Weishen Chu

540 total citations
21 papers, 428 citations indexed

About

Weishen Chu is a scholar working on Electrical and Electronic Engineering, Computer Vision and Pattern Recognition and Biomedical Engineering. According to data from OpenAlex, Weishen Chu has authored 21 papers receiving a total of 428 indexed citations (citations by other indexed papers that have themselves been cited), including 10 papers in Electrical and Electronic Engineering, 5 papers in Computer Vision and Pattern Recognition and 4 papers in Biomedical Engineering. Recurrent topics in Weishen Chu's work include Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (5 papers) and Image Enhancement Techniques (4 papers). Weishen Chu is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (5 papers) and Image Enhancement Techniques (4 papers). Weishen Chu collaborates with scholars based in United States, China and New Zealand. Weishen Chu's co-authors include Jingchun Zhou, Weishi Zhang, Paul S. Ho, Wei Li, Cheng Sun, Evan Baker, Jianmin Hu, Xiangfan Chen, Henry Oliver T. Ware and Yi Lin and has published in prestigious journals such as ACS Applied Materials & Interfaces, Optics Express and International Journal of Mechanical Sciences.

In The Last Decade

Weishen Chu

20 papers receiving 412 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Weishen Chu United States 11 161 134 73 61 43 21 428
Zepeng Wang China 12 95 0.6× 126 0.9× 20 0.3× 114 1.9× 113 2.6× 34 478
Lixia Wang China 11 55 0.3× 221 1.6× 36 0.5× 29 0.5× 97 2.3× 52 447
Hongyuan Yu China 13 121 0.8× 107 0.8× 30 0.4× 93 1.5× 57 1.3× 35 557
Hong Ye China 8 43 0.3× 174 1.3× 12 0.2× 27 0.4× 76 1.8× 19 344
Hyunchul Kang South Korea 13 63 0.4× 166 1.2× 10 0.1× 50 0.8× 77 1.8× 61 539
Mumtaj Begam Malaysia 15 63 0.4× 389 2.9× 27 0.4× 42 0.7× 80 1.9× 54 678
Siwei Lu China 9 79 0.5× 20 0.1× 23 0.3× 57 0.9× 22 0.5× 29 279
Wenqi Tang China 9 290 1.8× 49 0.4× 250 3.4× 32 0.5× 82 1.9× 36 598
Sukho Lee South Korea 14 51 0.3× 223 1.7× 22 0.3× 73 1.2× 212 4.9× 70 587

Countries citing papers authored by Weishen Chu

Since Specialization
Citations

This map shows the geographic impact of Weishen Chu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Weishen Chu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Weishen Chu more than expected).

Fields of papers citing papers by Weishen Chu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Weishen Chu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Weishen Chu. The network helps show where Weishen Chu may publish in the future.

Co-authorship network of co-authors of Weishen Chu

This figure shows the co-authorship network connecting the top 25 collaborators of Weishen Chu. A scholar is included among the top collaborators of Weishen Chu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Weishen Chu. Weishen Chu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Liu, Xiaoming, Danni Huang, Jingyu Yao, et al.. (2025). From Black Box to Glass Box: A Practical Review of Explainable Artificial Intelligence (XAI). AI. 6(11). 285–285.
2.
Zhang, Bingli, et al.. (2023). Path-following control method for articulated vehicles based on dual heuristic programming. Proceedings of the Institution of Mechanical Engineers Part C Journal of Mechanical Engineering Science. 238(3). 799–810. 1 indexed citations
3.
Zhou, Jingchun, et al.. (2022). Underwater image restoration via backscatter pixel prior and color compensation. Engineering Applications of Artificial Intelligence. 111. 104785–104785. 109 indexed citations
4.
Chu, Weishen, et al.. (2022). An Analytical Model for Thin Film Pattern-dependent Asymmetric Wafer Warpage Prediction. 1–4. 4 indexed citations
5.
Feng, Zhenan, et al.. (2022). Complex characteristics analysis of time-delay digital supply chain driven by cybersecurity. Kybernetes. 52(9). 3362–3390. 8 indexed citations
6.
Zhou, Jingchun, et al.. (2022). Underwater image enhancement method with light scattering characteristics. Computers & Electrical Engineering. 100. 107898–107898. 46 indexed citations
7.
8.
Zhou, Jingchun, et al.. (2022). Underwater Diver Image Enhancement via Dual-Guided Filtering. Computer Modeling in Engineering & Sciences. 131(2). 1063–1081. 1 indexed citations
9.
Wang, Cong, Zhenyu Wang, Decheng Zhao, et al.. (2021). Core–Shell Co2VO4/Carbon Composite Anode for Highly Stable and Fast-Charging Sodium-Ion Batteries. ACS Applied Materials & Interfaces. 13(46). 55020–55028. 77 indexed citations
10.
Chu, Weishen, et al.. (2021). Finite Element Analysis of Peltier Effect based Thermoelectric Energy Conservation Cooling System for Microprocessors. IOP Conference Series Earth and Environmental Science. 804(3). 32056–32056. 1 indexed citations
11.
12.
Chu, Weishen, et al.. (2021). Sampling Strategy Analysis of Machine Learning Models for Energy Consumption Prediction. 77–81. 22 indexed citations
13.
14.
Chu, Weishen, Paul S. Ho, & Wei Li. (2021). An Adaptive Machine Learning Method Based on Finite Element Analysis for Ultra Low-k Chip Package Design. IEEE Transactions on Components Packaging and Manufacturing Technology. 11(9). 1435–1441. 36 indexed citations
15.
Chu, Weishen, Tengfei Jiang, & Paul S. Ho. (2021). Effect of Wiring Density and Pillar Structure on Chip Packaging Interaction for Mixed-Signal Cu Low k Chips. IEEE Transactions on Device and Materials Reliability. 21(3). 290–296. 14 indexed citations
16.
Wu, Hongyu & Weishen Chu. (2021). Machine Learning assisted Structural Design Optimization for Flip Chip Packages. 132–136. 3 indexed citations
17.
18.
Chu, Weishen, et al.. (2020). Effects of Process Parameters on Graphene Growth Via Low-Pressure Chemical Vapor Deposition. Journal of Micro and Nano-Manufacturing. 8(3). 11 indexed citations
19.
Chen, Xiangfan, Henry Oliver T. Ware, Evan Baker, et al.. (2017). The Development of an All-polymer-based Piezoelectric Photocurable Resin for Additive Manufacturing. Procedia CIRP. 65. 157–162. 40 indexed citations
20.
Chu, Weishen & H. D. Conway. (1970). A numerical method for computing the stresses around an axisymmetrical inclusion. International Journal of Mechanical Sciences. 12(7). 575–588. 7 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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