Ming‐Hsien Lin

483 total citations
35 papers, 369 citations indexed

About

Ming‐Hsien Lin is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, Ming‐Hsien Lin has authored 35 papers receiving a total of 369 indexed citations (citations by other indexed papers that have themselves been cited), including 25 papers in Electrical and Electronic Engineering, 21 papers in Electronic, Optical and Magnetic Materials and 7 papers in Materials Chemistry. Recurrent topics in Ming‐Hsien Lin's work include Copper Interconnects and Reliability (18 papers), Semiconductor materials and devices (16 papers) and Electronic Packaging and Soldering Technologies (15 papers). Ming‐Hsien Lin is often cited by papers focused on Copper Interconnects and Reliability (18 papers), Semiconductor materials and devices (16 papers) and Electronic Packaging and Soldering Technologies (15 papers). Ming‐Hsien Lin collaborates with scholars based in Taiwan and United States. Ming‐Hsien Lin's co-authors include A. S. Oates, S. Kou, Chung-Chi Hsieh, Sindo Kou, Chang-Sheng Lin, Ke‐Horng Chen, Ying-Hsi Lin, Richard Wong, Seung‐Ryul Moon and Yu-Tao Yang and has published in prestigious journals such as IEEE Transactions on Electron Devices, Journal of Crystal Growth and Computers & Industrial Engineering.

In The Last Decade

Ming‐Hsien Lin

35 papers receiving 349 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Ming‐Hsien Lin Taiwan 11 307 200 54 48 28 35 369
Guanzhou Ren China 12 205 0.7× 67 0.3× 61 1.1× 54 1.1× 39 1.4× 27 336
Emil Cazacu Romania 10 181 0.6× 150 0.8× 24 0.4× 42 0.9× 12 0.4× 77 280
Neophytos Lophitis United Kingdom 13 373 1.2× 48 0.2× 52 1.0× 17 0.4× 26 0.9× 66 500
Martin Pfost Germany 17 794 2.6× 60 0.3× 51 0.9× 49 1.0× 16 0.6× 111 835
Knut Erik Knutsen Norway 11 201 0.7× 150 0.8× 23 0.4× 345 7.2× 35 1.3× 22 416
Ling Xia China 9 260 0.8× 64 0.3× 54 1.0× 41 0.9× 12 0.4× 32 337
Dean Hamilton United Kingdom 12 413 1.3× 85 0.4× 38 0.7× 83 1.7× 10 0.4× 35 483
Jinhyun Noh United States 13 288 0.9× 173 0.9× 16 0.3× 199 4.1× 10 0.4× 23 449
S. Quondam Antonio Italy 12 205 0.7× 225 1.1× 38 0.7× 20 0.4× 19 0.7× 43 363
Jiahao Niu United States 16 661 2.2× 40 0.2× 37 0.7× 40 0.8× 16 0.6× 39 761

Countries citing papers authored by Ming‐Hsien Lin

Since Specialization
Citations

This map shows the geographic impact of Ming‐Hsien Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ming‐Hsien Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ming‐Hsien Lin more than expected).

Fields of papers citing papers by Ming‐Hsien Lin

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ming‐Hsien Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ming‐Hsien Lin. The network helps show where Ming‐Hsien Lin may publish in the future.

