J. Reschke

547 total citations
9 papers, 438 citations indexed

About

J. Reschke is a scholar working on Mechanics of Materials, Electronic, Optical and Magnetic Materials and Electrical and Electronic Engineering. According to data from OpenAlex, J. Reschke has authored 9 papers receiving a total of 438 indexed citations (citations by other indexed papers that have themselves been cited), including 7 papers in Mechanics of Materials, 5 papers in Electronic, Optical and Magnetic Materials and 3 papers in Electrical and Electronic Engineering. Recurrent topics in J. Reschke's work include Metal and Thin Film Mechanics (7 papers), Copper Interconnects and Reliability (5 papers) and Adhesion, Friction, and Surface Interactions (2 papers). J. Reschke is often cited by papers focused on Metal and Thin Film Mechanics (7 papers), Copper Interconnects and Reliability (5 papers) and Adhesion, Friction, and Surface Interactions (2 papers). J. Reschke collaborates with scholars based in Germany. J. Reschke's co-authors include S. Schiller, K. Goedicke, V. W. J. H. Kirchhoff, Susanne Schneider, G. Beister, J. Strümpfel, U. Heisig, K. Steinfelder, M. Neumann and N. Schiller and has published in prestigious journals such as Thin Solid Films, Surface and Coatings Technology and Journal of Vacuum Science & Technology A Vacuum Surfaces and Films.

In The Last Decade

J. Reschke

9 papers receiving 409 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
J. Reschke Germany	5	325	306	244	49	45	9	438
E.O. Ristolainen United States	7	284 0.9×	260 0.8×	155 0.6×	81 1.7×	30 0.7×	21	398
U. Heisig Germany	13	334 1.0×	270 0.9×	337 1.4×	31 0.6×	79 1.8×	26	508
G. Beister Germany	9	243 0.7×	272 0.9×	255 1.0×	21 0.4×	68 1.5×	13	426
H. Bäcker United Kingdom	9	504 1.6×	408 1.3×	376 1.5×	44 0.9×	106 2.4×	10	608
W. M. Posadowski Poland	10	282 0.9×	175 0.6×	226 0.9×	40 0.8×	42 0.9×	24	371
Petter Larsson Sweden	9	442 1.4×	395 1.3×	309 1.3×	68 1.4×	99 2.2×	10	568
R. Scholl United States	9	218 0.7×	170 0.6×	203 0.8×	24 0.5×	22 0.5×	20	323
S. Craig Australia	11	156 0.5×	185 0.6×	175 0.7×	69 1.4×	82 1.8×	18	426
Fred Fietzke Germany	10	322 1.0×	247 0.8×	213 0.9×	73 1.5×	24 0.5×	21	431
P.J. Rudnik United States	13	488 1.5×	351 1.1×	198 0.8×	108 2.2×	32 0.7×	17	563

Countries citing papers authored by J. Reschke

Since Specialization

Citations

This map shows the geographic impact of J. Reschke's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Reschke with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Reschke more than expected).

Fields of papers citing papers by J. Reschke

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. Reschke. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Reschke. The network helps show where J. Reschke may publish in the future.

Co-authorship network of co-authors of J. Reschke

This figure shows the co-authorship network connecting the top 25 collaborators of J. Reschke. A scholar is included among the top collaborators of J. Reschke based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J. Reschke. J. Reschke is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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9 of 9 papers shown

1.

Reschke, J., et al.. (1998). Transformer-free semiconductor switches for the energization of a pulsed PVD plasma. Surface and Coatings Technology. 98(1-3). 1240–1244. 1 indexed citations

2.

Schiller, N., J. Reschke, K. Goedicke, & M. Neumann. (1996). Application of the magnetron activated deposition process (MAD-process) to coat polymer films with alumina in web coaters. Surface and Coatings Technology. 86-87. 776–782. 4 indexed citations

3.

Reschke, J., K. Goedicke, & S. Schiller. (1995). The magnetron-activated deposition process. Surface and Coatings Technology. 76-77. 763–769. 3 indexed citations

4.

Schiller, S., et al.. (1993). Pulsed magnetron sputter technology. Surface and Coatings Technology. 61(1-3). 331–337. 284 indexed citations

5.

Reschke, J., et al.. (1993). Metal-carbon layers for industrial application in the automotive industry. Surface and Coatings Technology. 60(1-3). 531–535. 40 indexed citations

6.

Schiller, S., U. Heisig, G. Beister, et al.. (1987). Reactive d.c. high-rate sputtering as production technology. Surface and Coatings Technology. 33. 405–423. 84 indexed citations

7.

Schiller, S., et al.. (1987). TiN hard coatings deposited on high-speed steel substrates by reactive direct current magnetron sputtering. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 5(4). 2180–2183. 16 indexed citations

8.

Schiller, S., et al.. (1981). Advances in mechanical activation as a pretreatment process for vacuum deposition. Thin Solid Films. 83(1). 7–16. 2 indexed citations

9.

Schiller, S., et al.. (1980). Pretreatment of metallic substrates by mechanical activation. Thin Solid Films. 72(2). 351–359. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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