Min Miao
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Electrical and Thermal Properties of Materials
- Electromagnetic Compatibility and Noise Suppression
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- Additive Manufacturing and 3D Printing Technologies
Papers in
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- 3D IC and TSV technologies 78
- Electronic Packaging and Soldering Technologies 45
- Electrical and Thermal Properties of Materials 22
- Semiconductor materials and devices 18
- Electromagnetic Compatibility and Noise Suppression 16
- Microwave Engineering and Waveguides 15
- Advanced MEMS and NEMS Technologies 14
- Co-authors
- Yufeng JinShenglin MaJin‐Ku LiuJing ChenYangfei ZhangXiaole CuiXiaogang WangYanan Xue
In The Last Decade
Min Miao
134 papers receiving 676 citations
Peers
Comparison fields: 5 of 58
- Electrical and Electronic Engineering 529
- Automotive Engineering 54
- Materials Chemistry 170
- Polymers and Plastics 38
- Ceramics and Composites 15
Countries citing papers authored by Min Miao
This map shows the geographic impact of Min Miao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Min Miao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Min Miao more than expected).
Fields of papers citing papers by Min Miao
This network shows the impact of papers produced by Min Miao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Min Miao. The network helps show where Min Miao may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Min Miao, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 1 | |
| 2 | 2025 | 0 | |
| 3 | 2024 | 1 | |
| 4 | 2024 | 3 | |
| 5 | 2024 | 1 | |
| 6 | 2024 | 4 | |
| 7 | 2024 | 6 | |
| 8 | 2023 | 12 | |
| 9 | 2023 | 1 | |
| 10 | 2023 | 1 | |
| 11 | A new stage for microsystem integration-the integrated development of integrated circuits chips and system-level electronic packaging | 2021 | 0 |
| 12 | 2019 | 7 | |
| 13 | 2017 | 31 | |
| 14 | 2016 | 1 | |
| 15 | 2016 | 1 | |
| 16 | 2013 | 1 | |
| 17 | 2012 | 3 | |
| 18 | 2011 | 4 | |
| 19 | Simulation and optimization design of multi-orifice hydraulic buffer | 2007 | 2 |
| 20 | 2002 | 1 |
About Min Miao
Min Miao is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Materials Chemistry, Hardware and Architecture and Ceramics and Composites, having authored 146 papers that have together received 702 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (78 papers), Electronic Packaging and Soldering Technologies (45 papers), Electrical and Thermal Properties of Materials (22 papers), Semiconductor materials and devices (18 papers), Electromagnetic Compatibility and Noise Suppression (16 papers), Microwave Engineering and Waveguides (15 papers), Advanced MEMS and NEMS Technologies (14 papers) and Ferroelectric and Piezoelectric Materials (12 papers). The work is most often cited by research in Electrical and Electronic Engineering (529 citations), Automotive Engineering (54 citations), Materials Chemistry (170 citations), Polymers and Plastics (38 citations) and Ceramics and Composites (15 citations). Min Miao has collaborated with scholars based in China, Singapore and Egypt. Frequent co-authors include Yufeng Jin, Yufeng Jin, Shenglin Ma, Jin‐Ku Liu, Jing Chen, Yangfei Zhang, Xiaole Cui, Xiaogang Wang, Yanan Xue and Yi Lu. Their work appears in journals such as ACS Applied Materials & Interfaces, Journal of Nanoelectronics and Optoelectronics, Progress in Organic Coatings, International Journal of Heat and Mass Transfer and Dyes and Pigments.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.