein is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, Verena Hein has authored 21 papers receiving a total of 498 indexed citations (citations by other indexed papers that have themselves been cited), including 14 papers in Electrical and Electronic Engineering, 13 papers in Electronic, Optical and Magnetic Materials and 9 papers in Mechanics of Materials. Recurrent topics in Verena Hein's work include Copper Interconnects and Reliability (13 papers), Electronic Packaging and Soldering Technologies (10 papers) and Metal and Thin Film Mechanics (7 papers). Verena Hein is often cited by papers focused on Copper Interconnects and Reliability (13 papers), Electronic Packaging and Soldering Technologies (10 papers) and Metal and Thin Film Mechanics (7 papers). Verena Hein collaborates with scholars based in Germany and United States. Verena Hein's co-authors include F. Erdoğan, Kirsten Weide-Zaage, M. Ackermann and M. Pohl and has published in prestigious journals such as International Journal of Fracture, Bell System Technical Journal and Microelectronics Reliability.

In The Last Decade

Verena Hein

18 papers receiving 473 citations

Hit Papers

Stress singularities in a two-material wedge 1971 2026 1989 2007 1971 100 200 300 400
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. Stress singularities in a two-material wedge
    1971 409 citations Verena Hein, F. Erdoğan International Journal of Fracture profile →

Peers

Verena Hein
F. G. Yuan United States
Mei‐Feng Liu Taiwan
Felipe García-Sánchez Spain
R.A.B. Engelen Netherlands
Federico C. Buroni Spain
Li Tian China
Shantanu S. Mulay India
T. Nakamura Japan
Dejin Huang China
Y. Lapusta Ukraine
F. G. Yuan United States
Verena Hein
Citations per year, relative to Verena Hein Verena Hein (= 1×) peers F. G. Yuan

Countries citing papers authored by Verena Hein

Since Specialization
Citations

This map shows the geographic impact of Verena Hein's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Verena Hein with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Verena Hein more than expected).

Fields of papers citing papers by Verena Hein

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Verena Hein. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Verena Hein. The network helps show where Verena Hein may publish in the future.

Co-authorship network of co-authors of Verena Hein

This figure shows the co-authorship network connecting the top 25 collaborators of Verena Hein. A scholar is included among the top collaborators of Verena Hein based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Verena Hein. Verena Hein is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Weide-Zaage, Kirsten & Verena Hein. (2018). Process, geometry and stack related reliability of thick ALCU-metal-tracks. 1–7.
2.
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Hein, Verena, et al.. (2016). Reliability evaluation of tungsten donut-via as an element of the highly robust metallization. Microelectronics Reliability. 64. 259–265. 11 indexed citations
5.
Hein, Verena, et al.. (2016). A design for highly robust ALCU-W-PLUG-metallization stack. 1–6. 2 indexed citations
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7.
Ackermann, M., et al.. (2015). Life time characterization for a highly robust metallization. 53. 1–6. 1 indexed citations
8.
Weide-Zaage, Kirsten, et al.. (2014). Reliability performance of different layouts of wide metal tracks. IT.4.1–IT.4.4. 3 indexed citations
9.
Hein, Verena, et al.. (2014). Evaluation new corner stress relief structure layout for high robust metallization. Microelectronics Reliability. 54(9-10). 1977–1981. 1 indexed citations
10.
Weide-Zaage, Kirsten, et al.. (2014). Degradation behavior in upstream/downstream via test structures. Microelectronics Reliability. 54(9-10). 1724–1728. 2 indexed citations
11.
Weide-Zaage, Kirsten, et al.. (2013). Characterization of a new designed octahedron slotted metal track by simulations. 1–5. 3 indexed citations
12.
Weide-Zaage, Kirsten, et al.. (2013). Dynamic simulation of octahedron slotted metal structures. Microelectronics Reliability. 53(9-11). 1606–1610. 3 indexed citations
13.
Weide-Zaage, Kirsten, et al.. (2013). Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects. Microelectronics Reliability. 53(9-11). 1365–1369. 1 indexed citations
14.
Weide-Zaage, Kirsten, et al.. (2013). Overlap design for higher tungsten via robustness in AlCu metallizations. 43. 137–141. 1 indexed citations
15.
Weide-Zaage, Kirsten, et al.. (2013). Investigation of temperature gradients with regard to thermomigration in aluminium metallizations. 1–7. 2 indexed citations
16.
Ackermann, M., et al.. (2012). A design for robust wide metal tracks. Microelectronics Reliability. 52(9-10). 2447–2451. 10 indexed citations
17.
Weide-Zaage, Kirsten, et al.. (2012). Simulation of the influence of TiAl3 layers on the thermal–electrical and mechanical behaviour of Al metallizations. Microelectronics Reliability. 52(9-10). 1987–1992. 6 indexed citations
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Hein, Verena & F. Erdoğan. (1971). Stress singularities in a two-material wedge. International Journal of Fracture. 7(3). 317–330. 409 indexed citations breakdown →
20.
Hein, Verena. (1967). Convection and Conduction Cooling of Substrates Containing Multiple Heat Sources. Bell System Technical Journal. 46(8). 1659–1678. 27 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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