Miyuki Uomoto

672 total citations
49 papers, 497 citations indexed

About

Miyuki Uomoto is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Miyuki Uomoto has authored 49 papers receiving a total of 497 indexed citations (citations by other indexed papers that have themselves been cited), including 46 papers in Electrical and Electronic Engineering, 12 papers in Atomic and Molecular Physics, and Optics and 12 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Miyuki Uomoto's work include 3D IC and TSV technologies (39 papers), Electronic Packaging and Soldering Technologies (29 papers) and Copper Interconnects and Reliability (12 papers). Miyuki Uomoto is often cited by papers focused on 3D IC and TSV technologies (39 papers), Electronic Packaging and Soldering Technologies (29 papers) and Copper Interconnects and Reliability (12 papers). Miyuki Uomoto collaborates with scholars based in Japan, United States and Taiwan. Miyuki Uomoto's co-authors include T. Shimatsu, M. Ichikawa, Takashi Mukai, Shinya Endo, Takao Kosugi, Akira Fujioka, Michio Kadota, Shuji Tanaka, Katsumi Doh‐ura and Yuri Kawasaki and has published in prestigious journals such as Antimicrobial Agents and Chemotherapy, Applied Surface Science and Japanese Journal of Applied Physics.

In The Last Decade

Miyuki Uomoto

43 papers receiving 479 citations

Peers

Miyuki Uomoto
Leonie Hold Australia
Peter Michael Gammon United Kingdom
M. Rivoire France
Alan Iacopi Australia
Wei Sha China
J. Cluzel France
Tommi Suni Finland
Miyuki Uomoto
Citations per year, relative to Miyuki Uomoto Miyuki Uomoto (= 1×) peers Joerg Pezoldt

Countries citing papers authored by Miyuki Uomoto

Since Specialization
Citations

This map shows the geographic impact of Miyuki Uomoto's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Miyuki Uomoto with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Miyuki Uomoto more than expected).

Fields of papers citing papers by Miyuki Uomoto

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Miyuki Uomoto. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Miyuki Uomoto. The network helps show where Miyuki Uomoto may publish in the future.

Co-authorship network of co-authors of Miyuki Uomoto

This figure shows the co-authorship network connecting the top 25 collaborators of Miyuki Uomoto. A scholar is included among the top collaborators of Miyuki Uomoto based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Miyuki Uomoto. Miyuki Uomoto is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Miura, Taisuke, Miyuki Uomoto, T. Shimatsu, et al.. (2023). Development of Direct-bonded Yb:YAG Thin Rod Amplifier. 42. JM4A.17–JM4A.17.
2.
Shimatsu, T., et al.. (2023). Atomic Diffusion Bonding in Air Using Oxide Films. ECS Transactions. 112(3). 173–180. 1 indexed citations
3.
Uomoto, Miyuki, et al.. (2022). Bonding performance in atomic diffusion bonding of wafers using amorphous Si thin films with smooth surface. Japanese Journal of Applied Physics. 61(SF). SF1002–SF1002. 6 indexed citations
4.
Uomoto, Miyuki, et al.. (2022). Atomic diffusion bonding in air using Ag films. Japanese Journal of Applied Physics. 61(SF). SF1003–SF1003. 1 indexed citations
5.
Uomoto, Miyuki, et al.. (2022). Atomic diffusion bonding with oxide underlayers using Al and amorphous Si films for high optical density applications. Japanese Journal of Applied Physics. 61(SF). SF1011–SF1011.
7.
Takahashi, Yuichi, et al.. (2019). Atomic diffusion bonding using oxide underlayers for optical applications. Japanese Journal of Applied Physics. 59(SB). SBBC03–SBBC03. 6 indexed citations
8.
Uomoto, Miyuki, et al.. (2019). Rearrangement of crystal lattice at a Ag/Ag and Au/Au bonded interface in atomic diffusion bonding. Japanese Journal of Applied Physics. 59(SB). SBBC01–SBBC01. 4 indexed citations
9.
Uomoto, Miyuki & T. Shimatsu. (2019). Atomic diffusion bonding of Si wafers using thin Nb films. Japanese Journal of Applied Physics. 59(SB). SBBC04–SBBC04. 7 indexed citations
10.
11.
Yamada, Yuki, Masahiro Nada, Miyuki Uomoto, et al.. (2019). Minority-electron transport through atomic-diffusion-bonded InGaAs/a-Ge/InGaAs structure studied by photodiode characterization. Japanese Journal of Applied Physics. 59(1). 16501–16501. 1 indexed citations
12.
Saito, Tetsuichiro, et al.. (2019). Sputter film deposition to fabricate thick oxide films with extremely smooth surface suitable for room-temperature bonding. Japanese Journal of Applied Physics. 59(SB). SBBC02–SBBC02. 1 indexed citations
13.
Uomoto, Miyuki & T. Shimatsu. (2019). Atomic Diffusion Bonding of Wafers using Thin Nb Films. 65–65. 3 indexed citations
15.
Mu, Fengwen, Miyuki Uomoto, T. Shimatsu, et al.. (2018). De-bondable SiC SiC wafer bonding via an intermediate Ni nano-film. Applied Surface Science. 465. 591–595. 17 indexed citations
16.
Ichikawa, M., Shinya Endo, Akira Fujioka, et al.. (2016). (Invited) High Output Power Deep Ultraviolet Light-Emitting Diodes with Hemispherical Lenses Fabricated Using Room Temperature Bonding. ECS Transactions. 75(9). 53–65. 7 indexed citations
17.
Uomoto, Miyuki & T. Shimatsu. (2016). Necessary Thickness of Au Capping Layers for Room Temperature Bonding of Wafers in Air Using Thin Metal Films with Au Capping Layers. ECS Transactions. 75(9). 67–76. 4 indexed citations
18.
Ebizuka, Noboru, Takayuki Okamoto, Takuya Hosobata, et al.. (2016). Novel diffraction gratings for next generation spectrographs with high spectral dispersion. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 9912. 99122Z–99122Z. 5 indexed citations
19.
Uomoto, Miyuki, et al.. (2014). Room Temperature Bonding of Wafers Using Au Films with Various Holding Times in Air. Journal of The Japan Institute of Electronics Packaging. 17(5). 431–435. 3 indexed citations
20.
Shimatsu, T. & Miyuki Uomoto. (2013). Room Temperature Bonding of Wafers with Thin Nanocrystalline Metal Films and Its Application to Devices Fabrication. Journal of the Japan Society for Precision Engineering. 79(8). 710–713. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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