Fengwen Mu

2.2k citations

77 papers · 1.7k · h-index 24

Impact in

Electronic, Optical and Magnetic Materials top 5%
- Ga2O3 and related materials
Condensed Matter Physics top 5%
- GaN-based semiconductor devices and materials

Papers in

Electrical and Electronic Engineering 62
- 3D IC and TSV technologies 34
- Electronic Packaging and Soldering Technologies 22
- Silicon Carbide Semiconductor Technologies 22
- Semiconductor materials and devices 20
Materials Chemistry 23
- ZnO doping and properties 9

Co-authors: Tadatomo Suga (53 shared papers)Xin Wu (7 shared papers)Haiyan Zhao (4 shared papers)Zhe Cheng (4 shared papers)Samuel Graham (4 shared papers)Ran He (3 shared papers)Xin Ou (14 shared papers)Tiangui You (13 shared papers)
Journals: ACS Applied Materials & Interfaces (6 papers)Journal of Alloys and Compounds (4 papers)Applied Surface Science (3 papers)ECS Journal of Solid State Science and Technology (3 papers)ACS Applied Electronic Materials (2 papers)
Partner nations: Japan China United States

In The Last Decade

Fengwen Mu

71 papers receiving 1.6k citations

Peers

Countries citing papers authored by Fengwen Mu

Since Specialization

Citations

This map shows the geographic impact of Fengwen Mu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fengwen Mu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fengwen Mu more than expected).

Fields of papers citing papers by Fengwen Mu

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Fengwen Mu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fengwen Mu. The network helps show where Fengwen Mu may publish in the future.

Co-authors

The 25 scholars most cited alongside Fengwen Mu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Fengwen Mu Line = papers co-authored together Fengwen Mu links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

Showing the 20 most-cited of 77 papers — load more, or switch the sort, to bring in the rest.

