U. Heisig

785 total citations
26 papers, 508 citations indexed

About

U. Heisig is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering and Aerospace Engineering. According to data from OpenAlex, U. Heisig has authored 26 papers receiving a total of 508 indexed citations (citations by other indexed papers that have themselves been cited), including 20 papers in Mechanics of Materials, 18 papers in Electrical and Electronic Engineering and 8 papers in Aerospace Engineering. Recurrent topics in U. Heisig's work include Metal and Thin Film Mechanics (20 papers), Semiconductor materials and devices (9 papers) and High-Temperature Coating Behaviors (8 papers). U. Heisig is often cited by papers focused on Metal and Thin Film Mechanics (20 papers), Semiconductor materials and devices (9 papers) and High-Temperature Coating Behaviors (8 papers). U. Heisig collaborates with scholars based in Germany and Russia. U. Heisig's co-authors include S. Schiller, K. Steinfelder, K. Goedicke, J. Strümpfel, G. Beister, Peter Frach, J. Reschke, Jan Henneberger, H. Bilz and William K. Sieber and has published in prestigious journals such as Thin Solid Films, Surface and Coatings Technology and Journal of Vacuum Science & Technology A Vacuum Surfaces and Films.

In The Last Decade

U. Heisig

25 papers receiving 423 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
U. Heisig Germany 13 337 334 270 79 61 26 508
G. J. Kominiak United States 9 198 0.6× 263 0.8× 215 0.8× 118 1.5× 96 1.6× 13 437
J. Reschke Germany 5 244 0.7× 325 1.0× 306 1.1× 45 0.6× 43 0.7× 9 438
C.V. Deshpandey United States 13 261 0.8× 323 1.0× 376 1.4× 58 0.7× 50 0.8× 48 594
Kari Koski Finland 10 227 0.7× 167 0.5× 264 1.0× 28 0.4× 55 0.9× 12 405
H. Bäcker United Kingdom 9 376 1.1× 504 1.5× 408 1.5× 106 1.3× 33 0.5× 10 608
V. Orlinov Bulgaria 10 206 0.6× 204 0.6× 189 0.7× 65 0.8× 48 0.8× 27 344
C. G. Pacey Australia 6 248 0.7× 258 0.8× 297 1.1× 139 1.8× 47 0.8× 9 543
C.‐P. Klages Germany 16 285 0.8× 370 1.1× 447 1.7× 67 0.8× 63 1.0× 34 590
W. M. Posadowski Poland 10 226 0.7× 282 0.8× 175 0.6× 42 0.5× 88 1.4× 24 371
E.O. Ristolainen United States 7 155 0.5× 284 0.9× 260 1.0× 30 0.4× 40 0.7× 21 398

Countries citing papers authored by U. Heisig

Since Specialization
Citations

This map shows the geographic impact of U. Heisig's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by U. Heisig with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites U. Heisig more than expected).

Fields of papers citing papers by U. Heisig

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by U. Heisig. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by U. Heisig. The network helps show where U. Heisig may publish in the future.

Co-authorship network of co-authors of U. Heisig

This figure shows the co-authorship network connecting the top 25 collaborators of U. Heisig. A scholar is included among the top collaborators of U. Heisig based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with U. Heisig. U. Heisig is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Heisig, U., et al.. (2015). 40 Jahre industrielles Magnetron‐Sputtern in Europa. Vakuum in Forschung und Praxis. 27(6). 21–26. 3 indexed citations
2.
Frach, Peter, et al.. (1993). Aspects and results of long-term stable deposition of Al2O3 with high rate pulsed reactive magnetron sputtering. Surface and Coatings Technology. 59(1-3). 177–182. 50 indexed citations
3.
Kirchhoff, V. W. J. H. & U. Heisig. (1993). Control of reactive d.c. magnetron sputtering of SnO2 by means of optical emission. Surface and Coatings Technology. 59(1-3). 101–104. 4 indexed citations
4.
Heisig, U., et al.. (1991). Competence, Control, and Work Redesign. Work and Occupations. 18(1). 4–28. 12 indexed citations
5.
Schiller, S., et al.. (1989). The effect of target-substrate coupling on reactive direct current magnetron sputtering. Surface and Coatings Technology. 39-40. 549–564. 10 indexed citations
6.
Schiller, S., et al.. (1987). High-rate vapor deposition and large systems for coating processes. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 5(4). 2239–2245. 10 indexed citations
7.
Schiller, S., U. Heisig, G. Beister, et al.. (1987). Reactive d.c. high-rate sputtering as production technology. Surface and Coatings Technology. 33. 405–423. 84 indexed citations
8.
Schiller, S., U. Heisig, G. Beister, et al.. (1984). Deposition of hard wear-resistant coatings by reactive D.C. Plasmatron sputtering. Thin Solid Films. 118(3). 255–270. 45 indexed citations
9.
Schiller, S., U. Heisig, K. Goedicke, H. Bilz, & K. Steinfelder. (1982). Methods and applications of plasmatron high rate sputtering in microelectronics, hybrid microelectronics and electronics. Thin Solid Films. 92(1-2). 81–98. 15 indexed citations
10.
Schiller, S., et al.. (1982). On the investigation of d.c. plasmatron discharges by optical emission spectrometry. Thin Solid Films. 96(3). 235–240. 38 indexed citations
11.
Schiller, S., et al.. (1982). CrSi resistive films produced by magnetron-plasmatron sputtering. Thin Solid Films. 96(4). 279–284. 12 indexed citations
12.
Schiller, S., et al.. (1981). Complete thin film system for hybrid circuits sputtered with the plasmatron. Thin Solid Films. 83(2). 165–172. 9 indexed citations
13.
Schiller, S., et al.. (1979). Advances in high rate sputtering with magnetron-plasmatron processing and instrumentation. Thin Solid Films. 64(3). 455–467. 33 indexed citations
14.
Schiller, S., et al.. (1978). Pretreatment of metallic substrates with the plasmatron. Thin Solid Films. 51(2). 189–196. 7 indexed citations
15.
Schiller, S., U. Heisig, & K. Goedicke. (1978). The role of plasmatron/magnetron systems in physical vapor deposition techniques. Thin Solid Films. 54(1). 33–47. 22 indexed citations
16.
Schiller, S., et al.. (1977). Comparison between electron beam evaporation and high rate sputtering with a plasmatron. Thin Solid Films. 45(2). 385–385. 1 indexed citations
17.
Schiller, S., U. Heisig, & K. Goedicke. (1977). Use of the ring gap plasmatron for high rate sputtering. Thin Solid Films. 40. 327–334. 34 indexed citations
18.
Schiller, S., U. Heisig, & K. Steinfelder. (1976). A new sputter cleaning system for metallic substrates. Thin Solid Films. 33(3). 331–339. 18 indexed citations
19.
Schiller, S., U. Heisig, & K. Goedicke. (1975). Alternating ion plating—A method of high-rate ion vapor deposition. Journal of Vacuum Science and Technology. 12(4). 858–864. 18 indexed citations
20.
Heisig, U.. (1966). Thermische Bearbeitung mit Mikrobildern, die durch elektronenoptische Verkleinerung einer Schablone hergestellt sind. Die Naturwissenschaften. 53(1). 15–16. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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