H. Y. Chuang
- Electrical and Electronic Engineering
- Mechanical Engineering top 10%
- Electronic, Optical and Magnetic Materials
- Mechanics of Materials
- Polymers and Plastics
- Co-authors
- C. R. KaoJinran YuJia-Hong KeHua-Ching TongTsung‐Lin YangYi‐Jane ChenM. R. PiggottYan‐Cheng Lin
- Topics
- Electronic Packaging and Soldering Technologies (10 papers)3D IC and TSV technologies (9 papers)Advanced Welding Techniques Analysis (4 papers)
In The Last Decade
H. Y. Chuang
12 papers receiving 357 citations
Peers
Comparison fields: 5 of 33
- Electrical and Electronic Engineering 302
- Mechanical Engineering 201
- Electronic, Optical and Magnetic Materials 69
- Mechanics of Materials 41
- Polymers and Plastics 31
Countries citing papers authored by H. Y. Chuang
This map shows the geographic impact of H. Y. Chuang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. Y. Chuang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. Y. Chuang more than expected).
Fields of papers citing papers by H. Y. Chuang
This network shows the impact of papers produced by H. Y. Chuang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. Y. Chuang. The network helps show where H. Y. Chuang may publish in the future.
Co-authorship network of co-authors of H. Y. Chuang
This figure shows the co-authorship network connecting the top 25 collaborators of H. Y. Chuang. A scholar is included among the top collaborators of H. Y. Chuang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with H. Y. Chuang. H. Y. Chuang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 10 | |
| 2 | 8 | |
| 3 | 68 | |
| 4 | 83 | |
| 5 | 73 | |
| 6 | 15 | |
| 7 | 8 | |
| 8 | 23 | |
| 9 | 11 | |
| 10 | 12 | |
| 11 | 26 | |
| 12 | 37 |
About H. Y. Chuang
H. Y. Chuang is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Electronic, Optical and Magnetic Materials, having authored 12 papers that have together received 374 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (9 papers) and Advanced Welding Techniques Analysis (4 papers). The work is most often cited by research in Mechanical Engineering (201 citations), Electrical and Electronic Engineering (302 citations) and Electronic, Optical and Magnetic Materials (69 citations). H. Y. Chuang has collaborated with scholars based in Taiwan and Canada. Frequent co-authors include C. R. Kao, Jinran Yu, Jia-Hong Ke, Hua-Ching Tong, Tsung‐Lin Yang, Yi‐Jane Chen, M. R. Piggott, Yan‐Cheng Lin, Y. S. Lai and Tsung‐Yen Tsai. Their work appears in journals such as Journal of Applied Physics, Acta Materialia and Composites Science and Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.