Shenglin Ma
- Electrical and Electronic Engineering top 10%
- Biomedical Engineering
- Materials Chemistry
- Mechanical Engineering
- Mechanics of Materials
- Topics
- 3D IC and TSV technologies (67 papers)Electronic Packaging and Soldering Technologies (42 papers)Semiconductor materials and devices (14 papers)
- Partner nations
- ChinaUnited StatesSwitzerland
In The Last Decade
Shenglin Ma
91 papers receiving 623 citations
Peers
Comparison fields: 5 of 65
- Electrical and Electronic Engineering 421
- Biomedical Engineering 224
- Materials Chemistry 126
- Mechanical Engineering 117
- Mechanics of Materials 51
Countries citing papers authored by Shenglin Ma
This map shows the geographic impact of Shenglin Ma's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Shenglin Ma with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Shenglin Ma more than expected).
Fields of papers citing papers by Shenglin Ma
This network shows the impact of papers produced by Shenglin Ma. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Shenglin Ma. The network helps show where Shenglin Ma may publish in the future.
Co-authorship network of co-authors of Shenglin Ma
This figure shows the co-authorship network connecting the top 25 collaborators of Shenglin Ma. A scholar is included among the top collaborators of Shenglin Ma based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Shenglin Ma. Shenglin Ma is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 0 | |
| 3 | 0 | |
| 4 | 4 | |
| 5 | 1 | |
| 6 | 21 | |
| 7 | 12 | |
| 8 | 19 | |
| 9 | 10 | |
| 10 | 0 | |
| 11 | 4 | |
| 12 | 2 | |
| 13 | Process Development of Through-Glass-Via (TGV) Interposer for Radio Frequency (RF) Applications | 0 |
| 14 | 2 | |
| 15 | 1 | |
| 16 | 3 | |
| 17 | 1 | |
| 18 | 3 | |
| 19 | 2 | |
| 20 | 2 |
About Shenglin Ma
Shenglin Ma is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Biomedical Engineering, having authored 105 papers that have together received 645 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (67 papers), Electronic Packaging and Soldering Technologies (42 papers) and Semiconductor materials and devices (14 papers). The work is most often cited by research in Electrical and Electronic Engineering (421 citations), Biomedical Engineering (224 citations) and Automotive Engineering (40 citations). Shenglin Ma has collaborated with scholars based in China, United States and Switzerland. Frequent co-authors include Yufeng Jin, Yanming Xia, Yufeng Jin, Lifeng Qin, Min Miao, Wei Zhou, Yong Tang, Wenjun Deng, Junpeng Zhang and Longsheng Lu. Their work appears in journals such as ACS Nano, Applied Physics Letters and Chemical Engineering Journal.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.