Chang-Bo Ke

575 total citations
64 papers, 456 citations indexed

About

Chang-Bo Ke is a scholar working on Materials Chemistry, Electrical and Electronic Engineering and Mechanical Engineering. According to data from OpenAlex, Chang-Bo Ke has authored 64 papers receiving a total of 456 indexed citations (citations by other indexed papers that have themselves been cited), including 36 papers in Materials Chemistry, 35 papers in Electrical and Electronic Engineering and 29 papers in Mechanical Engineering. Recurrent topics in Chang-Bo Ke's work include Electronic Packaging and Soldering Technologies (35 papers), Shape Memory Alloy Transformations (20 papers) and 3D IC and TSV technologies (18 papers). Chang-Bo Ke is often cited by papers focused on Electronic Packaging and Soldering Technologies (35 papers), Shape Memory Alloy Transformations (20 papers) and 3D IC and TSV technologies (18 papers). Chang-Bo Ke collaborates with scholars based in China, United Kingdom and Belgium. Chang-Bo Ke's co-authors include Shanshan Cao, Xin‐Ping Zhang, Xiao Ma, Shuibao Liang, X.P. Zhang, Min-Bo Zhou, Hongjie Jiang, Hui Jiang, Chunhua Wei and Y.Y. Li and has published in prestigious journals such as Journal of Applied Physics, Materials Science and Engineering A and Journal of Materials Science.

In The Last Decade

Chang-Bo Ke

59 papers receiving 449 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Chang-Bo Ke China 13 283 224 175 64 58 64 456
Ming Luo China 13 201 0.7× 162 0.7× 202 1.2× 152 2.4× 82 1.4× 19 437
Matthew Porter United States 7 184 0.7× 272 1.2× 63 0.4× 38 0.6× 23 0.4× 12 425
Xiao Ma China 12 297 1.0× 209 0.9× 80 0.5× 32 0.5× 24 0.4× 50 429
P. S. Sankara Rama Krishnan Singapore 10 257 0.9× 207 0.9× 113 0.6× 94 1.5× 24 0.4× 24 447
Wenhan Gai China 13 200 0.7× 223 1.0× 193 1.1× 40 0.6× 65 1.1× 24 487
Barbara Horváth Hungary 14 82 0.3× 191 0.9× 355 2.0× 57 0.9× 43 0.7× 31 445
Xin Zhai China 9 193 0.7× 200 0.9× 117 0.7× 22 0.3× 82 1.4× 14 381
Masamitsu Imai Japan 13 251 0.9× 254 1.1× 162 0.9× 18 0.3× 19 0.3× 38 491
Gaohui Wu China 13 202 0.7× 418 1.9× 72 0.4× 18 0.3× 132 2.3× 30 483
Wei Liao China 11 133 0.5× 204 0.9× 70 0.4× 25 0.4× 23 0.4× 38 350

Countries citing papers authored by Chang-Bo Ke

Since Specialization
Citations

This map shows the geographic impact of Chang-Bo Ke's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chang-Bo Ke with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chang-Bo Ke more than expected).

Fields of papers citing papers by Chang-Bo Ke

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chang-Bo Ke. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chang-Bo Ke. The network helps show where Chang-Bo Ke may publish in the future.

Co-authorship network of co-authors of Chang-Bo Ke

This figure shows the co-authorship network connecting the top 25 collaborators of Chang-Bo Ke. A scholar is included among the top collaborators of Chang-Bo Ke based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chang-Bo Ke. Chang-Bo Ke is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Tran, Dinh-Phuc, et al.. (2025). Design strategy and thermal stability characterization of high-strength nanotwinned Cu-Ni foils. Results in Engineering. 27. 106783–106783.
2.
Li, Yuanyuan, Jing Deng, Shanshan Cao, et al.. (2025). A finding of four-way shape memory effect in Ni51Ti49 alloy by constraint-aging within a transitional zone. Journal of Material Science and Technology. 244. 122–128.
3.
Zhang, Xin‐Ping, et al.. (2024). Prediction of Crack Initiation at Die Corner of Molded Underfill Flip-Chip Packages Under Thermal Load by New Criteria. IEEE Transactions on Device and Materials Reliability. 24(4). 498–506. 1 indexed citations
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Liang, Shuibao, Min-Bo Zhou, Chang-Bo Ke, Wei Cai, & X.P. Zhang. (2022). Study of migration and coalescence of voids driven by electric current stressing in solder interconnects using phase field simulation. Microelectronics Reliability. 138. 114611–114611. 4 indexed citations
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Ma, Xiao, et al.. (2020). Molecular dynamics simulation of migration behavior of FCC-BCC atomic terrace-step phase boundary in iron-based alloy. Acta Physica Sinica. 69(13). 136102–136102. 2 indexed citations
10.
Liang, Shuibao, et al.. (2019). Microstructural evolution and change in macroscopic physical properties of microscale flip chip Cu/Sn58Bi/Cu joints under the coupling effect of electric current stressing and elastic stress. Journal of materials research/Pratt's guide to venture capital sources. 34(16). 2775–2788. 11 indexed citations
11.
Ke, Chang-Bo, et al.. (2019). Current density dependent shear performance and fracture behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads. Journal of Materials Science Materials in Electronics. 30(16). 15184–15197. 16 indexed citations
12.
Ke, Chang-Bo, et al.. (2018). A Modified Phase Field Model Based on Order Parameter Gradient and Simulation of Martensitic Transformation in Large Scale System. Acta Metallurgica Sinica. 54(8). 1204–1214. 2 indexed citations
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Ma, Wenjing, et al.. (2017). Morphological evolution and growth kinetics of Kirkendall voids in binary alloy system during deformation process—Phase field crystal simulation study. Transactions of Nonferrous Metals Society of China. 27(3). 599–607. 3 indexed citations
15.
Liang, Shuibao, Chang-Bo Ke, Min-Bo Zhou, & Xin‐Ping Zhang. (2016). Phase field simulation of morphological evolution and migration of the microvoid in small scale solder interconnects driven by temperature gradient. 953–957. 1 indexed citations
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Ma, Wenjing, Chang-Bo Ke, Min-Bo Zhou, Shuibao Liang, & Xin‐Ping Zhang. (2015). PHASE-FIELD CRYSTAL SIMULATION ON EVOLU- TION AND GROWTH KINETICS OF KIRKENDALL VOIDS IN INTERFACE AND INTERMETALLIC COMPOUND LAYER IN Sn/Cu SOLDERING SYSTEM. Acta Metallurgica Sinica. 51(7). 873–882. 5 indexed citations
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Ke, Chang-Bo, Shanshan Cao, Xiao Ma, & Xin‐Ping Zhang. (2012). Modeling of Ni4Ti3 precipitation during stress-free and stress-assisted aging of bi-crystalline NiTi shape memory alloys. Transactions of Nonferrous Metals Society of China. 22(10). 2578–2585. 19 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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