#	Work
1	Interfacial Thermal Conductance across Room-Temperature-Bonded GaN/Diamond Interfaces for GaN-on-Diamond Devices ACS Applied Materials & Interfaces ·Zhe Cheng, Fengwen Mu, Luke Yates, Tadatomo Suga, Samuel Graham	2020	161
2	High Thermal Boundary Conductance across Bonded Heterogeneous GaN–SiC Interfaces ACS Applied Materials & Interfaces ·Fengwen Mu, Zhe Cheng, Jingjing Shi, Seongbin Shin, Bin Xu, Junichiro Shiomi, Samuel Graham, Tadatomo Suga	2019	111
3	Room temperature GaN-diamond bonding for high-power GaN-on-diamond devices Scripta Materialia ·Fengwen Mu, Ran He, Tadatomo Suga	2018	99
4	Recent progress in the synthesis of graphene/CNT composites and the energy-related applications Journal of Material Science and Technology ·Xin Wu, Fengwen Mu, Haiyan Zhao	2019	97
5	Thermal Transport across Ion-Cut Monocrystalline β-Ga₂O₃ Thin Films and Bonded β-Ga₂O₃–SiC Interfaces ACS Applied Materials & Interfaces ·Zhe Cheng, Fengwen Mu, Tiangui You, Wenhui Xu, Jingjing Shi, Michael E. Liao, Yekan Wang, Kenny Huynh, Tadatomo Suga, Mark S. Goorsky, Xin Ou, Samuel Graham	2020	88
6	Graphene and Graphene-Based Nanomaterials for DNA Detection: A Review Molecules ·Xin Wu, Fengwen Mu, Yinghui Wang, Haiyan Zhao	2018	69
7	First Demonstration of Waferscale Heterogeneous Integration of Ga₂O₃ MOSFETs on SiC and Si Substrates by Ion-Cutting Process The HKU Scholars Hub (University of Hong Kong) ·Wenhui Xu, Yibo Wang, Tiangui You, Xin Ou, Genquan Han, Haodong Hu, Shibin Zhang, Fengwen Mu, Tadatomo Suga, Yuhao Zhang, Yue Hao, Xi Wang	2019	65
8	Direct wafer bonding of Ga2O3–SiC at room temperature Ceramics International ·Yang Xu, Fengwen Mu, Yinghui Wang, Dapeng Chen, Xin Ou, Tadatomo Suga	2018	54
9	Three-dimensional printing of graphene-based materials and the application in energy storage Materials Today Advances ·Xin Wu, Fengwen Mu, Ziqi Lin	2021	52
10	Single-Crystalline 3C-SiC anodically Bonded onto Glass: An Excellent Platform for High-Temperature Electronics and Bioapplications ACS Applied Materials & Interfaces ·Hoang‐Phuong Phan, Han‐Hao Cheng, Toan Dinh, Barry Wood, Tuan‐Khoa Nguyen, Fengwen Mu, Harshad Kamble, Raja Vadivelu, Glenn M. Walker, Leonie Hold, Alan Iacopi, Ben Haylock, Dzung Viet Dao, Mirko Lobino, Tadatomo Suga, Nam‐Trung Nguyen	2017	51
11	Low Temperature Bonding of Cu Metal through Sintering of Ag Nanoparticles for High Temperature Electronic Application Guisheng Zou, Jianfeng Yan, Fengwen Mu, Aiping Wu, Ren Jialie, Anming Hu	2010	48
12	β-Ga2O3 MOSFETs on the Si substrate fabricated by the ion-cutting process Science China Physics Mechanics and Astronomy ·Yibo Wang, Wenhui Xu, Tiangui You, Fengwen Mu, Haodong Hu, Yan Liu, Hao Huang, Tadatomo Suga, Genquan Han, Xin Ou, Yue Hao	2020	43
13	Efficient thermal dissipation in wafer-scale heterogeneous integration of single-crystalline β-Ga2O3 thin film on SiC Fundamental Research ·Wenhui Xu, Tiangui You, Yibo Wang, Zhenghao Shen, K. Liu, Lianghui Zhang, Huarui Sun, Ruijie Qian, Zhenghua An, Fengwen Mu, Tadatomo Suga, Genquan Han, Xin Ou, Yue Hao, Xi Wang	2021	42
14	Silicon carbide wafer bonding by modified surface activated bonding method Japanese Journal of Applied Physics ·Tadatomo Suga, Fengwen Mu, Masahisa Fujino, Yoshikazu Takahashi, Haruo Nakazawa, Kenichi Iguchi	2015	41
15	A comparison study: Direct wafer bonding of SiC–SiC by standard surface-activated bonding and modified surface-activated bonding with Si-containing Ar ion beam Applied Physics Express ·Fengwen Mu, Kenichi Iguchi, Haruo Nakazawa, Yoshikazu Takahashi, Masahisa Fujino, Ran He, Tadatomo Suga	2016	40
16	GaN-Si direct wafer bonding at room temperature for thin GaN device transfer after epitaxial lift off Applied Surface Science ·Fengwen Mu, Yuki Morino, Kathleen Jerchel, Masahisa Fujino, Tadatomo Suga	2017	37
17	Thermal Visualization of Buried Interfaces Enabled by Ratio Signal and Steady-State Heating of Time-Domain Thermoreflectance ACS Applied Materials & Interfaces ·Zhe Cheng, Fengwen Mu, Xiaoyang Ji, Tiangui You, Wenhui Xu, Tadatomo Suga, Xin Ou, David G. Cahill, Samuel Graham	2021	34
18	Suppression of interface states between nitride-based gate dielectrics and ultrathin-barrier AlGaN/GaN heterostructure with in situ remote plasma pretreatments Applied Physics Letters ·Fuqiang Guo, Sen Huang, Xinhua Wang, Tiantian Luan, Wen Shi, Kexin Deng, Jie Fan, Haibo Yin, Jingyuan Shi, Fengwen Mu, Wei Ke, Xinyu Liu	2021	30
19	Channel Properties of Ga₂O₃-on-SiC MOSFETs IEEE Transactions on Electron Devices ·Yibo Wang, Wenhui Xu, Genquan Han, Tiangui You, Fengwen Mu, Haodong Hu, Yan Liu, Xinchuang Zhang, Hao Huang, Tadatomo Suga, Xin Ou, Xiaohua Ma, Yue Hao	2021	30
20	Direct wafer bonding of GaN-SiC for high power GaN-on-SiC devices Materialia ·Fengwen Mu, Yinghui Wang, Ran He, Tadatomo Suga	2018	27

About Fengwen Mu

Fengwen Mu is a scholar working on Electrical and Electronic Engineering, Materials Chemistry, Electronic, Optical and Magnetic Materials, Ceramics and Composites and Condensed Matter Physics, having authored 77 papers that have together received 1.7k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (34 papers), Electronic Packaging and Soldering Technologies (22 papers), Silicon Carbide Semiconductor Technologies (22 papers), Semiconductor materials and devices (20 papers), Advanced ceramic materials synthesis (17 papers), Ga2O3 and related materials (15 papers), GaN-based semiconductor devices and materials (15 papers) and ZnO doping and properties (9 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (520 citations), Condensed Matter Physics (302 citations), Materials Chemistry (944 citations), Ceramics and Composites (114 citations) and Electrical and Electronic Engineering (971 citations). Fengwen Mu has collaborated with scholars based in Japan, China and United States. Frequent co-authors include Tadatomo Suga, Xin Wu, Haiyan Zhao, Zhe Cheng, Samuel Graham, Ran He, Xin Ou, Tiangui You, Luke Yates and Masahisa Fujino. Their work appears in journals such as ACS Applied Materials & Interfaces, Journal of Alloys and Compounds, Applied Surface Science, ECS Journal of Solid State Science and Technology and ACS Applied Electronic Materials.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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