Shenglin Ma

879 total citations
105 papers, 645 citations indexed

About

Shenglin Ma is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanical Engineering. According to data from OpenAlex, Shenglin Ma has authored 105 papers receiving a total of 645 indexed citations (citations by other indexed papers that have themselves been cited), including 87 papers in Electrical and Electronic Engineering, 29 papers in Biomedical Engineering and 13 papers in Mechanical Engineering. Recurrent topics in Shenglin Ma's work include 3D IC and TSV technologies (67 papers), Electronic Packaging and Soldering Technologies (42 papers) and Semiconductor materials and devices (14 papers). Shenglin Ma is often cited by papers focused on 3D IC and TSV technologies (67 papers), Electronic Packaging and Soldering Technologies (42 papers) and Semiconductor materials and devices (14 papers). Shenglin Ma collaborates with scholars based in China, United States and Switzerland. Shenglin Ma's co-authors include Yufeng Jin, Yanming Xia, Yufeng Jin, Lifeng Qin, Min Miao, Wei Zhou, Yong Tang, Wenjun Deng, Junpeng Zhang and Longsheng Lu and has published in prestigious journals such as ACS Nano, Applied Physics Letters and Chemical Engineering Journal.

In The Last Decade

Shenglin Ma

91 papers receiving 623 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Shenglin Ma China 12 421 224 126 117 51 105 645
Jae‐Hoon Lee South Korea 14 378 0.9× 126 0.6× 176 1.4× 66 0.6× 54 1.1× 75 602
Huangping Yan China 14 219 0.5× 233 1.0× 163 1.3× 40 0.3× 93 1.8× 50 558
Ju-Hyeon Shin South Korea 14 406 1.0× 291 1.3× 142 1.1× 35 0.3× 83 1.6× 22 687
Quan Shen China 14 153 0.4× 93 0.4× 132 1.0× 79 0.7× 64 1.3× 32 434
Hyunki Kim South Korea 13 199 0.5× 159 0.7× 311 2.5× 214 1.8× 145 2.8× 64 618
T. Kaźmierczak Poland 11 210 0.5× 208 0.9× 156 1.2× 94 0.8× 98 1.9× 24 663
Muqi Ouyang United States 9 168 0.4× 185 0.8× 116 0.9× 103 0.9× 33 0.6× 29 518
Jincheng Lei United States 13 253 0.6× 105 0.5× 142 1.1× 70 0.6× 24 0.5× 45 446
Hongtao Li China 15 435 1.0× 133 0.6× 334 2.7× 40 0.3× 23 0.5× 44 694

Countries citing papers authored by Shenglin Ma

Since Specialization
Citations

This map shows the geographic impact of Shenglin Ma's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Shenglin Ma with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Shenglin Ma more than expected).

Fields of papers citing papers by Shenglin Ma

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Shenglin Ma. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Shenglin Ma. The network helps show where Shenglin Ma may publish in the future.

Co-authorship network of co-authors of Shenglin Ma

This figure shows the co-authorship network connecting the top 25 collaborators of Shenglin Ma. A scholar is included among the top collaborators of Shenglin Ma based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Shenglin Ma. Shenglin Ma is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Zhao, K. X., Fan Yang, Jiantao Song, et al.. (2025). Experimental observation of nonreciprocal magnonic frequency combs. AIP Advances. 15(1). 1 indexed citations
2.
Chen, Luming, Shitao Wang, Zhixiang Wei, et al.. (2025). Research on high-power high-frequency electrical transmission characteristics of through glass via interconnections. Microelectronics Reliability. 172. 115828–115828.
3.
4.
Wang, Weiyu, Jiaming Xu, Haiyan Chen, et al.. (2023). 3D-FEM thermal transfer analysis of MEMS-based thermal infrared emitter integrated with microchannel heatsink. Infrared Physics & Technology. 130. 104596–104596. 4 indexed citations
5.
Ma, Shenglin, Yan Wang, Luming Chen, et al.. (2023). Research progress on additives and mechanism of copper electroplating for TSV. Scientia Sinica Chimica. 53(10). 1891–1905. 1 indexed citations
6.
Lian, Tingting, Yanming Xia, Xiaofeng Yang, et al.. (2022). Thermal property evaluation of a 2.5D integration method with device level microchannel direct cooling for a high-power GaN HEMT device. Microsystems & Nanoengineering. 8(1). 119–119. 21 indexed citations
7.
Hu, Minghan, Yanming Xia, Xiaobao Cao, et al.. (2022). Multi-compartment supracapsules made from nano-containers towards programmable release. Materials Horizons. 9(6). 1641–1648. 12 indexed citations
8.
Wang, Chen, et al.. (2021). A Novel Ultrasonic TOF Ranging System Using AlN Based PMUTs. Micromachines. 12(3). 284–284. 19 indexed citations
9.
Ma, Shenglin, et al.. (2019). Design, fabrication, and radio frequency property evaluation of a through-glass-via interposer for 2.5D radio frequency integration. Journal of Micromechanics and Microengineering. 29(7). 75002–75002. 10 indexed citations
10.
11.
Li, Jiwei, Shenglin Ma, Yufeng Jin, et al.. (2018). Design, Fabrication and Characterization of a Novel TSV Interposer Integrated Inductor for RF Applications. 2492–2497. 4 indexed citations
12.
13.
Ma, Shenglin, et al.. (2016). Process Development of Through-Glass-Via (TGV) Interposer for Radio Frequency (RF) Applications. Scientia Forestalis.
14.
Ma, Shenglin, et al.. (2016). Process development of a new TGV interposer for wafer level package of inertial MEMS device. 983–987. 2 indexed citations
15.
16.
Xia, Yanming, Shenglin Ma, Lifeng Qin, Yufeng Jin, & Jing Chen. (2015). Fabrication of Microchannel embedded TSV interposer and its influence on TSV's electrical parameters. 699–704. 3 indexed citations
17.
Liu, Zhen Hua, et al.. (2013). Electrical characterization of integrated passive devices using thin film technology for 3D integration. Journal of Zhejiang University SCIENCE C. 14(4). 235–243. 1 indexed citations
18.
Ma, Shenglin, Zhiyuan Zhu, Meng Chen, et al.. (2012). Design and process development of a stacked SRAM memory chip module with TSV interconnection. 1925–1929. 3 indexed citations
19.
Miao, Min, Yuan Bian, Shenglin Ma, et al.. (2012). Understanding effect of additives in copper electroplating filling for through silicon via. 28. 1–3. 2 indexed citations
20.
Ma, Shenglin, et al.. (2011). Electrical modeling, simulation and SPICE model extraction of TSVs in silicon interposer. 171–174. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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