J. Reschke
- Mechanics of Materials top 5%
- Materials Chemistry
- Electrical and Electronic Engineering
- Mechanical Engineering
- Computational Mechanics
- Co-authors
- S. SchillerK. GoedickeV. W. J. H. KirchhoffSusanne SchneiderG. BeisterJ. StrümpfelU. HeisigK. Steinfelder
- Topics
- Metal and Thin Film Mechanics (7 papers)Copper Interconnects and Reliability (5 papers)Adhesion, Friction, and Surface Interactions (2 papers)
- Journals
- Thin Solid FilmsSurface and Coatings TechnologyJournal of Vacuum Science & Technology A Vacuum Surfaces and Films
- Partner nations
- Germany
In The Last Decade
J. Reschke
9 papers receiving 409 citations
Peers
Comparison fields: 5 of 34
- Mechanics of Materials 325
- Materials Chemistry 306
- Electrical and Electronic Engineering 244
- Mechanical Engineering 49
- Computational Mechanics 45
Countries citing papers authored by J. Reschke
This map shows the geographic impact of J. Reschke's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Reschke with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Reschke more than expected).
Fields of papers citing papers by J. Reschke
This network shows the impact of papers produced by J. Reschke. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Reschke. The network helps show where J. Reschke may publish in the future.
Co-authorship network of co-authors of J. Reschke
This figure shows the co-authorship network connecting the top 25 collaborators of J. Reschke. A scholar is included among the top collaborators of J. Reschke based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J. Reschke. J. Reschke is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 4 | |
| 3 | 3 | |
| 4 | 284 | |
| 5 | 40 | |
| 6 | 84 | |
| 7 | 16 | |
| 8 | 2 | |
| 9 | 4 |
About J. Reschke
J. Reschke is a scholar working on Mechanics of Materials, Electronic, Optical and Magnetic Materials and Surfaces, Coatings and Films, having authored 9 papers that have together received 438 indexed citations. Recurring topics across this work include Metal and Thin Film Mechanics (7 papers), Copper Interconnects and Reliability (5 papers) and Adhesion, Friction, and Surface Interactions (2 papers). The work is most often cited by research in Mechanics of Materials (325 citations), Materials Chemistry (306 citations) and Electrical and Electronic Engineering (244 citations). J. Reschke has collaborated with scholars based in Germany. Frequent co-authors include S. Schiller, K. Goedicke, V. W. J. H. Kirchhoff, Susanne Schneider, G. Beister, J. Strümpfel, U. Heisig, K. Steinfelder, M. Neumann and N. Schiller. Their work appears in journals such as Thin Solid Films, Surface and Coatings Technology and Journal of Vacuum Science & Technology A Vacuum Surfaces and Films.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.