Co-authorship network of co-authors of Ming‐Hsien Lin

This figure shows the co-authorship network connecting the top 25 collaborators of Ming‐Hsien Lin. A scholar is included among the top collaborators of Ming‐Hsien Lin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ming‐Hsien Lin. Ming‐Hsien Lin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Lin, Ming‐Hsien, et al.. (2022). A 16nm All-Digital Hardware Monitor for Evaluating Electromigration Effects in Signal Interconnects Through Bit-Error-Rate Tracking. IEEE Transactions on Device and Materials Reliability. 22(2). 194–204. 5 indexed citations
2.
Lin, Chang-Sheng & Ming‐Hsien Lin. (2021). Output-Only Modal Estimation Using Eigensystem Realization Algorithm with Nonstationary Data Correlation. Applied Sciences. 11(7). 3088–3088. 7 indexed citations
3.
Lin, Chang-Sheng, et al.. (2021). Modal Verification and Strength Analysis of Bladed Rotors of Turbine in Rated Working Conditions. Applied Sciences. 11(14). 6306–6306. 6 indexed citations
4.
Lin, Chang-Sheng & Ming‐Hsien Lin. (2020). System identification from stationary ambient response using wavelet analysis with variable modal scales. Archive of Applied Mechanics. 91(3). 841–858. 1 indexed citations
5.
6.
Lin, Ming‐Hsien, et al.. (2019). Novel Precoding Structures Design of Multiuser with SWIPT for MIMO Downlink Systems. 28–32. 1 indexed citations
7.
Lin, Ming‐Hsien & A. S. Oates. (2017). Electromigration Failure Time Model of General Circuit-Like Interconnects. IEEE Transactions on Device and Materials Reliability. 17(2). 381–398. 9 indexed citations
8.
Lin, Ming‐Hsien & A. S. Oates. (2016). Electromigration failure of circuit interconnects. 73. 5B–2. 9 indexed citations
9.
Lin, Ming‐Hsien & A. S. Oates. (2015). Mechanisms of electromigration under AC and pulsed-DC stress in Cu/low-k dual damascene interconnects. 47. 2D.2.1–2D.2.6. 3 indexed citations
10.
Lin, Ming‐Hsien & A. S. Oates. (2013). AC and pulsed-DC stress electromigration failure mechanisms in Cu interconnects. 1–3. 13 indexed citations
11.
Oates, A. S. & Ming‐Hsien Lin. (2012). The scaling of electromigration lifetimes. 6B.2.1–6B.2.7. 24 indexed citations
12.
Lin, Ming‐Hsien & A. S. Oates. (2011). The Effects of Al Doping and Metallic-Cap Layers on Electromigration Transport Mechanisms in Copper Nanowires. IEEE Transactions on Device and Materials Reliability. 11(4). 540–547. 17 indexed citations
13.
14.
Lai, Jih‐Sheng, et al.. (2007). A General-Purpose Three-Phase DC-DC Converter Building Block for Fuel Cell Applications. 1639–1644. 6 indexed citations
15.
Lai, Jih‐Sheng, et al.. (2007). A versatile three‐phase dc‐dc converter circuit for fuel cell applications. Journal of the Chinese Institute of Engineers. 30(7). 1145–1152. 2 indexed citations
16.
Lin, Ming‐Hsien, et al.. (2005). Electromigration Lifetime Improvement of Copper Interconnect by Cap/Dielectric Interface Treatment and Geometrical Design. IEEE Transactions on Electron Devices. 52(12). 2602–2608. 37 indexed citations
17.
Lin, Ming‐Hsien & S. Kou. (1995). Segregation control in Czochralski pulling of InSb single crystals. Journal of Crystal Growth. 152(4). 256–260. 9 indexed citations
18.
Lin, Ming‐Hsien & S. Kou. (1994). Further report on dopant segregation control in Czochralski crystal growth with a wetted float. Journal of Crystal Growth. 135(3-4). 643–645. 18 indexed citations
19.
Lin, Ming‐Hsien & Sindo Kou. (1993). Crystal pulling with a floating nonwetted shaper. Journal of Crystal Growth. 130(3-4). 507–510. 4 indexed citations
20.
Lin, Ming‐Hsien & Sindo Kou. (1993). Crystal pulling with floating wetted shapers. Journal of Crystal Growth. 132(3-4). 467–470. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Guanzhou Ren Breakdown of academic impact, for papers by Emil Cazacu Breakdown of academic impact, for papers by Neophytos Lophitis Breakdown of academic impact, for papers by Martin Pfost Breakdown of academic impact, for papers by Knut Erik Knutsen Breakdown of academic impact, for papers by Ling Xia Breakdown of academic impact, for papers by Dean Hamilton Breakdown of academic impact, for papers by Jinhyun Noh Breakdown of academic impact, for papers by S. Quondam Antonio Breakdown of academic impact, for papers by Jiahao Niu
Rankless by CCL
2026