Chang-Bo Ke
- Materials Chemistry
- Mechanical Engineering top 10%
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
- Aerospace Engineering
- Co-authors
- Shanshan CaoXin‐Ping ZhangXiao MaShuibao LiangX.P. ZhangMin-Bo ZhouHongjie JiangHui Jiang
- Topics
- Electronic Packaging and Soldering Technologies (35 papers)Shape Memory Alloy Transformations (20 papers)3D IC and TSV technologies (18 papers)
- Partner nations
- ChinaUnited KingdomBelgium
In The Last Decade
Chang-Bo Ke
59 papers receiving 449 citations
Peers
Comparison fields: 5 of 31
- Materials Chemistry 283
- Mechanical Engineering 224
- Electrical and Electronic Engineering 175
- Electronic, Optical and Magnetic Materials 64
- Aerospace Engineering 58
Countries citing papers authored by Chang-Bo Ke
This map shows the geographic impact of Chang-Bo Ke's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chang-Bo Ke with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chang-Bo Ke more than expected).
Fields of papers citing papers by Chang-Bo Ke
This network shows the impact of papers produced by Chang-Bo Ke. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chang-Bo Ke. The network helps show where Chang-Bo Ke may publish in the future.
Co-authorship network of co-authors of Chang-Bo Ke
This figure shows the co-authorship network connecting the top 25 collaborators of Chang-Bo Ke. A scholar is included among the top collaborators of Chang-Bo Ke based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chang-Bo Ke. Chang-Bo Ke is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 0 | |
| 3 | 1 | |
| 4 | 7 | |
| 5 | 1 | |
| 6 | 1 | |
| 7 | 4 | |
| 8 | 2 | |
| 9 | 2 | |
| 10 | 11 | |
| 11 | 16 | |
| 12 | 2 | |
| 13 | 4 | |
| 14 | 3 | |
| 15 | 1 | |
| 16 | 7 | |
| 17 | 5 | |
| 18 | 1 | |
| 19 | 6 | |
| 20 | 19 |
About Chang-Bo Ke
Chang-Bo Ke is a scholar working on Mechanical Engineering, Materials Chemistry and Electronic, Optical and Magnetic Materials, having authored 64 papers that have together received 456 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (35 papers), Shape Memory Alloy Transformations (20 papers) and 3D IC and TSV technologies (18 papers). The work is most often cited by research in Materials Chemistry (283 citations), Mechanical Engineering (224 citations) and Electronic, Optical and Magnetic Materials (64 citations). Chang-Bo Ke has collaborated with scholars based in China, United Kingdom and Belgium. Frequent co-authors include Shanshan Cao, Xin‐Ping Zhang, Xiao Ma, Shuibao Liang, X.P. Zhang, Min-Bo Zhou, Hongjie Jiang, Hui Jiang, Chunhua Wei and Y.Y. Li. Their work appears in journals such as Journal of Applied Physics, Materials Science and Engineering A and Journal of Materials Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.